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1. 发明申请

US20140231126A1 STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES 有权
标题翻译：多层电子基板Z轴互连的结构
公开(公告)号：US20140231126A1
公开(公告)日：2014-08-21
申请号：US14183488
申请日：2014-02-18
申请人： INTEGRAL TECHNOLOGY, INC. , ORMET CIRCUITS, INC.
发明人： Christopher A Hunrath , Khang Duy Tran , Catherine A Shearer , Kenneth C Holcomb , G Delbert Friesen
IPC分类号： H01L21/48
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/4623 , H05K3/4652 , H05K2201/0195 , H05K2201/10378 , H05K2203/1194
摘要： Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
摘要翻译：本发明的z轴互连结构提供了一种在电子基板中可靠且以任何构造机械地和电气地互连金属化层的手段。本发明的z轴互连结构包括由其形成的新颖的接合膜和导电浆料以及由其形成的一体和两件式的构件结构。

2. 发明申请

US20140120356A1 CONDUCTIVE FILM ADHESIVE 审中-公开
标题翻译：导电胶粘剂
公开(公告)号：US20140120356A1
公开(公告)日：2014-05-01
申请号：US13843555
申请日：2013-03-15
申请人： ORMET CIRCUITS, INC.
发明人： Catherine Shearer , Peter A. Matturri , Michael C. Matthews
IPC分类号： C09J9/02 , C09J5/06
CPC分类号： C09J9/02 , C08K3/08 , C08K5/0025 , C09J5/06 , C09J11/02 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2221/68327 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/2929 , H01L2224/29301 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29314 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29369 , H01L2224/29371 , H01L2224/2939 , H01L2224/2949 , H01L2224/3201 , H01L2224/32225 , H01L2224/32245 , H01L2224/325 , H01L2224/32503 , H01L2224/32507 , H01L2224/83191 , H01L2224/83203 , H01L2224/83447 , H01L2224/83815 , H01L2224/83825 , H01L2224/83862 , H01L2224/83905 , H01L2224/83948 , H01L2224/92 , H01L2224/94 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , Y10T156/10 , Y10T428/31678 , H01L2924/00 , H01L2924/00015 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01048 , H01L2924/01052 , H01L2924/01002 , H01L2924/01034 , H01L2924/01012 , H01L2924/01083 , H01L2924/01051 , H01L2924/01049 , H01L2924/01005 , H01L2924/01015 , H01L2224/27 , H01L21/78 , H01L2224/83 , H01L2221/68381 , H01L2924/00012
摘要： An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.
摘要翻译：公开了用于形成导电接合膜的本发明组合物和方法。本发明将胶粘粘合片技术（例如，芯片附着膜或DAF）与瞬态液相烧结糊组合物的导电性能和导电性相结合。本发明的薄膜的特征在于薄膜内的高体积热导和电导率，以及在本发明薄膜和金属化被粘体之间的界面处的低和稳定的热和电阻。

3. 发明申请

US20140042212A1 ELECTRICALLY CONDUCTIVE COMPOSITIONS COMPRISING NON-EUTECTIC SOLDER ALLOYS 有权
标题翻译：包含非保护性焊料合金的电导体组合物
公开(公告)号：US20140042212A1
公开(公告)日：2014-02-13
申请号：US13732308
申请日：2012-12-31
申请人： ORMET CIRCUITS, INC.
发明人： Catherine Shearer , Peter A. Matturri , Kenneth C. Holcomb , Michael C. Matthews
IPC分类号： B23K35/02 , B23K1/20
CPC分类号： B23K35/025 , B22F3/1035 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K1/203 , B23K35/02 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/268 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K2101/40 , B23K2101/42
摘要： Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.
摘要翻译：包含一种或多种高熔点金属和一种或多种低熔点温度合金的瞬态液相烧结组合物在本领域中是已知的用于在电子应用中产生电和/或导热通路的有用组合物。本发明提供了使用非共晶低熔点合金来改善烧结和金属基体特性的瞬态液相烧结组合物。

4. 发明申请

US20100252616A1 CONDUCTIVE COMPOSITIONS CONTAINING BLENDED ALLOY FILLERS 有权
标题翻译：含有混合合金填料的导电组合物
公开(公告)号：US20100252616A1
公开(公告)日：2010-10-07
申请号：US12751030
申请日：2010-03-31
申请人： Catherine Shearer , Kenneth C. Holcomb , G. Delbert Friesen , Michael C. Matthews
发明人： Catherine Shearer , Kenneth C. Holcomb , G. Delbert Friesen , Michael C. Matthews
IPC分类号： B23K31/02 , B22F1/00 , B32B15/02
CPC分类号： B22F1/0003 , B22F1/0059 , B22F7/064 , H05K3/321 , H05K2201/0221 , H05K2201/0272
摘要： The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.
摘要翻译：本发明提供用于形成电子元件之间的互连的导电和导热组合物。本发明组合物包含三种或更多种金属或金属合金颗粒类型和包含特异性应用的助熔剂的有机载体。第一颗粒型包括与其它颗粒中的反应性低熔点金属反应以形成金属间物质的反应性高熔点金属。本发明的反应性低熔点金属以两种不同的颗粒形式提供。第一反应性低熔点金属颗粒包括促进与反应性高熔点金属反应的载体。第二反应性低熔点金属颗粒主要作为反应性低熔点金属的来源。三种颗粒类型的组合提供了几个优点，包括减少载体金属的不期望的特性，同时保留并且在一些实施方案中增强对金属反应的有利促进。

