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1. 发明授权

US09935078B2 Bonding device 有权
公开(公告)号：US09935078B2
公开(公告)日：2018-04-03
申请号：US15104391
申请日：2015-02-19
申请人： KAIJO CORPORATION
发明人： Akio Sugito
IPC分类号： B23K37/00 , H01L23/00 , B23K20/00 , B23K20/10
CPC分类号： H01L24/78 , B23K20/005 , B23K20/007 , B23K20/10 , H01L2224/78301 , H01L2224/78349 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： [Problem]To provide a bonding device in which a capillary can perform stable vibration from a low frequency to a high frequency while achieving lightening and downsizing of a load to be driven by a piezoelectric element and in which stable vibration can be transmitted to the capillary without disturbing operation of expansion and contraction of the piezoelectric element as keeping preliminary pressure to the capillary constant.[Solution]The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a piezoelectric element (10) that is expanded and contracted along an axial direction of a bonding arm (3) with one end thereof fixed to a leading end of the bonding arm (3), a capillary holding portion (15) that is in contact with a circumferential face of a capillary (20) at a base end side thereof as being fixed to the other end of the piezoelectric element (10), a string-like member (23) that is wound to a half circumferential face of the capillary (20) at the base end side on a side opposite to the capillary holding portion (15), and a tension mechanism (25) that is arranged at the bonding arm (3) side to press and hold the capillary (20) to the capillary holding portion (15) by exerting tensile force on the string-like member (23).

2. 发明授权

US09865562B2 Bonding device 有权
公开(公告)号：US09865562B2
公开(公告)日：2018-01-09
申请号：US15104410
申请日：2015-02-19
申请人： KAIJO CORPORATION
发明人： Akio Sugito
IPC分类号： B23K37/00 , H01L23/00 , B23K20/00 , B23K20/02 , B23K20/10
CPC分类号： H01L24/78 , B23K20/005 , B23K20/02 , B23K20/106 , H01L2224/45015 , H01L2224/45099 , H01L2224/78301 , H01L2224/78349 , H01L2224/78824 , H01L2224/78901 , H01L2924/00014 , H01L2924/207 , H01L2224/05599
摘要： To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration. The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a plurality of piezoelectric elements (10) that are expanded and contracted along an axial direction of a bonding arm (3) respectively with one end thereof fixed to a leading end of the bonding arm (3), a plurality of capillary holding portions (15) that are in contact respectively with a circumferential face of a capillary (20) at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (10), and a pressing-holding portion (21) that sandwiches the capillary (20) as pressing the capillary (20) to the capillary holding portions (15) with at least one end side fixed to the bonding arm (3) and the other end side being in contact with the circumferential face of the capillary (20) at the base end side thereof on a side opposite to the capillary holding portions (15). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.

3. 发明授权

US09793236B2 Wire-bonding apparatus and method of manufacturing semiconductor device 有权
公开(公告)号：US09793236B2
公开(公告)日：2017-10-17
申请号：US14712932
申请日：2015-05-15
申请人： SHINKAWA LTD.
发明人： Naoki Sekine , Motoki Nakazawa , Yasuo Nagashima
IPC分类号： B23K31/02 , H01L23/00 , B23K20/00 , B23K20/10
CPC分类号： H01L24/78 , B23K20/005 , B23K20/10 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/78301 , H01L2224/78313 , H01L2224/78343 , H01L2224/78901 , H01L2224/85186 , H01L2224/85201 , H01L2224/85205 , H01L2924/00014 , H01L2924/00 , H01L2924/01012 , H01L2924/0102 , H01L2924/013 , H01L2924/20753 , H01L2224/4554
摘要： Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

