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1. 发明公开

US20240261816A1 LIQUID SOLUTION TWIST PEN METHOD AND DEVICES 审中-公开
公开(公告)号：US20240261816A1
公开(公告)日：2024-08-08
申请号：US18387049
申请日：2023-11-05
申请人： Eli Altaras , Yusuf Altaras
发明人： Eli Altaras , Yusuf Altaras
IPC分类号： B05C17/005 , B05C5/02 , B05C11/02 , B05C21/00
CPC分类号： B05C17/00506 , B05C5/0225 , B05C11/023 , B05C17/0052 , B05C21/00
摘要： The embodiments disclose an apparatus including a dispenser having an elongated compartment configured to contain a liquid solution, a liquid solution contained in the elongated compartment configured to suspend solid nanoparticles in an evaporative liquid, a dispenser handle configured to twist to push a predetermined amount of the liquid solution from the elongated compartment out of an open tip orifice, and at least one applicator tip insertable into the tip orifice configured to receive from the elongated compartment the predetermined amount of the liquid solution to spread over a user's mobile device glass screen.

2. 发明授权

US12036573B2 Coating film forming method and coating film forming apparatus 有权
公开(公告)号：US12036573B2
公开(公告)日：2024-07-16
申请号：US17274560
申请日：2019-08-28
申请人： Tokyo Electron Limited
发明人： Shougo Inaba
IPC分类号： B05C11/08 , B05C11/02 , B05D1/00 , B05D3/04 , H01L21/67
CPC分类号： B05C11/08 , B05C11/023 , B05D1/002 , B05D3/042 , H01L21/6715
摘要： A coating film forming method includes holding a substrate by a substrate holder; forming an air flow on a front surface of the substrate; supplying a coating liquid configured to form a coating film on the front surface; forming, after moving a covering member from a first position to a second position relatively to the substrate, the air flow in a gap formed by the covering member placed at the second position and the front surface of the substrate being rotated at a first rotation number such that a flow velocity of the air flow becomes larger than that of the air flow obtained when the covering member is placed at the first position; and rotating the substrate at a second rotation number higher than the first rotation number to adjust a film thickness distribution of the coating film by scattering the coating liquid from a peripheral portion thereof.

3. 发明公开

US20240226952A9 HYBRID PAINT, DRYWALL COMPOUND, AND TEXTURE APPLICATOR SYSTEM 审中-公开
公开(公告)号：US20240226952A9
公开(公告)日：2024-07-11
申请号：US18492562
申请日：2023-10-23
申请人： Uvaldo Vera Martin
发明人： Uvaldo Vera Martin
IPC分类号： B05C11/10 , B05C1/08 , B05C1/10 , B05C5/02 , B05C11/02
CPC分类号： B05C11/1036 , B05C1/0808 , B05C1/0813 , B05C1/10 , B05C5/02 , B05C11/023
摘要： Portable hybrid system for application of any material of drywall compound material, paint material, and texture material by the hybrid system via any of a plurality of material expulsion outlet ports, comprising: a pressurizable hollow tank for carrying material, at least one air compressor for pressurizing the material from the tank, an optionally attachable paint roller subsystem, an optionally attachable paint sprayer subsystem, an optionally attachable drywall compound applicator subsystem, an optionally attachable texture applicator subsystem, and an optionally attachable edge-cutting porous paint pad subsystem, enabling a plurality of workers to apply a given material from a single tank of the material.

4. 发明授权

US11701820B2 Recoaters with gas flow management 有权
公开(公告)号：US11701820B2
公开(公告)日：2023-07-18
申请号：US17488711
申请日：2021-09-29
申请人： Delavan Inc.
发明人： Diana Giulietti , David W. Morganson
IPC分类号： B29C64/153 , B29C64/188 , B05C11/02 , B29C64/205 , B29C64/214 , B33Y10/00 , B22F10/28 , B22F12/60 , B22F12/67 , B22F10/73 , B22F12/70 , B22F10/32 , B22F10/37
CPC分类号： B29C64/153 , B05C11/023 , B22F10/28 , B22F12/60 , B22F12/67 , B29C64/188 , B29C64/205 , B29C64/214 , B33Y10/00 , B22F10/32 , B22F10/37 , B22F10/73 , B22F12/70
摘要： An additive manufacturing device includes a recoater configured to push powder onto a build platform. The recoater defines an advancing direction for pushing powder. A first baffle is mounted to a first end of a leading edge of the recoater and a second baffle mounted to a second end of the leading edge of the recoater opposite the first end. Each of the first and second baffles includes a base mounted to the recoater, a first wall that extends obliquely ahead of and laterally outward from the base relative to the advancing direction, and a second wall opposite the first wall. The second wall extends obliquely ahead of and laterally inward from the base relative to the advancing direction. A volume is defined between the first and second wall with capacity to collect powder as the recoater advances.

