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1. 发明授权

US09887111B2 Die mounting system and die mounting method 有权
公开(公告)号：US09887111B2
公开(公告)日：2018-02-06
申请号：US15127615
申请日：2014-03-24
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Yukinori Nakayama , Kenji Nakai , Satoshi Yoshioka
IPC分类号： H01L21/00 , H01L21/67 , H01L23/00 , H01L21/52
CPC分类号： H01L21/67144 , H01L21/52 , H01L24/75 , H01L2224/75745 , H01L2224/75753 , H01L2224/75822 , H01L2224/7598
摘要： In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.

2. 发明授权

US09530751B2 Die bonder and bonding method 有权
标题翻译：焊接机和接合方法
公开(公告)号：US09530751B2
公开(公告)日：2016-12-27
申请号：US14699609
申请日：2015-04-29
申请人： Fasford Technology Co., Ltd.
发明人： Kazuo Nakano , Koji Nakamura , Shoji Kanai , Fukashi Tanaka
IPC分类号： B23K37/00 , H01L23/00 , B23K3/08 , B23K37/04 , H01L21/683 , H01L25/00
CPC分类号： H01L24/75 , B23K3/087 , B23K37/04 , H01L21/6836 , H01L24/83 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2221/68377 , H01L2224/27003 , H01L2224/7501 , H01L2224/75252 , H01L2224/7565 , H01L2224/75745 , H01L2224/75753 , H01L2224/75822 , H01L2224/75824 , H01L2224/7598 , H01L2224/83132 , H01L2224/83862 , H01L2224/92 , H01L2224/94 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/27 , H01L2221/68304 , H01L21/78 , H01L2221/68381 , H01L2224/83 , H01L2224/27436
摘要： A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.
摘要翻译：提供了一种能够可靠地将模具安装在中间台上并且可靠地从中间阶段拾取模具并因此具有高可靠性的管芯接合器和接合方法。芯片接合器设置有用于在其上安装由拾取头从模具供应单元拾取的模具的中间平台。中间台的安装部分设置有不平坦图案，其包括多个安装支撑突起，所述多个安装支撑突起具有接触表面，该接触表面与模具的后表面齐平，用于支撑模具不会脱落，以及形成在安装支撑突起。

3. 发明申请

US20150321338A1 MASS TRANSFER TOOL MANIPULATOR ASSEMBLY WITH REMOTE CENTER OF COMPLIANCE 有权
标题翻译：具有远程符合性中心的大量传送工具操纵器组件
公开(公告)号：US20150321338A1
公开(公告)日：2015-11-12
申请号：US14273298
申请日：2014-05-08
申请人： LuxVue Technology Corporation
发明人： Paul Argus Parks , Nile Alexander Light , Stephen P. Bathurst , John A. Higginson , Andreas Bibl
IPC分类号： B25J7/00
CPC分类号： B25J7/00 , B25J9/0015 , B25J18/007 , H01L2224/7565 , H01L2224/75822 , Y10T74/20354
摘要： Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
摘要翻译：公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。

4. 发明授权

US09120169B2 Method for device packaging 有权
标题翻译：设备包装方法
公开(公告)号：US09120169B2
公开(公告)日：2015-09-01
申请号：US13128141
申请日：2009-11-09
申请人： Hwee Seng Chew , Chee Kian Ong , Kian Hock Lim , Amlan Sen , Shoa Siong Lim
发明人： Hwee Seng Chew , Chee Kian Ong , Kian Hock Lim , Amlan Sen , Shoa Siong Lim
IPC分类号： H01L21/66 , B23K1/00 , B23K1/20 , H01L21/683 , H01L21/687 , H01L23/00
CPC分类号： B23K1/0016 , B23K1/203 , B23K2101/40 , H01L21/683 , H01L21/6838 , H01L21/68707 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2221/68354 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/73204 , H01L2224/7515 , H01L2224/7525 , H01L2224/75251 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75701 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75802 , H01L2224/75804 , H01L2224/75822 , H01L2224/75824 , H01L2224/81024 , H01L2224/81048 , H01L2224/81121 , H01L2224/8115 , H01L2224/8116 , H01L2224/8117 , H01L2224/8118 , H01L2224/81191 , H01L2224/81204 , H01L2224/81815 , H01L2224/83192 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3511 , H01L2924/381 , H01L2924/3841 , Y10T29/41 , H01L2224/13099 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fabricating a flip-chip semiconductor package. The method comprises processing a semiconductor device, for example a semiconductor chip and processing a device carrier, for example a substrate. The semiconductor device comprises bump structures formed on a surface thereof. The substrate comprises bond pads formed on a surface thereof. Processing of the semiconductor chip results in heating of the semiconductor chip to a chip process temperature. The chip process temperature melts solder portions on the bump structures Processing of the substrate results in heating of the substrate to a substrate process temperature. The method comprises spatially aligning the semiconductor chip in relation to the substrate to correspondingly align the bump structures in relation to the bump pads. The semiconductor chip is then displaced towards the substrate for abutting the bump structures of the semiconductor chip with the bond pads of the substrate to thereby form bonds therebetween. A system for performing the above method is also disclosed.
摘要翻译：一种用于制造倒装芯片半导体封装的方法。该方法包括处理半导体器件，例如半导体芯片和处理器件载体，例如衬底。半导体器件包括在其表面上形成的凸块结构。衬底包括形成在其表面上的接合焊盘。半导体芯片的处理导致半导体芯片的加热达到芯片工艺温度。芯片工艺温度熔化凸块结构上的焊料部分衬底的加工导致衬底加热到衬底工艺温度。该方法包括相对于衬底空间对准半导体芯片，以相对于凸块焊盘对准对准凸块结构。然后半导体芯片朝向衬底移位，以使半导体芯片的凸块结构与衬底的接合焊盘邻接，从而在衬底之间形成结合。还公开了用于执行上述方法的系统。