4. 发明申请

US20170005065A1 BONDING DEVICE 有权
标题翻译：绑定设备
公开(公告)号：US20170005065A1
公开(公告)日：2017-01-05
申请号：US15104410
申请日：2015-02-19
申请人： KAIJO CORPORATION
发明人： Akio SUGITO
IPC分类号： H01L23/00 , B23K20/10 , B23K20/02 , B23K20/00
CPC分类号： H01L24/78 , B23K20/005 , B23K20/02 , B23K20/106 , H01L2224/45015 , H01L2224/45099 , H01L2224/78301 , H01L2224/78349 , H01L2224/78824 , H01L2224/78901 , H01L2924/00014 , H01L2924/207 , H01L2224/05599
摘要： [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.[Solution] The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a plurality of piezoelectric elements (10) that are expanded and contracted along an axial direction of a bonding arm (3) respectively with one end thereof fixed to a leading end of the bonding arm (3), a plurality of capillary holding portions (15) that are in contact respectively with a circumferential face of a capillary (20) at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (10), and a pressing-holding portion (21) that sandwiches the capillary (20) as pressing the capillary (20) to the capillary holding portions (15) with at least one end side fixed to the bonding arm (3) and the other end side being in contact with the circumferential face of the capillary (20) at the base end side thereof on a side opposite to the capillary holding portions (15). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.
摘要翻译： [解决方案]接合装置设置有振动驱动部分（7），振动驱动部分（7）包括分别沿着接合臂（3）的轴向方向膨胀和收缩的多个压电元件（10）其一端固定在所述接合臂（3）的前端，多个毛细管保持部（15）分别与毛细管（20）的基端侧的周面接触，固定对应于压电元件（10）的另一端，以及将毛细管（20）压在毛细管保持部（15）上的毛细管（20）的夹持部（21）的至少一端固定到所述接合臂（3），所述另一端侧在与所述毛细管保持部（15）相对的一侧的基端侧与所述毛细管（20）的周面接触。这里，对相应的压电元件的驱动电压波形进行振幅，相位，频率或波形的功能操作。

5. 发明授权

US09515034B2 Bond pad having a trench and method for forming 有权
标题翻译：具有沟槽的焊盘和用于形成的方法
公开(公告)号：US09515034B2
公开(公告)日：2016-12-06
申请号：US14147238
申请日：2014-01-03
申请人： Sohrab Safai , David B. Clegg , Tu-Anh N. Tran
发明人： Sohrab Safai , David B. Clegg , Tu-Anh N. Tran
IPC分类号： H01L23/00 , H01L23/485 , B23K20/00
CPC分类号： H01L24/03 , B23K20/004 , B23K20/005 , B23K20/007 , H01L23/485 , H01L24/05 , H01L24/08 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/02166 , H01L2224/03831 , H01L2224/04042 , H01L2224/05017 , H01L2224/05558 , H01L2224/05624 , H01L2224/08059 , H01L2224/43 , H01L2224/45147 , H01L2224/48 , H01L2224/48463 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/01013 , H01L2924/14 , H01L2924/00015 , H01L2924/00014 , H01L2924/00
摘要： A conductive structure is formed in a last metal layer of an integrated circuit. Passivation material is patterned over a portion of the conductive structure. A first trench is patterned around a selected portion of the passivation material. The selected portion represents a bond region of a wire bond to be formed above the passivation material. A portion of the passivation material completely covers a bottom of the trench. A layer of conductive material is conformally deposited over the passivation material. The conformal depositing resulting in a second trench forming in the conductive material over the first trench in the passivation material. The second trench is positioned to contain at least a portion of a splash of the conductive material when the wire bond is subsequently formed.
摘要翻译：导电结构形成在集成电路的最后金属层中。钝化材料在导电结构的一部分上被图案化。在钝化材料的选定部分周围形成第一沟槽。所选择的部分表示将形成在钝化材料上方的引线键合的键合区域。钝化材料的一部分完全覆盖沟槽的底部。一层导电材料共形沉积在钝化材料上。保形沉积导致在钝化材料中的第一沟槽上形成在导电材料中的第二沟槽。当随后形成引线接合时，第二沟槽定位成容纳至少一部分导电材料的溅射。

