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1. 发明申请

US20170217084A1 DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP 审中-公开
公开(公告)号：US20170217084A1
公开(公告)日：2017-08-03
申请号：US15317611
申请日：2014-05-02
申请人： Nobuo KURODA , Eiji KUWAHARA
发明人： Eiji KUWAHARA
IPC分类号： B29C65/32 , H05B6/14 , B29C51/08 , B44C3/08
CPC分类号： B29C65/32 , B29C35/0805 , B29C35/12 , B29C43/04 , B29C43/14 , B29C43/18 , B29C43/40 , B29C51/08 , B29C65/04 , B29C65/366 , B29C65/3676 , B29C65/7441 , B29C66/00463 , B29C66/1122 , B29C66/30621 , B29C66/433 , B29C66/71 , B29C66/73921 , B29C66/8122 , B29C66/81457 , B29C66/8322 , B29C2043/3602 , B29C2793/009 , B29K2023/12 , B29K2105/20 , B29K2105/256 , B29L2017/006 , B29L2031/722 , B29L2031/744 , B44C3/02 , B44C3/085 , H05B6/14 , B29K2021/00 , B29K2027/06 , B29K2075/00 , B29K2067/00 , B29K2023/00
摘要： A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

2. 发明授权

US09677596B2 Compression molding fastener 有权
公开(公告)号：US09677596B2
公开(公告)日：2017-06-13
申请号：US14403545
申请日：2013-05-22
申请人： CONTINENTAL STRUCTURAL PLASTICS, INC.
发明人： Christopher Johnston
IPC分类号： F16B37/14 , B29C43/36 , B29C43/18 , B29C70/68 , B29C33/12 , B29C70/86 , B29K101/12 , B29K105/08 , B29L31/00 , F16B37/12
CPC分类号： F16B37/14 , B29C33/12 , B29C43/18 , B29C43/36 , B29C70/682 , B29C70/86 , B29C2043/3602 , B29K2101/12 , B29K2105/0872 , B29L2031/727 , F16B37/122
摘要： A method for forming an elevated surface feature for compression molded assemblies includes the placement of an afore-mentioned insert onto an actuated fixture pin with the pin initially in a retracted position. An upper portion of a mold configured with said retracted actuated fixture pin over a preform of pre-preg plies placed on the bottom portion of the mold is then closed. The fixture pin is actuated towards the pre-preg plies when a flowable material fills a molding cavity in the upper portion of the mold. The cavity is configured to form the elevated surface feature with the advancing action of the insert packs out the surface feature under the pressure of the pin to eliminate porosity in the elevated surface feature in the molding cavity.

3. 发明申请

US20160035593A1 DEVICES AND METHODS RELATED TO SUPPORT FOR PACKAGING SUBSTRATE PANEL HAVING CAVITIES 审中-公开
标题翻译：用于包装具有CAVITIES的基板的相关装置和方法
公开(公告)号：US20160035593A1
公开(公告)日：2016-02-04
申请号：US14809239
申请日：2015-07-26
申请人： SKYWORKS SOLUTIONS, INC.
发明人： Matthew Sean READ , Howard E. CHEN , Sandra Louise PETTY-WEEKS
IPC分类号： H01L21/56 , B29C43/36 , B29C43/18
CPC分类号： H01L21/565 , B29C43/18 , B29C43/36 , B29C2043/3602 , B29L2031/3406 , H01L21/52 , H01L23/13 , H01L23/3107 , H01L23/3121 , H01L23/49838 , H01L23/5389 , H01L23/552 , H01L23/66 , H01L24/97 , H01L25/16 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/15153 , H01L2924/15159 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H05K1/023 , H05K1/181
摘要： Devices and methods related to support for packaging substrate panel having cavities. In some embodiments, a device for fabricating radio-frequency (RF) modules can include a support plate having a receiving side configured to receive a packaging substrate panel having a plurality of pockets. The receiving side can include a plurality of support features. Each support feature can be dimensioned to fit at least partially into the corresponding pocket and provide support for a portion of the packaging substrate panel associated with the pocket. Among others, such a device can allow formation of an overmold on the side of packaging substrate panel opposite from the pockets, without mechanical deformation of the packaging substrate panel.
摘要翻译：与支撑具有空腔的包装衬底面板相关的装置和方法。在一些实施例中，用于制造射频（RF）模块的装置可以包括支撑板，其具有被配置为接收具有多个袋的封装衬底面板的接收侧。接收侧可以包括多个支撑特征。每个支撑特征的尺寸可以至少部分地配合到相应的袋中，并且为与袋相关联的一部分包装衬底面板提供支撑。其中，这种装置可以允许在包装基板的与袋口相对的一侧上形成包覆模制，而不会使包装基板面板发生机械变形。