5. 发明申请

US20150044786A1 Alignment Systems and Wafer Bonding Systems and Methods 有权
标题翻译：对准系统和晶圆接合系统和方法
公开(公告)号：US20150044786A1
公开(公告)日：2015-02-12
申请号：US13963741
申请日：2013-08-09
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Xin-Hua Huang , Xiaomeng Chen , Ping-Yin Liu , Lan-Lin Chao
IPC分类号： H01L21/66 , H01L23/00 , H01L21/67
CPC分类号： H01L24/94 , H01L21/67092 , H01L21/681 , H01L24/08 , H01L24/74 , H01L24/80 , H01L2224/08145 , H01L2224/74 , H01L2224/7501 , H01L2224/75251 , H01L2224/75252 , H01L2224/753 , H01L2224/75702 , H01L2224/75744 , H01L2224/75745 , H01L2224/75802 , H01L2224/75804 , H01L2224/75822 , H01L2224/75824 , H01L2224/759 , H01L2224/80011 , H01L2224/80013 , H01L2224/80019 , H01L2224/8013 , H01L2224/80132 , H01L2224/80201 , H01L2224/80203 , H01L2224/80986 , H01L2224/94 , H01L2924/01322 , H01L2924/12042 , H01L2924/00012 , H01L2924/00014 , H01L2224/80 , H01L2924/00015 , H01L2224/80121 , H01L2924/00
摘要： Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes means for monitoring an alignment of a first wafer and a second wafer, and means for adjusting a position of the second wafer. The alignment system includes means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer.
摘要翻译：对准系统和晶片接合对准系统和方法被公开。在一些实施例中，用于晶片接合系统的对准系统包括用于监测第一晶片和第二晶片的对准的装置，以及用于调整第二晶片的位置的装置。对准系统包括用于将第一晶片和第二晶片的相对位置反馈到用于调整第一晶片和第二晶片的接合工艺之前和期间的第二晶片的位置的装置的装置。

6. 发明授权

US08531297B2 High-speed RFID circuit placement method and device 有权
公开(公告)号：US08531297B2
公开(公告)日：2013-09-10
申请号：US12607534
申请日：2009-10-28
申请人： Scott Wayne Ferguson , Ralf Linkmann , Werner Kiehne
发明人： Scott Wayne Ferguson , Ralf Linkmann , Werner Kiehne
IPC分类号： G08B13/14
CPC分类号： G06K19/07718 , G06K7/0095 , G06K19/07749 , G06K19/07752 , G06K19/07756 , H01L21/67144 , H01L21/67271 , H01L2224/75822 , Y10T29/49004 , Y10T29/49018 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137
摘要： A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

7. 发明申请

US20130133188A1 Apparatus For Mounting Semiconductor Chips 有权
标题翻译：用于安装半导体芯片的装置
公开(公告)号：US20130133188A1
公开(公告)日：2013-05-30
申请号：US13614622
申请日：2012-09-13
申请人： Guido Suter , Ruedi Grueter
发明人： Guido Suter , Ruedi Grueter
IPC分类号： H05K13/04
CPC分类号： H05K13/0404 , H01L21/67144 , H01L24/75 , H01L2224/75701 , H01L2224/75702 , H01L2224/75804 , H01L2224/75822 , Y10T29/53178
摘要： An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.
摘要翻译：一种装置包括具有接合头，拾取头和支撑台的拾取和放置系统。拾取头和支撑台安装在支架上。该装置可以以直接模式和并行模式操作。在直接模式下，滑架处于第一位置（停放）。控制单元操作拾取和放置系统以使得接合头将一系列半导体芯片从晶片台移动到基板。在平行模式中，托架处于第二位置。控制单元操作拾取头，支撑台和拾取和放置系统以重复地使拾取头将半导体芯片从晶片台移动到支撑台和接合头以将所述半导体芯片从支撑台移动到基板。

