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1. 发明公开

US20230405757A1 BARRIER DEVICE USED IN THE MANUFACTURE OF A LAPPING PLATE, AND RELATED APPARATUSES AND METHODS OF MAKING 审中-公开
公开(公告)号：US20230405757A1
公开(公告)日：2023-12-21
申请号：US18240134
申请日：2023-08-30
申请人： Seagate Technology LLC
发明人： Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC分类号： B24B37/12 , B24B37/005 , B24B53/017 , B24B37/04
CPC分类号： B24B37/12 , B24B37/005 , B24B53/017 , B24B37/04
摘要： The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.

2. 发明授权

US08147294B2 Capillary, capillary polishing method, and capillary polishing apparatus 失效
标题翻译：毛细管，毛细管抛光方法和毛细管抛光装置
公开(公告)号：US08147294B2
公开(公告)日：2012-04-03
申请号：US11987579
申请日：2007-11-30
申请人： Jun Sasaki , Akihiko Yabuki
发明人： Jun Sasaki , Akihiko Yabuki
IPC分类号： B24B1/00
CPC分类号： B24B19/16 , B24B29/08 , B24B37/042 , B24B37/12
摘要： A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the polishing plate at a predetermined angle and with a predetermined amount of pressing. The polishing plate is repeatedly moved at a predetermined speed by a predetermined distance such that the first side is polished. The capillary is then rotated around an axis thereof to obtain a second side of the tip, and the process of polishing is repeated for the second side.
摘要翻译：通过使用具有通过干蚀刻粗糙化的研磨板，在多个侧面上研磨用于显微注射的毛细管尖。尖端的第一侧以预定的角度和预定的压制量放置在抛光板上。抛光板以预定的速度反复移动预定的距离，使得第一面被抛光。然后将毛细管绕其轴线旋转以获得尖端的第二侧，并且对于第二侧重复抛光过程。

3. 发明授权

US08092560B2 Lapping tool and method for manufacturing the same 失效
标题翻译：研磨工具及其制造方法
公开(公告)号：US08092560B2
公开(公告)日：2012-01-10
申请号：US11594080
申请日：2006-11-08
申请人： Hiroshi Inaba , Hiromu Chiba , Xudong Yang , Shinji Sasaki , Nobuto Yasui
发明人： Hiroshi Inaba , Hiromu Chiba , Xudong Yang , Shinji Sasaki , Nobuto Yasui
IPC分类号： B24B1/00 , B24D11/00 , B05D1/12 , H05H1/24 , C23C14/00 , C23C14/32 , C25B11/00
CPC分类号： B24D18/0054 , B24B37/12
摘要： Since structural portions of a device made of a plurality of materials are different from one another in mechanical hardness, it is very difficult to uniformly lap the structural portions. This is attributable to generation of machining recessions due to differences in lapped amount when large fixed abrasive grains are used, and generation of lapping marks caused by that the dropped abrasive grains rotate. Accordingly, in order to cope with the disadvantage, it is essential to surely grip abrasive grains of small size to a surface of a surface plate.[Solving Means]Abrasive grains are fixedly forced into a surface of a lapping tool with mechanical pressure and then the surface of the lapping tool including the abrasive grains is subjected to plasma processing, whereby an improvement in adhesion between the abrasive grains and a surface plate and reduction in the number of loose abrasive grains, which are dropped from the surface of the lapping tool, can be achieved, so that it is possible to realize lapping, in which a surface of a device made of a plurality of materials is made very plane.
摘要翻译：由于由多种材料制成的装置的结构部分在机械硬度上彼此不同，所以很难均匀地研磨结构部分。这是由于当使用大的固定磨粒时由于研磨量的差异而产生加工凹陷，并且由于下落的磨料颗粒旋转而产生研磨痕迹。因此，为了应对这个缺点，必须将小尺寸的磨粒牢固地夹在表面板的表面上。 [解决方案]将研磨颗粒以机械压力固定地压入研磨工具的表面，然后对包含磨粒的研磨工具的表面进行等离子体处理，由此改善磨粒与表面板之间的粘合性并且可以实现从研磨工具的表面落下的松散的磨粒的数量的减少，从而可以实现由多种材料制成的装置的表面非常成型的研磨飞机