4. 发明申请

US20100189836A1 MICROPATTERN TRANSFER DEVICE 失效
标题翻译：微波传输设备
公开(公告)号：US20100189836A1
公开(公告)日：2010-07-29
申请号：US12692135
申请日：2010-01-22
申请人： Ryuta Washiya , Masahiko Ogino , Noritake Shizawa , Kyoichi Mori , Akihiro Miyauchi
发明人： Ryuta Washiya , Masahiko Ogino , Noritake Shizawa , Kyoichi Mori , Akihiro Miyauchi
IPC分类号： B29C59/02
CPC分类号： G11B5/82 , B29C43/021 , B29C2043/025 , B29C2043/3411 , B29C2043/3488 , B29C2043/3602 , B29C2043/3634 , B29C2043/5038 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G11B5/743 , G11B7/263
摘要： In a micropattern transfer device, a stamper on which a fine indented pattern is formed is brought into contact with a material to be transferred, and the fine indented pattern on the stamper is transferred onto a surface of the material to be transferred. The micropattern transfer device includes a holding mechanism which holds an entire outer circumferential portion of the material to be transferred. The holding mechanism holds the material to be transferred such that a distance between the material to be transferred and the stamper is substantially equal to or shorter than a distance between the holding mechanism and the stamper.
摘要翻译：在微图案转印装置中，形成有精细凹凸图案的压模与要转印的材料接触，压模上的精细凹入图案被转印到待转印材料的表面上。微图案转印装置包括保持待转印材料的外周部分的保持机构。保持机构保持要被转印的材料，使得被转印材料和压模之间的距离基本上等于或短于保持机构和压模之间的距离。

5. 发明授权

US07699595B2 Method and apparatus for molding a laminated trim component without use of slip frame 有权
标题翻译：用于模制不使用滑动框架的层压装饰构件的方法和装置
公开(公告)号：US07699595B2
公开(公告)日：2010-04-20
申请号：US11155045
申请日：2005-06-17
申请人： Gerhard Spengler
发明人： Gerhard Spengler
IPC分类号： B29C51/20
CPC分类号： B29C43/36 , B29C33/20 , B29C2043/3602 , B29K2105/0854 , B29L2031/3041
摘要： An apparatus for producing a molded product from a sheet-form raw material blank has first and second mold tools that each respectively include a respective inner core mold and a respective outer edge mold laterally adjacent thereto. Drive elements drive the outer edge molds relative to a machine frame, and drive the inner core molds relative to the outer edge molds. A molding process involves closing the outer edge molds to hold an edge rim of the material blank while allowing slippage thereof, and then closing the inner core molds to three-dimensionally deform and mold a central portion of the material blank while pulling required additional material by slippage through the outer edge molds. A separate slip frame is not used. The edge rim held by the outer edge molds remains as a permanent mounting rim or flange of the finished molded product. Edge waste is minimized.
摘要翻译：用于从片状原料坯料制造模塑产品的装置具有第一和第二模具，每个模具工具分别包括相应的内芯模具和与其横向相邻的相应外边缘模具。驱动元件相对于机架驱动外边缘模具，并相对于外边缘模具驱动内芯模具。模制过程涉及关闭外边缘模具以保持材料坯料的边缘边缘，同时允许其滑动，然后关闭内芯模具以三维地变形和模制材料坯料的中心部分，同时通过通过外边缘模具滑动。不使用单独的滑动框架。由外边缘模具保持的边缘保持为成品模制产品的永久性安装边缘或凸缘。边缘废料最小化。

6. 发明申请

US20080265464A1 Apparatus and Process for Manufacturing Shaped Plastic Reinforced Composite Articles 审中-公开
标题翻译：制造塑料增强复合材料制品的设备和工艺
公开(公告)号：US20080265464A1
公开(公告)日：2008-10-30
申请号：US11577392
申请日：2005-10-20
申请人： Edward L. D'Hooghe , Richard A. Walker , David G. McLeod
发明人： Edward L. D'Hooghe , Richard A. Walker , David G. McLeod
IPC分类号： B29C51/00
CPC分类号： B29C43/36 , B29C51/004 , B29C70/04 , B29C2043/3602 , B29C2043/3631 , B29K2023/0641 , B29K2023/12 , B32B1/00 , B32B27/32 , D03D15/00 , D03D15/0088 , D10B2321/021 , D10B2321/022 , D10B2401/041 , D10B2505/02 , Y10T156/10 , Y10T428/13 , Y10T428/1303 , Y10T428/1352 , Y10T428/1359 , Y10T428/139 , Y10T428/1393 , Y10T428/24942 , Y10T428/2495 , Y10T428/24975 , Y10T428/264 , Y10T428/31504 , Y10T428/31909 , Y10T428/31913 , Y10T442/2008
摘要： A process for forming a shaped three dimensional article, comprising the steps of deforming an intermediate form (10), including a plurality of thermoplastic elongated members that are initially movable relative to each other, while displaceably clamping the intermediate form during the deforming in such a way that while a force is applied for deforming the intermediate form, the intermediate form is free to move within a predetermined limit; and optionally at least partially consolidating the thermoplastic elongated members of the intermediate form for forming a three dimensional article having a predetermined orientation of the elongated members. An apparatus including a press (32) for forming the shaped three-dimensional article is also disclosed.
摘要翻译：一种用于形成成形的三维制品的方法，包括以下步骤：使中间形式（10）变形，所述中间形式（10）包括可以相对于彼此最初可移动的多个热塑性细长构件，同时在所述变形过程中可移动地夹持所述中间形式当施加力以使中间形式变形时，中间形式在预定限度内自由移动; 并且可选地至少部分地固定中间形式的热塑性细长构件，以形成具有预定方向的细长构件的三维制品。还公开了一种包括用于形成成形三维制品的压机（32）的设备。