5. 发明申请

US20180369854A1 COATING APPLICATION WITH AUTOMATED BRUSHING 审中-公开
公开(公告)号：US20180369854A1
公开(公告)日：2018-12-27
申请号：US15628980
申请日：2017-06-21
申请人： Toyota Motor Engineering & Manufacturing North America Inc.
发明人： Frank Zolli , Dan LeLievre , Michael Horn
IPC分类号： B05C1/06 , B05C1/02
CPC分类号： B05C1/06 , A46B17/06 , B05B1/005 , B05B13/0452 , B05C1/027 , B05C5/0216 , B05C9/12 , B05C11/023 , B05C11/1039 , B05C17/10 , B05D1/28 , B05D1/42 , B44D3/128
摘要： Arrangements described herein include coating application systems and methods for controlling such systems. The system can include an application end configured to be operatively connected to a robot arm. The application end can include one or more nozzles to dispense a coating onto a workpiece. The application end can further include one or more brushes to brush a portion of the coating dispensed onto the workpiece. The brush can be moveable between a retracted position and a deployed position. In some arrangements, the systems can include a cleaning tool to remove excess coating from the brush after brushing.

6. 发明授权

US10062920B2 Powder supplying device and electrode manufacturing apparatus 有权
公开(公告)号：US10062920B2
公开(公告)日：2018-08-28
申请号：US14779677
申请日：2014-03-11
申请人： Masahiro Umeda , Yasuhiro Sakashita , Koichi Tanihara , Naohiro Hasama , Ryo Nakatani
发明人： Masahiro Umeda , Yasuhiro Sakashita , Koichi Tanihara , Naohiro Hasama , Ryo Nakatani
IPC分类号： H01M10/04 , B05C19/06 , B05B5/08 , B05C19/04 , H01M4/04 , B30B15/30 , B05C19/00 , B05B5/16 , B05B7/14 , B05B5/04 , B05C11/02
CPC分类号： H01M10/0404 , B05B5/0418 , B05B5/081 , B05B5/084 , B05B5/1683 , B05B7/144 , B05C11/023 , B05C19/008 , B05C19/04 , B05C19/06 , B30B15/308 , H01M4/0435 , Y10S118/16
摘要： A powder supplying device (2) includes a case (6) in which a storage portion (6a) is formed for temporarily storing powder (10), the case (6) having an inlet (6b) formed in an upper end of the storage portion (6a), and a rectangular outlet (6c) formed in a lower end of the storage portion (6a); a rotor (7) that is arranged in the case (6) and transports the powder (10) in the storage portion (6a) to the outlet (6c) by rotating; and a mesh body (8) through which the powder (10) that has been transported to the outlet (6c) passes. The powder supplying device (2) supplies the powder (10) onto an upper surface of an electrode foil (5). The rotor (7) has a brush-like shape, with a plurality of hair members (7b) radially implanted pointing radially outward with an axial center (G) of the rotor (7) as the center.

7. 发明申请

US20170001165A1 SYSTEMS AND METHODS TO DISPENSE AND MIX REAGENTS 审中-公开
标题翻译：配制和混合试剂的系统和方法
公开(公告)号：US20170001165A1
公开(公告)日：2017-01-05
申请号：US15200408
申请日：2016-07-01
申请人： Centrillion Technology Holdings Corporation
发明人： Filip CRNOGORAC , Glenn MCGALL , Bolan LI
IPC分类号： B01J19/00 , B05C13/00 , B05C11/02 , B05C11/10 , B05D1/00 , B05C11/08
CPC分类号： B01J19/0046 , B01J2219/00333 , B01J2219/0036 , B01J2219/00421 , B01J2219/00443 , B01J2219/00529 , B01J2219/00536 , B01J2219/00596 , B01J2219/00608 , B01J2219/00612 , B01J2219/00659 , B01J2219/00675 , B01J2219/00691 , B01J2219/00722 , B05C11/023 , B05C11/08 , B05C11/1039 , B05C13/00 , B05D1/005 , C40B50/18 , C40B60/14 , G03F7/162 , G03F7/30 , G03F7/3014
摘要： The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm.
摘要翻译：本公开提供了用于晶片处理的方法，装置和系统。晶片处理装置使用盖分配器将至少一种试剂分散到晶片的表面。此外，晶片位于可旋转真空卡盘的顶部，该卡盘构造成经由离心力或表面张力将至少一种试剂扩散到晶片的表面上，从而允许至少一种试剂与另外的试剂反应。此外，当分配至少一种试剂时，盖分配器和晶片之间的间隔距离为例如50μm至2mm的预定距离。

