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1. 发明授权

US11289459B2 Apparatus and method for manufacturing light-emitting diode module 有权
公开(公告)号：US11289459B2
公开(公告)日：2022-03-29
申请号：US16626858
申请日：2018-05-30
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Sung Sik Jo , Jung Hyun Park
IPC分类号： H01L21/00 , H01L25/075 , H01L33/62 , B65G47/90 , H01L21/67
摘要： The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet. An apparatus for manufacturing a light-emitting diode (LED) module according to one embodiment of the present invention, in which the light-emitting diode module comprises a plurality of light-emitting diodes each having one side surface with an exposed electrode surface and the other side surface corresponding to the one side surface, comprises: a sheet placement unit in which a sheet having a lower portion to which the other side surfaces of the plurality of light-emitting diodes are adhered is placed; a substrate placement unit in which a substrate is placed at a position corresponding to the sheet in the lower portion of the sheet, wherein the substrate has thereon a conductive pattern to which the one side surfaces of the plurality of light-emitting diodes are electrically contacted; and a multi-transfer unit having, on a higher portion of the sheet, a plurality of eject pins for transferring the plurality of light-emitting diodes adhered to the lower portion of the sheet onto the substrate, wherein the multi-transfer unit is characterized in that the plurality of eject pins transfer the plurality of light-emitting diodes onto the substrate.

2. 发明授权

US11244934B2 LED display module 有权
公开(公告)号：US11244934B2
公开(公告)日：2022-02-08
申请号：US16793258
申请日：2020-02-18
申请人： LUMENS CO., LTD.
发明人： Seunghyun Oh
IPC分类号： H01L25/075 , H01L33/62
摘要： An LED display module is disclosed. The LED display module includes: a micro-LED array including a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units including a red LED, a green LED, and a blue LED; a substrate including a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected. The distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.

3. 发明授权

US11069664B2 Micro-LED module and method for fabricating the same 有权
公开(公告)号：US11069664B2
公开(公告)日：2021-07-20
申请号：US16524790
申请日：2019-07-29
申请人： LUMENS CO., LTD.
发明人： Daewon Kim , Eunsung Shin , Myungji Moon , Hanbeet Chang , Yongpil Kim , Jaesoon Park
IPC分类号： H01L25/075 , H01L25/00 , H01L33/36 , H01L33/54 , H01L27/15 , H01L33/00 , H01L25/04 , H01L33/08 , H01L33/62 , H01L27/32 , H01L21/447
摘要： A micro-LED module is disclosed. The micro-LED module includes: a micro-LED including a plurality of LED cells, each of which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a submount substrate mounted with the micro-LED; a plurality of electrode pads formed on the micro-LED cells; a plurality of electrodes formed corresponding to the plurality of electrode pads on the submount substrate; a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes; and a gap fill layer formed in the gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate.

4. 发明申请

US20200212017A1 LED PIXEL DEVICE HAVING CHIP STACK STRUCTURE 审中-公开
公开(公告)号：US20200212017A1
公开(公告)日：2020-07-02
申请号：US16615832
申请日：2018-06-04
申请人： LUMENS CO., LTD.
发明人： Seunghyun OH , Sungsik JO , Junghyun PARK , Byeonggeon KIM
IPC分类号： H01L25/075 , H01L33/62
摘要： An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.

5. 发明授权

US10692845B2 Method for arraying micro-LED chips for manufacturing LED display panel and multi-chip carrier used in the method 有权
公开(公告)号：US10692845B2
公开(公告)日：2020-06-23
申请号：US16273615
申请日：2019-02-12
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Juok Seo , Bogyun Kim , Gunha Kim , Jugyeong Mun
IPC分类号： H01L25/075 , H01L23/00 , H01L33/00 , H01L27/15 , H01L33/48
摘要： A method for arraying micro-LED chips is disclosed. The method includes preparing a chip carrier formed with a plurality of chip pockets whose internal pressure is reduced through a plurality of suction holes, capturing the micro-LED chips in the corresponding chip pockets such that the micro-LED chips are in close contact with the bottoms of the chip pockets, and placing the micro-LED chips captured in the chip pockets on a base body. Each of the chip pockets includes a slope through which an inlet having a larger width than the bottom is connected to the bottom. The distances between the centers of the adjacent micro-LED chips placed on the base body are the same as those between the centers of the corresponding chip pockets.

6. 发明申请

US20200185361A1 LED DISPLAY MODULE 审中-公开
公开(公告)号：US20200185361A1
公开(公告)日：2020-06-11
申请号：US16793258
申请日：2020-02-18
申请人： LUMENS CO., LTD.
发明人： SEUNGHYUN OH
IPC分类号： H01L25/075
摘要： An LED display module is disclosed. The LED display module includes: a micro-LED array including a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units including a red LED, a green LED, and a blue LED; a substrate including a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected. The distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.

7. 发明申请

US20200126957A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20200126957A1
公开(公告)日：2020-04-23
申请号：US16717696
申请日：2019-12-17
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L33/62 , H01L33/00 , H01L23/00 , H01L21/67 , H01L33/36 , H01L27/15 , H01L21/683 , H01L21/677 , H01L33/60
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

8. 发明授权

US10607970B2 LED display module 有权
公开(公告)号：US10607970B2
公开(公告)日：2020-03-31
申请号：US16242203
申请日：2019-01-08
申请人： LUMENS CO., LTD.
发明人： Seunghyun Oh
IPC分类号： H01L25/075 , H01L33/62
摘要： An LED display module is disclosed. The LED display module includes: a micro-LED array including a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units including a red LED, a green LED, and a blue LED; a substrate including a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected. The distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.

9. 发明申请

US20190391397A1 HEAD-MOUNTED DISPLAY APPARATUSES 审中-公开
公开(公告)号：US20190391397A1
公开(公告)日：2019-12-26
申请号：US16559287
申请日：2019-09-03
申请人： LUMENS CO., LTD.
发明人： Daewon KIM , Seongbok YOON , Hanbeet CHANG , Myungji MOON , Yongpil KIM , JaeSoon PARK
IPC分类号： G02B27/01 , F21V8/00 , G06F3/01 , G06T19/00 , G02C7/10 , H04N13/332
摘要： A head-mounted display apparatus is disclosed. The head-mounted display apparatus includes an optical member having a front surface, a rear surface, and a plurality of side surfaces, a display unit adapted to emit a display image toward one of the side surfaces of the optical member, and a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface. The image reflected by the reflective structure and delivered to user's eyes is the same irrespective of the coverage of the user's field of view.

10. 发明授权

US10468393B2 LED module and method for fabricating the same 有权
公开(公告)号：US10468393B2
公开(公告)日：2019-11-05
申请号：US16059019
申请日：2018-08-08
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L27/32 , H01L25/075 , H01L33/62 , H01L21/683 , H01L33/00 , H01L23/00 , H01L33/60 , H01L21/677 , H01L27/15 , H01L33/36 , H01L21/67 , H01L33/08 , H01L33/06 , H01L33/32 , H01L33/30
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

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