7. 发明授权

US07163033B2 Substrate bonding apparatus for liquid crystal display device panel 失效
标题翻译：液晶显示装置面板用基板接合装置
公开(公告)号：US07163033B2
公开(公告)日：2007-01-16
申请号：US11117316
申请日：2005-04-29
申请人： Sang Pyo Hong
发明人： Sang Pyo Hong
IPC分类号： B65B1/04
CPC分类号： B29C43/56 , B29C2043/3602 , B29C2043/561 , B32B37/10 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , H01L21/67092 , H01L21/6838
摘要： A substrate bonding apparatus for a liquid crystal display device panel includes an upper chamber plate, a lower chamber plate opposing the upper chamber plate, an upper low vacuum chamber provided on the upper chamber plate, a lower low vacuum chamber provided on a rear surface of the lower chamber plate, a sealing member provided on the lower chamber plate, the sealing member projecting from a top surface of the lower chamber plate at a predetermined height to contact the upper chamber plate to form a high vacuum chamber therein, at least two holes provided in each of the upper and lower chamber plates, at least two flow shut-off systems shutting off each of the holes, vacuum pumping system for reducing pressures of the upper and lower low vacuum chambers to low vacuum states, and reducing the high vacuum chamber to a high vacuum state, and upper and lower stages provided to upper and lower chamber plates, respectively, within an inside space of the high vacuum chamber to affix first and second substrates of the liquid crystal display device panel, respectively.
摘要翻译：一种用于液晶显示装置面板的基板接合装置包括：上室板，与上室板相对的下室板，设在上室板上的上低真空室;设置在上室板的后表面上的下低真空室; 所述下室板，设置在所述下室板上的密封构件，所述密封构件从所述下室板的顶表面以预定高度突出以接触所述上室板，以在其中形成高真空室，至少两个孔设置在每个上室和下室板中，至少两个关闭每个孔的流动切断系统，用于将上下低真空室的压力降低到低真空状态的真空泵系统，以及降低高真空室到高真空状态，以及分别在高真空室的内部空间内设置到上部和下部室板的上部和下部，以首先固定和液晶显示装置面板的第二基板。

8. 发明申请

US20050225006A1 Method for molding metal-covered component 审中-公开
标题翻译：金属覆盖部件成型方法
公开(公告)号：US20050225006A1
公开(公告)日：2005-10-13
申请号：US11146809
申请日：2005-06-07
申请人： Jason Murar , David Davis
发明人： Jason Murar , David Davis
IPC分类号： B29C43/02 , B29C43/20 , B29C43/36 , B29C43/40 , B29C45/14 , B60R21/20 , B60R21/215
CPC分类号： B29C43/021 , B29C43/00 , B29C43/203 , B29C43/36 , B29C43/3697 , B29C43/40 , B29C2043/3411 , B29C2043/3422 , B29C2043/3602 , B29C2043/522 , B29C2793/0081 , B29C2793/009 , B29K2105/256 , B29K2995/0026 , B29L2031/3005 , B29L2031/3041 , B60R21/21656
摘要： A molding method and a metal-covered plastic component such as partial or entire fascia, body side moldings, and the like, which have bright surface requirements and which includes a film sheet and a one-piece thermoplastic elastomeric structural carrier are provided. The film sheet includes a decorative layer of metal such as chrome. A plastic layer of the film sheet on which the layer of metal is formed is selected from a group consisting of polyester, polyurethane and polycarbonate. A bottom contact surface of the film sheet bonds with a front contact surface of the structural carrier by diffusion between the contact surfaces thereof within a mold cavity of an injection mold separate from the step of forming a preform which is securely positioned within the injection mold during injection molding to form the plastic part.
摘要翻译：提供了具有光亮表面要求并且包括薄膜片和一体式热塑性弹性体结构载体的成型方法和金属覆盖的塑料部件，例如局部或整个面板，本体侧模制品等。膜片包括金属如铬的装饰层。其上形成有金属层的薄膜片的塑料层选自聚酯，聚氨酯和聚碳酸酯。膜片的底部接触表面通过在注射模具的模腔内的接触表面之间的扩散而与结构载体的前接触表面粘合，所述接触表面与在形成预定器的步骤之间分离，所述预成型件牢固地定位在注射模具内注塑成型塑料件。

