专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10697908B2 Metrology inspection apparatus 有权
公开(公告)号：US10697908B2
公开(公告)日：2020-06-30
申请号：US15574174
申请日：2016-05-29
申请人： XWINSYS LTD.
发明人： Doron Reinis , Michael Geffen , Roni Peretz , Colin Smith
IPC分类号： G01N23/223 , G01N23/2206 , G01N23/207 , G02B21/00
摘要： The present disclosure provides a method and an apparatus for apparatus for inspecting a semiconductor wafer for abnormalities by accurately measuring elemental concentration at a target area. The apparatus includes an x-ray imaging subsystem for measuring an elemental composition at the target area of the semiconductor wafer. The apparatus further includes an edxrf subsystem for measuring an elemental concentration at the target area of the semiconductor wafer. The elemental concentration may be calibrated by first correlating the elemental concentration measurements obtained using x-ray imaging system for the target area with the elemental concentration measurements obtained using the edxrf subsystem for the target area to receive an augmented and accurate elemental concentration measurement for the target area of the semiconductor wafer.

2. 发明申请

US20140161224A1 METHOD AND A SYSTEM FOR RECOGNIZING VOIDS IN A BUMP 有权
标题翻译：用于识别BUMP中的声音的方法和系统
公开(公告)号：US20140161224A1
公开(公告)日：2014-06-12
申请号：US14234169
申请日：2012-09-02
申请人： MICHA Geffen , Doron Reinis
发明人： MICHA Geffen , Doron Reinis
IPC分类号： G01N23/22 , G01R31/26
CPC分类号： G01N23/22 , G01N23/2252 , G01N2223/6113 , G01R31/26
摘要： A method and a system for bump's inspection are disclosed. The inspection done by comparing the volume of the bump's outside contour and the volume the solid materials from which the bump is made and/or analyzing the bump's solid materials ratio. Principally, the inspection id done by preparing an empiric reference table of the emitted energy received from the solid materials, from which a reference proper bump with a given volume is comprised, using ED-XRF (Energy-Dispersive-X-ray-Fluorescence analysis) analyze; obtaining a first calculated volume of the bump, using a 3D image-processing method; adapting the reference table according to the difference between the given volume and the first calculated volume of the bump; performing a second volume calculation of the bump by applying ED-XRF technology. The difference between the first and second volume calculations and the solid material combination are used to inspect the bump.
摘要翻译：公开了一种用于凸块检查的方法和系统。通过比较凸块的外部轮廓的体积和制造凸块的固体材料和/或分析凸块的固体材料比来进行检查。主要是通过使用ED-XRF（能量 - 分散X射线 - 荧光分析法）制备从固体材料接收的发射能量的经验参考表，其中包括具有给定体积的参考适当凸块）分析; 使用3D图像处理方法获得凸起的第一计算体积; 根据给定体积与凸起的第一计算体积之间的差异来适应参考表; 通过应用ED-XRF技术对凸点进行第二次体积计算。第一和第二体积计算和固体材料组合之间的差异用于检查凸块。

3. 发明授权

US10697907B2 Metrology measuring apparatus 有权
公开(公告)号：US10697907B2
公开(公告)日：2020-06-30
申请号：US15574171
申请日：2016-05-29
申请人： XWINSYS LTD.
发明人： Doron Reinis , Michael Geffen , Roni Peretz , Colin Smith
IPC分类号： G01N23/223 , G02B21/00
摘要： The present disclosure provides a method and an apparatus for apparatus for accurately measuring and calibrating elemental concentration measurements for a semiconductor wafer. The apparatus includes an edxrf system for calculating an elemental concentration at a target area of the semiconductor wafer. The apparatus further includes an optical subsystem for calculating volumetric information of the target area of the semiconductor wafer. The elemental concentration may be calibrated by first correlating the elemental concentration measurements for a norm feature at the target area with the volumetric information for the norm feature of the target area to obtain a calibration data. Thereafter, the calibration data obtained is used to calibrate the elemental concentration measurements to achieve an accurate measurement thereof.

4. 发明授权

US09335283B2 Method and a system for recognizing voids in a bump 有权
标题翻译：用于识别凹凸中的空隙的方法和系统
公开(公告)号：US09335283B2
公开(公告)日：2016-05-10
申请号：US14234169
申请日：2012-09-02
申请人： Micha Geffen , Doron Reinis
发明人： Micha Geffen , Doron Reinis
IPC分类号： G01N23/223 , G01N23/22 , G01N23/225 , G01R31/26
CPC分类号： G01N23/22 , G01N23/2252 , G01N2223/6113 , G01R31/26
摘要： A method and a system for bump's inspection are disclosed. The inspection done by comparing the volume of the bump's outside contour and the volume the solid materials from which the bump is made and/or analyzing the bump's solid materials ratio. Principally, the inspection id done by preparing an empiric reference table of the emitted energy received from the solid materials, from which a reference proper bump with a given volume is comprised, using ED-XRF (Energy-Dispersive-X-ray-Fluorescence analysis) analyze; obtaining a first calculated volume of the bump, using a 3D image-processing method; adapting the reference table according to the difference between the given volume and the first calculated volume of the bump; performing a second volume calculation of the bump by applying ED-XRF technology. The difference between the first and second volume calculations and the solid material combination are used to inspect the bump.
摘要翻译：公开了一种用于凸块检查的方法和系统。通过比较凸块的外部轮廓的体积和制造凸块的固体材料和/或分析凸块的固体材料比来进行检查。主要是通过使用ED-XRF（能量 - 分散X射线 - 荧光分析法）制备从固体材料接收的发射能量的经验参考表，其中包括具有给定体积的参考适当凸块）分析; 使用3D图像处理方法获得凸起的第一计算体积; 根据给定体积与凸起的第一计算体积之间的差异来适应参考表; 通过应用ED-XRF技术对凸点进行第二次体积计算。第一和第二体积计算和固体材料组合之间的差异用于检查凸块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式