6. 发明授权

US09455544B2 Wire loops, methods of forming wire loops, and related processes 有权
标题翻译：线环，形成线环的方法和相关过程
公开(公告)号：US09455544B2
公开(公告)日：2016-09-27
申请号：US13812999
申请日：2011-08-03
申请人： Gary S. Gillotti
发明人： Gary S. Gillotti
IPC分类号： B23K31/02 , H01R43/00 , B23K20/00 , H01L23/00
CPC分类号： H01R43/00 , B23K20/005 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48478 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/82045 , H01L2224/829 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , Y10T29/49117 , H01L2924/00 , H01L2224/48227 , H01L2224/85399 , H01L2224/05599
摘要： A method of forming a wire loop is provided. The method includes the steps of: (1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) if the wire bonding tool reaches a predetermined height.
摘要翻译：提供一种形成线环的方法。该方法包括以下步骤：（1）使用引线接合工具在接合位置形成导电凸块; （2）使用所述引线接合工具将一部分线接合到另一接合位置; （3）将线的长度从所述接合部分延伸到所述接合位置; （4）在检测所述引线接合工具的尖端的高度的同时，朝向所述接合位置降低所述接合工具; 以及（5）如果所述引线接合工具达到预定高度，则在步骤（4）期间中断所述引线接合工具的下降。

7. 发明授权

US09397066B2 Bond wire feed system and method therefor 有权
标题翻译：债券送丝系统及其方法
公开(公告)号：US09397066B2
公开(公告)日：2016-07-19
申请号：US14693881
申请日：2015-04-23
申请人： Zhijie Wang , Zhigang Bai , Huchang Zhang
发明人： Zhijie Wang , Zhigang Bai , Huchang Zhang
IPC分类号： B23K31/02 , H01L23/00 , B23K31/12 , B23K37/047 , B23K20/00
CPC分类号： H01L24/78 , B23K20/005 , B23K31/12 , B23K37/047 , B65H51/18 , B65H2701/36 , H01L24/45 , H01L24/85 , H01L2224/45147 , H01L2224/48247 , H01L2224/78301 , H01L2224/78611 , H01L2224/78621 , H01L2224/78631 , H01L2224/789 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.
摘要翻译：接合丝馈送系统具有线张紧单元，其具有具有线入口孔和线出口孔的腔室。电线入口和出口孔具有与腔室的中心轴线对准的中心。定位夹具以接收从线出口孔提供的接合线。夹具具有至少两个可相对于彼此移动的夹爪，并布置成夹持线以将线的中心轴线与腔室的中心轴线对准。夹爪也可以沿着导线的中心轴线移动，以便将线材拉过线材拉紧单元。

8. 发明申请

US20160155718A1 BOND WIRE FEED SYSTEM AND METHOD THEREFOR 有权
标题翻译： BOND WIRE FEED系统及其方法
公开(公告)号：US20160155718A1
公开(公告)日：2016-06-02
申请号：US14693881
申请日：2015-04-23
申请人： ZHIJIE WANG , Zhigang Bai , Huchang Zhang
发明人： ZHIJIE WANG , Zhigang Bai , Huchang Zhang
IPC分类号： H01L23/00 , B23K37/047 , B23K31/12
CPC分类号： H01L24/78 , B23K20/005 , B23K31/12 , B23K37/047 , B65H51/18 , B65H2701/36 , H01L24/45 , H01L24/85 , H01L2224/45147 , H01L2224/48247 , H01L2224/78301 , H01L2224/78611 , H01L2224/78621 , H01L2224/78631 , H01L2224/789 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.
摘要翻译：接合丝馈送系统具有线张紧单元，其具有具有线入口孔和线出口孔的腔室。电线入口和出口孔具有与腔室的中心轴线对准的中心。定位夹具以接收从线出口孔提供的接合线。夹具具有至少两个可相对于彼此移动的夹爪，并布置成夹持线以将线的中心轴线与腔室的中心轴线对准。夹爪也可以沿着导线的中心轴线移动，以便将线材拉过线材拉紧单元。