9. 发明授权

US06939597B2 Molded painted plastic component being an integrally formed badge 失效
标题翻译：成型的塑料部件是整体形成的徽章
公开(公告)号：US06939597B2
公开(公告)日：2005-09-06
申请号：US09996422
申请日：2001-11-30
申请人： Larry J. Winget , Darius J. Preisler , Jason T. Murar
发明人： Larry J. Winget , Darius J. Preisler , Jason T. Murar
IPC分类号： B29C43/02 , B29C43/20 , B29C43/36 , B29C43/40 , B29C45/14 , B44C1/17 , B60R21/215 , B60R21/2165 , B32B27/36
CPC分类号： B60R21/215 , B29C43/00 , B29C43/021 , B29C43/203 , B29C43/36 , B29C43/3697 , B29C43/40 , B29C45/14 , B29C45/1418 , B29C45/14811 , B29C2043/026 , B29C2043/3411 , B29C2043/3422 , B29C2043/3602 , B29C2043/3652 , B29C2043/525 , B29C2045/14237 , B29C2793/0081 , B29C2793/009 , B29K2105/256 , B29K2221/003 , B29K2995/0026 , B29L2031/3005 , B29L2031/3038 , B29L2031/3041 , B44C1/1729 , B60R21/21656 , B60R2021/21543 , Y10T428/24364 , Y10T428/24736 , Y10T428/265 , Y10T428/31507 , Y10T428/31554 , Y10T428/31565 , Y10T428/31583 , Y10T428/31587 , Y10T428/31786 , Y10T428/31797
摘要： A method is provided for manufacturing a painted plastic component having a badge, emblem or other ornamentation, such as air bag covers having a badge, or wherein the component is the badge itself. The method includes providing a painted film sheet and a one-piece thermoplastic elastomeric structural carrier. A bottom contact surface of the film sheet bonds with a front contact surface of the structural carrier by diffusion between the contact surfaces thereof within a mold cavity of an injection mold separate from the mold cavity of a vacuum mold which is utilized to vacuum-mold the film sheet to form the desired painted plastic component.
摘要翻译：提供了一种用于制造具有徽章，徽章或其他装饰物的涂漆塑料部件的方法，例如具有徽章的气囊盖，或者其中该部件是徽章本身。该方法包括提供涂膜片和单件热塑弹性结构载体。膜片的底部接触表面通过在与真空模具的模具腔分开的模具腔内的接触表面之间的扩散结合在结构载体的前接触表面上，该真空模具用于真空模制膜片以形成所需的涂漆塑料部件。

10. 发明申请

US20050183789A1 Substrate bonding apparatus for liquid crystal display device panel 失效
公开(公告)号：US20050183789A1
公开(公告)日：2005-08-25
申请号：US11117316
申请日：2005-04-29
申请人： Sang Hong
发明人： Sang Hong
IPC分类号： G02F1/13 , B29C43/56 , B29C65/00 , B32B37/10 , B65B1/04 , B67C3/00 , G02F1/1333 , G02F1/1339 , G02F1/1341 , H01L21/00 , H01L21/683
CPC分类号： B29C43/56 , B29C2043/3602 , B29C2043/561 , B32B37/10 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , H01L21/67092 , H01L21/6838
摘要： A substrate bonding apparatus for a liquid crystal display device panel includes an upper chamber plate, a lower chamber plate opposing the upper chamber plate, an upper low vacuum chamber provided on the upper chamber plate, a lower low vacuum chamber provided on a rear surface of the lower chamber plate, a sealing member provided on the lower chamber plate, the sealing member projecting from a top surface of the lower chamber plate at a predetermined height to contact the upper chamber plate to form a high vacuum chamber therein, at least two holes provided in each of the upper and lower chamber plates, at least two flow shut-off systems shutting off each of the holes, vacuum pumping system for reducing pressures of the upper and lower low vacuum chambers to low vacuum states, and reducing the high vacuum chamber to a high vacuum state, and upper and lower stages provided to upper and lower chamber plates, respectively, within an inside space of the high vacuum chamber to affix first and second substrates of the liquid crystal display device panel, respectively.

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