5. 发明申请

US20100230145A1 METHODS TO PRODUCE HIGH DENSITY, MULTILAYER PRINTED WIRING BOARDS FROM PARALLEL-FABRICATED CIRCUITS AND FILLED VIAS 有权
标题翻译：从并联电路和填充VIAS生产高密度，多层印刷布线的方法
公开(公告)号：US20100230145A1
公开(公告)日：2010-09-16
申请号：US12521558
申请日：2007-12-28
申请人： Ken Holcomb
发明人： Ken Holcomb
IPC分类号： H05K1/09 , B32B38/04 , H05K3/46
CPC分类号： H05K3/4614 , H05K3/386 , H05K3/4069 , H05K3/4602 , H05K3/462 , H05K3/4652 , H05K2201/0195 , H05K2201/0394 , H05K2201/10378 , H05K2203/061 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T156/1056
摘要： The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.
摘要翻译：本发明提供了通过并行处理制造的质量叠层和互连高密度互连电路层的方法。本发明的方法采用内向外互连策略，其消除通孔的电镀并提供无缺陷的外部电路层。导电浆料和通孔层也是本发明的关键特征。

6. 发明申请

US20230049614A1 INDIUM SOLDER PASTE COMPOSITIONS 有权
公开(公告)号：US20230049614A1
公开(公告)日：2023-02-16
申请号：US17787053
申请日：2021-01-06
申请人： Ormet Circuits, Inc.
发明人： Catherine A. SHEARER
IPC分类号： B23K35/36 , B23K35/02 , B23K35/26
摘要： The present invention relates to paste compositions comprising an indium metal powder; and an organic vehicle. The organic vehicle includes one or more C8-C18 fatty acids; a salt formed from a C4-C6 carboxylic acid and a tertiary alkanolamine; a cationic catalyst; a thixotrope; and a diluent.

7. 发明授权

US08840700B2 Preparation of metallurgic network compositions and methods of use thereof 有权
标题翻译：冶金网络组合物的制备及其使用方法
公开(公告)号：US08840700B2
公开(公告)日：2014-09-23
申请号：US12940203
申请日：2010-11-05
申请人： Catherine Shearer , Kenneth C. Holcomb , G. Delbert Friesen , Michael C. Matthews
发明人： Catherine Shearer , Kenneth C. Holcomb , G. Delbert Friesen , Michael C. Matthews
IPC分类号： B22F1/00 , B23K35/22 , B22F3/10 , C22C1/04 , H01B1/02
CPC分类号： H01B1/02 , B22F3/10 , C22C1/0425 , C22C1/0483 , C22C1/0491 , H01B1/026 , H01L2224/83825 , H01L2224/8384
摘要： The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.
摘要翻译：本发明提供用于电子应用的导电金属组合物及其制备方法和用途。更具体地说，本发明提供金属颗粒瞬态液相烧结组合物，其含有金属和金属合金组分的混合配方，其形成具有增加的稳定性，耐热应力和减轻材料之间CTE失配的能力的互连导电冶金网络。

8. 发明申请

US20220336341A1 LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE PASTES 有权
公开(公告)号：US20220336341A1
公开(公告)日：2022-10-20
申请号：US17640390
申请日：2020-09-09
申请人： ORMET CIRCUITS, INC. , MERCK Patent GmbH
发明人： Catherine A. SHEARER , Ping-Hung LU , Chunwei CHEN
IPC分类号： H01L23/498 , H01L21/48 , H05K1/09
摘要： The present invention relates to electrical interconnect structures formed from a lithographically defined polymer coating in conjunction with a conductive paste, and methods for forming same.

9. 发明授权

US11440142B2 Alternative compositions for high temperature soldering applications 有权
公开(公告)号：US11440142B2
公开(公告)日：2022-09-13
申请号：US15109115
申请日：2014-01-16
申请人： Ormet Circuits, Inc.
发明人： Catherine A Shearer
IPC分类号： B23K35/26 , B23K35/30 , B23K35/02 , H05K3/34 , H01L23/00 , B23K35/36 , B23K35/362
摘要： Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.

10. 发明申请

US20210118836A1 METALLIC ADHESIVE COMPOSITIONS HAVING GOOD WORK LIVES AND THERMAL CONDUCTIVITY, METHODS OF MAKING SAME AND USES THEREOF 有权
公开(公告)号：US20210118836A1
公开(公告)日：2021-04-22
申请号：US16500607
申请日：2018-06-07
申请人： ORMET CIRCUITS, INC.
发明人： Matthew WROSCH , Catherine A. SHEARER
IPC分类号： H01L23/00 , H01L23/373
摘要： Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.

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