4. 发明授权

US08083442B2 Cutting tool for lapping plate 失效
标题翻译：研磨板切割工具
公开(公告)号：US08083442B2
公开(公告)日：2011-12-27
申请号：US12458115
申请日：2009-06-30
申请人： Yaoliang Pan
发明人： Yaoliang Pan
IPC分类号： B26D1/25 , B26D1/00
CPC分类号： B24B37/34 , B24B37/12 , Y10T407/1946 , Y10T407/1948 , Y10T407/23
摘要： A cutting tool for a lapping plate surface profile comprises a major body and a cutting body, and the cutting body comprises a first connection surface, a second connection surface and a third connection surface connecting the first connection surface and the second connection surface. The third connection surface has a secondary portion connecting a arc-shaped portion of the first connection portion and an inclined portion of the second connection portion. The cutting tool employs the arc-shaped portion and the secondary portion to cut the lapping plate so as to form a sound profile surface.
摘要翻译：用于研磨板表面轮廓的切削工具包括主体和切割体，切割体包括连接第一连接表面和第二连接表面的第一连接表面，第二连接表面和第三连接表面。第三连接面具有连接第一连接部的弧形部和第二连接部的倾斜部的二次部。切割工具采用弧形部分和次要部分来切割研磨板以形成声音轮廓表面。

5. 发明申请

US20090020437A1 Method and system for controlled material removal by electrochemical polishing 审中-公开
标题翻译：通过电化学抛光控制材料去除的方法和系统
公开(公告)号：US20090020437A1
公开(公告)日：2009-01-22
申请号：US10902241
申请日：2004-07-29
申请人： Bulent M. Basol , Cyprian E. Uzoh , George Xinsheng Guo
发明人： Bulent M. Basol , Cyprian E. Uzoh , George Xinsheng Guo
IPC分类号： C25F3/16 , C25D17/00
CPC分类号： B24B37/12 , B24B37/046 , C25F3/30 , C25F7/00 , H01L21/2885 , H01L21/32115 , H01L21/32125 , H01L21/76838 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for electropolishing a conductive layer on a wafer is provided. The apparatus includes an electrode and a conductive member having openings permitting an electropolishing solution to flow through it. Surface of the conductive member includes a surface profile. During the electropolishing process, the surface of the conductive element is placed across from the conductive layer and a potential difference is applied between the conductive layer and the electrode. The process forms a conductive layer profile of the conductive layer.
摘要翻译：提供了一种在晶片上电抛光导电层的方法和装置。该装置包括电极和具有允许电解抛光溶液流过其的开口的导电构件。导电构件的表面包括表面轮廓。在电抛光过程中，导电元件的表面被放置在导电层的两侧，并且在导电层和电极之间施加电位差。该工艺形成导电层的导电层轮廓。

6. 发明授权

US07431634B2 Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly 失效
标题翻译：压板组件，具有压板组件的装置和使用压板组件抛光晶片的方法
公开(公告)号：US07431634B2
公开(公告)日：2008-10-07
申请号：US11702854
申请日：2007-02-06
申请人： Young-Chul Lee
发明人： Young-Chul Lee
IPC分类号： B24B49/16
CPC分类号： B24B37/12 , B24B21/08
摘要： In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders extends in a first direction on an entire surface of the platen and is spaced apart by a uniform distance, and the first bladders apply pressure to the polishing belt. A plurality of second bladders extends in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and is positioned between the first bladders, and the second bladders apply pressure to the polishing belt. The pressures of the bladders are individually controlled by pressure controllers. Various pressures are individually applied different portions of the polishing belt by the bladders.
摘要翻译：在用于抛光装置的压板组件中，压板支撑在抛光过程中与物体接触的抛光带，使得压板在抛光过程中在抛光带上提供压力。多个第一气囊在压板的整个表面上沿第一方向延伸并且间隔开均匀的距离，并且第一气囊向抛光带施加压力。多个第二气囊在压板表面的中间部分的第一方向上延伸，位于压板的中心部分和周边部分之间，并且位于第一气囊之间，并且第二气囊向抛光带施加压力。气囊的压力由压力控制器单独控制。通过气囊分别施加各种压力的抛光带的不同部分。

7. 发明申请

US20080051014A1 CONFIGURABLE POLISHING APPARATUS 有权
标题翻译：可配置抛光装置
公开(公告)号：US20080051014A1
公开(公告)日：2008-02-28
申请号：US11762007
申请日：2007-06-12
申请人： In-Kwon Jeong , David E. Berkstresser
发明人： In-Kwon Jeong , David E. Berkstresser
IPC分类号： B24B7/30 , B24B1/00 , B24B7/19
CPC分类号： B24B37/12 , B24B37/345
摘要： A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.
摘要翻译：用于研磨半导体晶片的抛光装置包括主抛光结构，其包括多个抛光台，多个抛光头和多个装载和卸载台，以及附加抛光结构，其包括附加抛光桌子和一个额外的抛光头。附加抛光结构可以附加到主抛光结构以形成具有附加抛光台和附加抛光头的较大抛光结构。