9. 发明申请

US20150336206A1 TOOL FOR PRODUCING A FRICTION-WELDED CONNECTION BETWEEN A WIRE AND A SUBSTRATE, HAVING A POCKET-SHAPED RECESS 审中-公开
标题翻译：用于生产线和衬底之间的摩擦焊接连接的工具，具有形状的凹坑
公开(公告)号：US20150336206A1
公开(公告)日：2015-11-26
申请号：US14652929
申请日：2013-12-05
申请人： HESSE GMBH
发明人： Michael BROEKELMANN , Hans-Juergen HESSE
IPC分类号： B23K20/12 , B23K20/10
CPC分类号： B23K20/129 , B23K20/005 , B23K20/10 , B23K20/1205 , B23K2101/42 , B23K2103/12 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45147 , H01L2224/48456 , H01L2224/78315 , H01L2224/78316 , H01L2224/85205 , H01L2924/00014
摘要： The invention relates to a tool (1) for producing a friction-welded connection between a wire and a substrate having a tool shaft (2, 3) extending in the direction of a longitudinal center axis of the tool, having a tool receptacle section (2) for fastening the tool to a tool receptacle of a friction-welding machine and having a tool tip (3) connecting to the tool shaft, wherein a face (5) of the tool (1) is allocated to the tool tip (3) and wherein, in order to receive the wire during friction-welding, there is a channel-shaped groove (7) extending in a transverse direction of the tool in the region of the face (5) which is delimited by a shell surface, which can contact the wire at least in sections during friction welding, wherein there is at least one pocket-shaped recess (11) on the shell surface such that a cross-section of the groove (7) is designed to flare in the region of the recesses (11) and there is a wall of the recess (11) set back opposite the shell surface.
摘要翻译：本发明涉及一种用于在电线和基板之间产生摩擦焊接连接的工具（1），该工具（1）具有在工具的纵向中心轴线方向上延伸的工具轴（2,3），具有工具接收部分 2）用于将工具紧固到摩擦焊接机的工具接收器并具有连接到工具轴的工具尖端（3），其中工具（1）的面（5）被分配给工具尖端（3）），并且其中为了在摩擦焊接期间接收所述线，在所述面（5）的由壳表面限定的区域中，存在在所述工具的横向方向上延伸的通道形槽（7）其可以在摩擦焊接期间至少部分地接触线材，其中在壳体表面上存在至少一个袋状凹部（11），使得凹槽（7）的横截面被设计成在凹部（11），并且凹部（11）的壁与壳体表面相对设置。

10. 发明申请

US20150249063A1 WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：电线连接装置及制造半导体器件的方法
公开(公告)号：US20150249063A1
公开(公告)日：2015-09-03
申请号：US14712932
申请日：2015-05-15
申请人： SHINKAWA LTD.
发明人： NAOKI SEKINE , MOTOKI NAKAZAWA , YASUO NAGASHIMA
IPC分类号： H01L23/00 , B23K20/10 , B23K20/00
CPC分类号： H01L24/78 , B23K20/005 , B23K20/10 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/78301 , H01L2224/78313 , H01L2224/78343 , H01L2224/78901 , H01L2224/85186 , H01L2224/85201 , H01L2224/85205 , H01L2924/00014 , H01L2924/00 , H01L2924/01012 , H01L2924/0102 , H01L2924/013 , H01L2924/20753 , H01L2224/4554
摘要： Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.
摘要翻译：提供一种引线接合装置（10），包括：毛细管（28），线（30）穿过该毛细管插入; 和控制器（80）。控制器（80）被配置为执行以下操作：包括：在第二接合操作之后的断开操作，在线被保持在其中时，使线插入的毛细管垂直于毛细管的轴向垂直于水平面。夹紧状态，从而使线与第二接合点断开; 从所述第二接合点向所述预定接合点供给所述线的预接合动作，并且在所述预接合点进行预接合; 以及在预接合操作之后，将从毛细管的尖端突出的线成形为预定的弯曲形状的成形操作。

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