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1. 发明申请

US20190244938A1 MICRO-LED DISPLAY PANEL 审中-公开
公开(公告)号：US20190244938A1
公开(公告)日：2019-08-08
申请号：US16261985
申请日：2019-01-30
申请人： LUMENS CO., LTD.
发明人： Jeongho BANG , Juok SEO , Taekyung YOO
IPC分类号： H01L25/075 , H01L33/50 , H01L33/58 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/502 , H01L33/58 , H01L33/62 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
摘要： A micro-LED display panel is disclosed. The micro-LED display panel includes: a plurality of unit substrates, each of which is formed with a plurality of electrode pads; a plurality of pixels, each of which includes a first micro-LED chip, a second micro-LED chip, and a third micro-LED chip mounted corresponding to the electrode pads; and a mesh arranged over the plurality of unit substrates. The mesh has pixel spacing portions covering at least some exposed areas of the plurality of unit substrates between the pixels and a plurality of openings accommodating the corresponding pixels. The micro-LED display panel is constructed such that the reflection of external light by the exposed areas of the substrate between the pixels and the exposed areas of the electrode pads disposed on the unit substrates is reduced. This construction improves the contrast characteristics and black characteristics of a display and achieves seamlessness in the micro-LED display panel.

2. 发明申请

US20200126957A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20200126957A1
公开(公告)日：2020-04-23
申请号：US16717696
申请日：2019-12-17
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L33/62 , H01L33/00 , H01L23/00 , H01L21/67 , H01L33/36 , H01L27/15 , H01L21/683 , H01L21/677 , H01L33/60
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

3. 发明申请

US20180158807A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20180158807A1
公开(公告)日：2018-06-07
申请号：US15883413
申请日：2018-01-30
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L21/67144 , H01L21/677 , H01L21/6835 , H01L21/6836 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/007 , H01L33/0075 , H01L33/0079 , H01L33/06 , H01L33/08 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/60 , H01L33/62 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2221/68395 , H01L2224/1403 , H01L2224/81005 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/95001 , H01L2224/9511 , H01L2224/95115 , H01L2224/95136 , H01L2924/12041 , H01L2933/0066
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

4. 发明申请

US20200013759A1 LIGHT EMITTING ELEMENT FOR PIXEL AND LED DISPLAY MODULE 审中-公开
公开(公告)号：US20200013759A1
公开(公告)日：2020-01-09
申请号：US16047912
申请日：2018-07-27
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Seunghyun OH , Sungsik JO , Minpyo KIM , Jiyu SHIN , Daewon KIM
IPC分类号： H01L25/075 , H01L25/16 , H01L33/62 , H01L33/00
摘要： A light emitting element is disclosed. The light emitting element includes: a mount substrate on which a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad are disposed; a first vertical LED chip mounted on the mount substrate such that the bottom portion of the first vertical LED chip is connected to the first electrode pad; a second vertical LED chip mounted on the mount substrate such that the bottom portion of the second vertical LED chip is connected to the second electrode pad; a third vertical LED chip mounted on the mount substrate such that the bottom portion of the third vertical LED chip is connected to the third electrode pad; a light-transmitting conductive plate electrically connected to the top portions of the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip; and a conductor connecting the light-transmitting conductive plate to the fourth electrode pad. Individual driving powers are applied to the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip through the first electrode pad, the second electrode pad, and the third electrode pad, respectively, or through the fourth electrode pad.

5. 发明申请

US20190164947A1 METHOD FOR FABRICATING HIGH-EFFICIENCY MICRO-LED MODULE 审中-公开
公开(公告)号：US20190164947A1
公开(公告)日：2019-05-30
申请号：US16185979
申请日：2018-11-09
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO
IPC分类号： H01L25/18 , H01L33/00 , H01L33/62 , H01L23/00 , H01L33/56
摘要： Disclosed is a method for fabricating a high-efficiency micro-LED module. The method includes: preparing a micro-LED in which an epilayer is grown on a sapphire substrate, a plurality of LED cells are formed on the epilayer, a plurality of individual electrode pads are disposed such that one individual electrode pad is assigned to each LED cell, and a common electrode pad is formed on an area surrounding the plurality of LED cells; preparing a submount substrate including a plurality of individual electrodes corresponding to the individual electrode pads and a common electrode corresponding to the common electrode pad; mounting the micro-LED on the submount substrate such that the plurality of individual electrodes are connected to the plurality of individual electrode pads and the common electrode pad is connected to the common electrode through a plurality of bonding connection members; forming a buffer layer between the micro-LED and the submount substrate; and irradiating a laser around the boundary between the sapphire substrate and the epilayer to separate the sapphire substrate from the epilayer, wherein the buffer layer absorbs energy produced by the laser at least between the neighboring LED cells to protect the epilayer or the surmount substrate from damage.

6. 发明申请

US20180374989A1 LED PANEL 审中-公开
公开(公告)号：US20180374989A1
公开(公告)日：2018-12-27
申请号：US15960514
申请日：2018-04-23
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Yelim WON
IPC分类号： H01L33/08 , H01L33/50 , H01L33/38 , H01L23/00 , H01L33/12
摘要： An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.

7. 发明申请

US20200013762A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20200013762A1
公开(公告)日：2020-01-09
申请号：US16576263
申请日：2019-09-19
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L33/62 , H01L21/683 , H01L33/00 , H01L23/00 , H01L33/60 , H01L21/677 , H01L27/15 , H01L33/36 , H01L21/67
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

8. 发明申请

US20190058086A1 LED PANEL 审中-公开
公开(公告)号：US20190058086A1
公开(公告)日：2019-02-21
申请号：US16168098
申请日：2018-10-23
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Yelim WON
IPC分类号： H01L33/08 , H01L33/38 , H01L33/50 , H01L33/12 , H01L23/00
摘要： An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.

9. 发明申请

US20180358335A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20180358335A1
公开(公告)日：2018-12-13
申请号：US16059019
申请日：2018-08-08
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L23/00 , H01L21/67 , H01L33/60 , H01L33/00
CPC分类号： H01L25/0753 , H01L21/67144 , H01L21/677 , H01L21/6835 , H01L21/6836 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/007 , H01L33/0075 , H01L33/0079 , H01L33/06 , H01L33/08 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/60 , H01L33/62 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2221/68395 , H01L2224/1403 , H01L2224/81005 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/95001 , H01L2224/9511 , H01L2224/95115 , H01L2224/95136 , H01L2924/12041 , H01L2933/0066 , H05K999/99
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

10. 发明申请

US20180350783A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20180350783A1
公开(公告)日：2018-12-06
申请号：US16059017
申请日：2018-08-08
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L23/00 , H01L33/60 , H01L33/00
CPC分类号： H01L25/0753 , H01L21/67144 , H01L21/677 , H01L21/6835 , H01L21/6836 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/007 , H01L33/0075 , H01L33/0079 , H01L33/06 , H01L33/08 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/60 , H01L33/62 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2221/68395 , H01L2224/1403 , H01L2224/81005 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/95001 , H01L2224/9511 , H01L2224/95115 , H01L2224/95136 , H01L2924/12041 , H01L2933/0066 , H05K999/99
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

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