8. 发明申请

US20070197133A1 Polishing article with integrated window stripe 失效
标题翻译：具有集成窗口条纹的抛光物品
公开(公告)号：US20070197133A1
公开(公告)日：2007-08-23
申请号：US11707548
申请日：2007-02-15
申请人： Gregory Menk , Peter McReynolds , Erik Rondum , Anand Iyer , Gopalakrishna Prabhu , Garlen Leung
发明人： Gregory Menk , Peter McReynolds , Erik Rondum , Anand Iyer , Gopalakrishna Prabhu , Garlen Leung
IPC分类号： B24B49/00 , B24B1/00 , B24D11/00
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.
摘要翻译：描述了一种方法。该方法包括使非固体材料与抛光材料片的非线性边缘接触，并使非固体材料固化以形成接触抛光材料的非线性边缘的窗口。

9. 发明授权

US07175508B2 Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method 有权
标题翻译：抛光装置，使用其的半导体装置的制造方法以及通过该方法制造的半导体装置
公开(公告)号：US07175508B2
公开(公告)日：2007-02-13
申请号：US11290815
申请日：2005-12-01
申请人： Shigeto Izumi
发明人： Shigeto Izumi
IPC分类号： B24B7/02
CPC分类号： B24B37/12 , H01L21/30625
摘要： The present invention provides a polishing apparatus for a semiconductor wafer in which a slide member and a swing holding member are provided in a polishing member that is provided so as to block an opening in a head housing, a slide guide member and a ring member are provided in the head housing, the ring member surrounds the periphery of the polishing member positioned in the head housing such that a predetermined clearance is formed between the ring member and the outer peripheral portion of the polishing member, and the polishing member is constituted to be capable of a reciprocating motion using air that is supplied into and discharged from the head housing. By means of this constitution, the present invention provides a polishing apparatus in which the linearity between a polishing thrust and air pressure in the head housing is increased.
摘要翻译：本发明提供了一种用于半导体晶片的抛光装置，其中滑动构件和摆动保持构件设置在抛光构件中，该抛光构件被设置为阻挡头壳体中的开口，滑动引导构件和环构件设置在头部壳体中，环形构件围绕位于头部壳体中的抛光构件的周边，使得环形构件与抛光构件的外周部分之间形成预定的间隙，并且抛光构件构成为能够使用从头部壳体供给和排出的空气进行往复运动。通过该结构，本发明提供一种抛光装置，其中抛光推力与头壳体中的空气压力之间的线性度增加。

10. 发明授权

US07160175B2 Attitude control device and precision machining apparatus 有权
标题翻译：姿态控制装置和精密加工装置
公开(公告)号：US07160175B2
公开(公告)日：2007-01-09
申请号：US11316906
申请日：2005-12-27
申请人： Sumio Kamiya , Hisao Iwase , Tetsuya Nagaike , Hiroshi Eda , Libo Zhou
发明人： Sumio Kamiya , Hisao Iwase , Tetsuya Nagaike , Hiroshi Eda , Libo Zhou
IPC分类号： B24B51/00
CPC分类号： B24B37/12 , B24B49/10
摘要： An attitude control device and a precision machining apparatus capable of accurately controlling the attitude of an object mounted on the attitude control device according to grinding stages. The attitude control device is constituted by a first flat-plate member 21 and a second flat-plate member 22 disposed in parallel with the first flat-plate while being spaced apart from the same by a distance L. A spherical member 3 is interposed between the first and second flat-plate members 21, 22 while fitting its portions in recesses 21a, 22a respectively formed in the first and second flat-plate members 21, 22. A first actuator 4a expandable in a Z-axis direction perpendicular to a plane defined by an X-axis and a Y-axis is interposed between the flat-plate members. Second actuators 4b, 4b expandable in a suitable direction in the plane defined by the X-axis and the Y-axis are connected to the second flat-plate member 22. The second flat-plate member 22 is movable relative to the first flat-plate member while being in an attitude with an object mounted thereon. The spherical member 3 is bonded to the first and second flat-plate members 21, 22 by an adhesive 6 elastically deformable.
摘要翻译：一种能够根据研磨阶段精确地控制安装在姿态控制装置上的物体的姿态的姿态控制装置和精密加工装置。姿态控制装置由与第一平板平行设置的第一平板构件21和第二平板构件22构成，同时与其隔开一段距离L.一个球形构件3介于第一和第二平板构件21,22，同时将其部分装配在分别形成在第一和第二平板构件21,22中的凹部21a，22a中。第一致动器4可沿Z轴方向垂直到由X轴和Y轴限定的平面插入在平板构件之间。在由X轴和Y轴限定的平面中沿适当的方向膨胀的第二致动器4b，4b连接到第二平板构件22.第二平板构件22可相对于第一平板构件22移动。平板构件，同时处于安装在其上的物体的姿态。球形构件3通过可弹性变形的粘合剂6结合到第一和第二平板构件21,22。

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