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    • 6. 发明申请
    • DEVICE FOR THE SOLID/LIQUID SEPARATION OF SUBSTANCE MIXTURES AND SUSPENSIONS
    • 用于固体/液体分离物质混合物和悬浮液的装置
    • US20140061118A1
    • 2014-03-06
    • US13975948
    • 2013-08-26
    • Albert BÄHR
    • Albert BÄHR
    • B01D29/52
    • B01D29/52B01D29/115B01D36/02B01D37/04
    • Device for the solid/liquid separation of substance mixtures and suspensions, comprising a feed and at least one feed-side vertical filtration chamber (2, 3), to the outlet of which at least one pump device (6) is connected for removing the thickened residual volume from the filtration chamber (2) and for generating a pump pressure, and the pump device (6) is connected by connecting lines (10) to one or more closed compacting pressure chambers (8), in which device two filtration chambers (2, 3) are provided in parallel and each connected individually by valve means to the feed on the inlet side and by the pump device (6) to one or more compacting pressure chambers (8) on the outlet side.
    • 用于物质混合物和悬浮液的固体/液体分离的装置,包括进料和至少一个进料侧垂直过滤室(2,3),其出口连接有至少一个泵装置(6),用于除去 增加来自过滤室(2)的剩余体积并产生泵压力,并且泵装置(6)通过连接管线(10)连接到一个或多个闭合的压实压力室(8),其中装置两个过滤室 (2,3)平行地设置,并且各自通过阀装置分别连接到入口侧的进料和泵装置(6)到出口侧的一个或多个压实室(8)。
    • 10. 发明申请
    • SYSTEM AND METHOD FOR TREATING WASTEWATER
    • 用于处理废水的系统和方法
    • US20080190867A1
    • 2008-08-14
    • US11833234
    • 2007-08-03
    • Sin Chai LinYuan Hsin PengJiang LiuJun Feng
    • Sin Chai LinYuan Hsin PengJiang LiuJun Feng
    • B01D37/00B01D43/00
    • B01D36/02B01D37/00B01D43/00C02F1/444C02F2103/346
    • The present invention provides a system for treating wastewater produced during grinding and slicing in a semiconductor packaging process, comprising a collecting tank for collecting the wastewater produced during grinding and/or slicing in a semiconductor packaging process; a physical filtration device for separating the suspended materials from the wastewater by physical filtration, the physical filtration device being in fluid communication with the collecting tank; a receiving device for receiving the wastewater treated by the physical filtration device, and the receiving device being in fluid communication with the physical filtration device. The present invention further provides a method for treating wastewater produce during grinding and slicing in a semiconductor packaging process. The present invention simplifies the treatment of wastewater produced during grinding and slicing in a semiconductor packaging process, and lowers the cost.
    • 本发明提供了一种处理在半导体封装过程中研磨和切片期间产生的废水的系统,包括:用于收集在半导体封装过程中研磨和/或切片期间产生的废水的收集罐; 物理过滤装置,用于通过物理过滤将悬浮物与废水分离,物理过滤装置与收集罐流体连通; 用于接收由所述物理过滤装置处理的废水的接收装置,以及所述接收装置与所述物理过滤装置流体连通。 本发明还提供了一种在半导体封装过程中在研磨和切片期间处理废水产物的方法。 本发明简化了在半导体封装工艺中在研磨和切片期间产生的废水的处理,降低了成本。