8. 发明授权

US09162247B2 Coating and development treatment system with airflow control including control unit and movable airflow control plate 有权
标题翻译：涂装开发处理系统，包括控制单元和可移动气流控制板
公开(公告)号：US09162247B2
公开(公告)日：2015-10-20
申请号：US13448526
申请日：2012-04-17
申请人： Kousuke Yoshihara , Koji Takayanagi , Shinichi Hatakeyama , Kohei Kawakami
发明人： Kousuke Yoshihara , Koji Takayanagi , Shinichi Hatakeyama , Kohei Kawakami
IPC分类号： B05C11/00 , B05C13/02 , B05C5/00 , B05C11/02 , B05D1/00 , H01L21/67 , G03F7/16 , B05D3/12 , H01L21/00 , H01L51/00
CPC分类号： H01L21/0337 , B05C11/023 , B05D1/005 , G03F7/162 , G06F19/00 , H01L21/0271 , H01L21/6715 , H01L51/0003 , H01L2224/03418
摘要： A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.
摘要翻译：一种涂布处理装置，其将涂布溶液供给到旋转的基板的前表面，并将供给的涂布溶液扩散到基板的外周侧，从而将涂布液涂布在基板的前表面上，包括：保持基板底物; 旋转部，旋转保持在所述基板保持部上的所述基板; 供给部，其向保持在所述基板保持部的所述基板的前表面供给涂布液; 以及气流控制板，其设置在保持在所述基板保持部上的所述基板上方的预定位置，用于在任意位置局部地改变由所述旋转部旋转的所述基板上方的气流。

9. 发明授权

US09138735B2 Method of coating a substrate with a catalyst component 有权
标题翻译：用催化剂组分涂覆基材的方法
公开(公告)号：US09138735B2
公开(公告)日：2015-09-22
申请号：US14294190
申请日：2014-06-03
申请人： Johnson Matthey Public Limited Company
发明人： Dale Albert Roberts , Andrew Michael Bortz , Daniel L. Troland , Richard Peter Rose , R. Bradford Fortner
IPC分类号： B01J37/02 , B01D53/94 , B05D7/22 , B05D7/24 , F01N3/20 , B05C7/04 , B05C7/02 , B05C11/02 , B05D3/02 , B05D3/04 , B65D6/10
CPC分类号： B05C7/04 , B01J35/04 , B01J37/0215 , B01J37/0234 , B05C7/02 , B05C11/02 , B05C11/023 , B05C13/00 , B05D3/0245 , B05D3/0493 , B05D7/22 , B05D2254/04 , B65D7/22
摘要： A method of coating a substrate with a liquid comprising a catalyst component, the method comprising: (a) holding the substrate vertically, thereby defining upper and lower ends thereof, wherein the vertical substrate comprises a plurality of channels that are open at said upper and lower ends; (b) continuously introducing the liquid into the substrate by pushing or injecting the liquid through the open ends of the channels at the lower end of the substrate with a piston; and (c) after the lower end of the substrate has been partly filled with the liquid in step (b), applying a vacuum to the open ends of the channels at the upper end of the substrate while continuing to introduce the liquid into the substrate.
摘要翻译：一种用包含催化剂组分的液体涂覆基材的方法，所述方法包括：（a）垂直地保持所述基材，由此限定其上端和下端，其中所述垂直基材包括在所述上部开口的多个通道，下端（b）通过用活塞将基板的下端的通道的开口端推入或注入液体，将液体连续引入基板; 和（c）在步骤（b）中在衬底的下端部分地填充有液体之后，在衬底的上端处的通道的开口端施加真空，同时继续将液体引入衬底。

10. 发明授权

US09016231B2 Substrate processing method and substrate processing system 有权
标题翻译：基板加工方法和基板处理系统
公开(公告)号：US09016231B2
公开(公告)日：2015-04-28
申请号：US13956958
申请日：2013-08-01
申请人： Tokyo Electron Limited
发明人： Yuichiro Inatomi
IPC分类号： B05C11/02 , G03F7/40 , H01L21/027 , H01L21/67
CPC分类号： B05C11/023 , G03F7/40 , H01L21/0273 , H01L21/67028 , H01L21/67051
摘要： A solvent vapor is made to adhere efficiently to the surface of a resist pattern without using an ultraviolet irradiation process to improve processing accuracy, to reduce processing time and to suppress the diffusion of the solvent outside a substrate processing system. The surface of a resist pattern R formed on a semiconductor wafer W by an exposure process and a developing process is coated with water molecules m. A solvent vapor of a water-soluble solvent, such as NMP, is spouted on the surface of the resist pattern R coated with the water molecules m. A surface layer of the resist pattern R is swollen by the solvent vapor combined with the water molecules m to achieve a smoothing process. The water molecules m and the solvent s remaining on the resist pattern R on the wafer W after the smoothing process are removed by drying.
摘要翻译：使溶剂蒸气有效地粘附到抗蚀剂图案的表面上，而不使用紫外线照射工艺来提高加工精度，减少加工时间并抑制溶剂扩散到基板处理系统外部。通过曝光工艺和显影工艺在半导体晶片W上形成的抗蚀剂图案R的表面涂覆有水分子m。水溶性溶剂如NMP的溶剂蒸气喷射在涂有水分子m的抗蚀剂图案R的表面上。抗蚀剂图案R的表面层通过与水分子m结合的溶剂蒸气而溶胀以实现平滑处理。通过干燥除去平滑处理后的水分子m和残留在晶片W上的抗蚀剂图案R上的溶剂。

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