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1. 发明授权

US09515045B2 Method and apparatus for inspecting a semiconductor chip prior to bonding 有权
标题翻译：在接合之前检查半导体芯片的方法和装置
公开(公告)号：US09515045B2
公开(公告)日：2016-12-06
申请号：US13558771
申请日：2012-07-26
申请人： Andreas Marte , Tim Oliver Stadelmann
发明人： Andreas Marte , Tim Oliver Stadelmann
IPC分类号： B32B37/00 , H01L23/00 , H01L21/66 , G01N29/04 , H01L21/67
CPC分类号： H01L24/75 , G01N29/045 , G01N2291/2697 , H01L21/67132 , H01L21/67144 , H01L21/67253 , H01L22/12 , H01L2224/75651 , H01L2224/75745 , H01L2224/75822 , H01L2224/759 , H01L2924/12042 , Y10T156/17 , H01L2924/00
摘要： A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more chip handling units configured to pick a chip from the supply station, transport the chip to the mounting station, and place the chip at a mounting location; wherein each chip handling unit is configured to temporarily retain the chip in a defined position relative to the chip handling unit. The chip handling apparatus further comprises means for inducing sonic vibrations in the chip when retained by one of the chip handling units; and means for measuring the vibrations induced in the chip.
摘要翻译：提出了一种芯片处理装置，单元和方法。芯片处理装置包括芯片供应站; 芯片安装站; 以及一个或多个芯片处理单元，被配置为从供应站拾取芯片，将芯片运输到安装站，并将芯片放置在安装位置; 其中每个芯片处理单元被配置为临时将芯片保持在相对于芯片处理单元的限定位置。芯片处理装置还包括当由芯片处理单元之一保持时在芯片中引起声音振动的装置; 以及用于测量在芯片中感应的振动的装置。

2. 发明授权

US09373530B2 Tool for picking a planar object from a supply station 有权
标题翻译：从供应站挑选平面物体的工具
公开(公告)号：US09373530B2
公开(公告)日：2016-06-21
申请号：US13395019
申请日：2010-09-09
申请人： Michael Schmidt-Lange , Kam-Shing Wong , Johannes Schuster
发明人： Michael Schmidt-Lange , Kam-Shing Wong , Johannes Schuster
IPC分类号： H01L21/67 , H01L21/683 , H01L21/687 , B65G47/91 , B32B37/10 , H01L21/00 , H01L21/68 , B32B37/26
CPC分类号： H01L21/67144 , B32B37/10 , B32B37/1018 , B65G47/91 , B65H37/04 , H01L21/00 , H01L21/68 , H01L21/6838 , Y10T156/17
摘要： A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.
摘要翻译：提供了一种用于从供应站拾取平面物体的拾取工具，特别是用于从载带拾取半导体管芯，所述拾取工具包括：工作表面，所述工作表面包括至少一个接触区域，与平面物体的第一面上的第一表面接触; 工作表面中的一个或多个真空出口可以连接到真空源以允许临时将平面物体固定到工作表面; 并且其中提供柔性密封件以在平面物体变形时保持真空。

3. 发明授权

US07981246B2 Method and device for detaching a component which is attached to a flexible film 有权
标题翻译：用于分离连接到柔性膜的部件的方法和装置
公开(公告)号：US07981246B2
公开(公告)日：2011-07-19
申请号：US11596645
申请日：2004-12-17
申请人： Joachim Trinks , Andreas Marte , Wolfgang Herbst
发明人： Joachim Trinks , Andreas Marte , Wolfgang Herbst
IPC分类号： B32B38/10 , H01L21/46
CPC分类号： H01L21/67132 , Y10S438/976 , Y10T156/1132 , Y10T156/1944
摘要： The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film, which extends in a plane of support (11). The film is sucked against the support element (6) and partially under the plane of support by exerting negative pressure. The area of the supporting element is provided with at least one surface section (8) which extends in the plane of support when the detaching process begins, and which can be displaced, once the component (1) is grasped by a suction tool (4), plane-parallel to the plane of support while the negative pressure is maintained. The invention allows to control the detaching process of the film in a controlled movement without damaging or displacing the component.
摘要翻译：本发明涉及一种薄膜（2），其包括要与其分离的组分（1）。所述膜被放置在分离工具（5）上的部件的区域中，所述分离工具（5）设置有至少一个用于膜的支撑元件（6），该支撑元件在支撑件（11）的平面中延伸。通过施加负压将膜吸附在支撑元件（6）上并部分地在支撑平面下方。支撑元件的区域设置有至少一个表面部分（8），当分离过程开始时，至少一个表面部分（8）在支撑平面中延伸，并且一旦部件（1）被抽吸工具（4）），平行于支撑平面，同时保持负压。本发明允许在受控的运动中控制胶片的分离过程，而不损坏或移动该部件。

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