8. 发明授权

US07595219B2 IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base 失效
标题翻译： IC芯片安装方法，用于通过将吸入第一辊的IC芯片顺序地转印到第二辊上来安装两个或更多个IC芯片，并将传送到第二辊的IC芯片安装在行进基座上
公开(公告)号：US07595219B2
公开(公告)日：2009-09-29
申请号：US11324600
申请日：2006-01-04
申请人： Naoki Ishikawa , Tatsuro Tsuneno , Hidehiko Kira , Hiroshi Kobayashi
发明人： Naoki Ishikawa , Tatsuro Tsuneno , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： H01L21/00
CPC分类号： G06K19/07745 , G06K19/07718 , H01L21/67144 , H01L21/6836 , H01L24/75 , H01L24/97 , H01L2221/68327 , H01L2223/6677 , H01L2224/16225 , H01L2224/75743 , H01L2224/75822 , H01L2224/7598 , H01L2224/81203 , H01L2224/81801 , H01L2224/97 , H01L2924/14 , H01L2924/00 , H01L2224/81
摘要： The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; sequentially pressing the IC chips on the wafer against a first roller to allow the chips to be sucked onto the first roller; subsequently transferring the IC chips sucked onto the first roller to a second roller; and subsequently mounting the IC chips transferred to the second roller on the traveling base.
摘要翻译：本发明提供了一种用于在基座上安装两个或更多个IC芯片的IC芯片安装方法，包括：通过在其表面上安装带来准备晶片，该晶片具有安装在其上的安装表面并且通过在离开胶带的同时通过切割将晶片分成IC芯片; 依次将晶片上的IC芯片压靠在第一辊上，以使芯片被吸入到第一辊上; 随后将吸入第一辊的IC芯片传送到第二辊; 随后将传送到第二辊的IC芯片安装在行进基座上。

9. 发明申请

US20170148759A1 BONDING APPARATUS AND BONDING METHOD 审中-公开
公开(公告)号：US20170148759A1
公开(公告)日：2017-05-25
申请号：US15342381
申请日：2016-11-03
申请人： Shinkawa Ltd.
发明人： Shigeru HAYATA , Rei ANDO , Yasushi SATO
IPC分类号： H01L23/00
CPC分类号： H01L24/75 , H01L21/52 , H01L24/81 , H01L24/83 , H01L2224/75251 , H01L2224/7565 , H01L2224/75702 , H01L2224/75745 , H01L2224/75753 , H01L2224/75822 , H01L2224/75824 , H01L2224/75901 , H01L2224/8113 , H01L2224/81132 , H01L2224/8313 , H01L2224/83132 , H01L2924/00014 , H01L2924/00012
摘要： A bonding apparatus 10 includes: a bonding head 18 configured to move a top camera 24 facing toward a bonding surface and a collet 22 disposed with an offset from the top camera 24, while integrally holding the top camera 24 and the collet 22; a bottom camera 28 facing toward the collet 22 so as to detect a position of a semiconductor chip 100 held by the collet 22 with respect to the collet 22; a reference mark 32 disposed within a view field of the bottom camera 28; and a control unit 40. The control unit 40 moves the bonding head 18 based on a position of the mark 32 recognized by the top camera 24, and then calculates a value of the offset based on a position of the collet 22 with respect to the mark 32 recognized by the bottom camera 28. With this, it is possible to provide a bonding apparatus capable of easily detecting an offset between a bonding tool and a position detection camera without providing a dedicated camera.

10. 发明授权

US09603294B2 Apparatus for mounting semiconductor chips 有权
公开(公告)号：US09603294B2
公开(公告)日：2017-03-21
申请号：US13614622
申请日：2012-09-13
申请人： Guido Suter , Ruedi Grueter
发明人： Guido Suter , Ruedi Grueter
IPC分类号： H05K13/04 , H01L21/67 , H01L23/00
CPC分类号： H05K13/0404 , H01L21/67144 , H01L24/75 , H01L2224/75701 , H01L2224/75702 , H01L2224/75804 , H01L2224/75822 , Y10T29/53178
摘要： An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

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