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1. 发明申请

US20180266910A1 PRESSURE SENSOR, PRESSURE SENSOR MODULE, ELECTRONIC APPARATUS, AND VEHICLE 审中-公开
公开(公告)号：US20180266910A1
公开(公告)日：2018-09-20
申请号：US15914067
申请日：2018-03-07
申请人： SEIKO EPSON CORPORATION
发明人： Yusuke MATSUZAWA , Nobuyuki TANAKA
IPC分类号： G01L19/04 , B81B3/00 , B81B7/00
CPC分类号： G01L19/04 , B81B3/001 , B81B3/0072 , B81B7/0038 , B81B2201/0264 , B81B2203/0127 , B81B2207/07 , G01L9/0052 , G01L9/0054 , G01L9/065 , G01L19/0076 , G01L19/0084 , G01L19/06 , G01L19/145
摘要： A pressure sensor includes a substrate which has a diaphragm that is flexurally deformed by receiving a pressure, a side wall section which is placed on one surface side of the substrate and surrounds the diaphragm in a plan view, and a sealing layer which is placed so as to face the diaphragm through a space and seals the space, wherein the sealing layer includes a first silicon layer which has a through-hole facing the space, a silicon oxide layer which is located on the opposite side to the space with respect to the first silicon layer and seals the through-hole, and a second silicon layer which is located on the opposite side to the space with respect to the silicon oxide layer.

2. 发明申请

US20180234774A1 MICROELECTROMECHANICAL MICROPHONE 审中-公开
公开(公告)号：US20180234774A1
公开(公告)日：2018-08-16
申请号：US15897946
申请日：2018-02-15
申请人： Infineon Technologies AG
发明人： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser , Carsten Ahrens
IPC分类号： H04R19/04 , B81B3/00 , B81C1/00 , H04R19/00 , H04R31/00
CPC分类号： H04R19/04 , B81B3/001 , B81B3/0021 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2203/04 , B81C1/00182 , H04R19/005 , H04R31/003 , H04R2201/003
摘要： A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.

3. 发明授权

US09988260B2 Rough MEMS surface 有权
公开(公告)号：US09988260B2
公开(公告)日：2018-06-05
申请号：US15142381
申请日：2016-04-29
申请人： FREESCALE SEMICONDUCTOR, INC.
发明人： Ruben B. Montez , Arvind S. Salian , Robert F. Steimle
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/001 , B81B2201/0235 , B81B2203/0315 , B81C1/00976 , B81C2201/0132 , B81C2201/115 , B81C2203/0118
摘要： A surface of a cavity of a MEMS device that is rough to reduce stiction. In some embodiments, the average roughness (Ra) of the surface is 5 nm or greater. In some embodiments, the rough surface is formed by forming one or more layers of a rough oxidizable material, then oxidizing the material to form an oxide layer with a rough surface. Another layer is formed over the oxide layer with the rough surface, wherein the roughness of the oxide layer is transferred to the another layer.

4. 发明申请

US20180145612A1 MEMS Structure and Method of Forming Same 审中-公开
公开(公告)号：US20180145612A1
公开(公告)日：2018-05-24
申请号：US15859130
申请日：2017-12-29
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Yi Heng Tsai , Chia-Hua Chu , Kuei-Sung Chang
IPC分类号： H02N1/00 , B81B3/00 , G01P15/125 , G01P15/08
CPC分类号： H02N1/006 , B81B3/0005 , B81B3/0008 , B81B3/001 , B81B2201/0235 , G01P15/125 , G01P2015/0871 , H02N1/00 , Y10T29/49002
摘要： A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.

5. 发明申请

US20180134542A1 METHOD AND APPARATUS FOR REDUCING IN-PROCESS AND IN-USE STICTION FOR MEMS DEVICES 审中-公开
公开(公告)号：US20180134542A1
公开(公告)日：2018-05-17
申请号：US15850677
申请日：2017-12-21
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Lee-Chuan Tseng , Chang-Ming Wu , Shih-Chang Liu , Yuan-Chih Hsieh
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/001 , B81C1/0092 , B81C1/00936 , B81C1/00944 , B81C1/00952 , B81C1/0096 , B81C1/00984 , B81C1/00992 , B81C2201/0132 , B81C2201/056
摘要： The present disclosure involves forming a method of fabricating a Micro-Electro-Mechanical System (MEMS) device. A plurality of openings is formed in a first side of a first substrate. A dielectric layer is formed over the first side of the substrate. A plurality of segments of the dielectric layer fills the openings. The first side of the first substrate is bonded to a second substrate that contains a cavity. The bonding is performed such that the segments of the dielectric layer are disposed over the cavity. A portion of the first substrate disposed over the cavity is transformed into a plurality of movable components of a MEMS device. The movable components are in physical contact with the dielectric the layer. Thereafter, a portion of the dielectric layer is removed without using liquid chemicals.

6. 发明申请

US20180057350A1 MICROMECHANICAL SYSTEM HAVING A STOP ELEMENT 审中-公开
公开(公告)号：US20180057350A1
公开(公告)日：2018-03-01
申请号：US15681062
申请日：2017-08-18
申请人： Robert Bosch GmbH
发明人： Juergen Mueller
IPC分类号： B81B3/00
CPC分类号： B81B3/001 , B81B3/0051 , B81B2203/0172 , B81B2203/0376
摘要： A micromechanical system includes a substrate; a functional element that is mounted to as to allow movement in relation to the substrate; and an elastic stop element. The stop element has a first end that is attached to the substrate, and a second end that is configured to engage with the functional element when the functional element is deflected by a predefined amount from a neutral position. The stop element has an elastic configure in a first direction that coincides with a preferred direction of the functional element, and in a second direction that extends at a right angle to the first direction.

7. 发明申请

US20170217755A1 PRESSURE SENSOR, MANUFACTURING METHOD OF PRESSURE SENSOR, ALTIMETER, ELECTRONIC APPARATUS, AND MOVING OBJECT 有权
公开(公告)号：US20170217755A1
公开(公告)日：2017-08-03
申请号：US15417674
申请日：2017-01-27
申请人： Seiko Epson Corporation
发明人： Yusuke MATSUZAWA , Takuya KINUGAWA
IPC分类号： B81B3/00 , G01C5/06 , G01L9/00 , B81C1/00
CPC分类号： B81B3/001 , B81B2201/0264 , B81B2207/015 , B81C2203/0728 , G01C5/06 , G01L9/0054
摘要： A pressure sensor has a substrate having a diaphragm, a cavity portion that is positioned on one side of the diaphragm, and a ceiling portion that is disposed opposite to the diaphragm via the cavity portion, and unevenness is formed on a surface of the substrate facing the cavity portion. In addition, the unevenness has a plurality of recessed portions.

8. 发明申请

US20170166435A1 Semiconductor Devices with Moving Members and Methods for Making the Same 审中-公开
公开(公告)号：US20170166435A1
公开(公告)日：2017-06-15
申请号：US15441791
申请日：2017-02-24
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/0005 , B81B3/001 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81B2207/092 , B81B2207/095 , B81B2207/096 , B81C1/00269 , B81C1/00579 , B81C2201/0111 , B81C2201/014 , B81C2201/0176 , B81C2203/0118 , B81C2203/019
摘要： A method for forming a MEMS structure includes forming, on a MEMS substrate, an interconnect structure having conductive lines and a first conductive plug of a semiconductor material, forming an etch stop layer on the interconnect structure, forming a dielectric layer over the etch stop layer, bonding a silicon substrate over the dielectric layer, forming a second and third conductive plugs of the semiconductor material in the silicon substrate, wherein the second conductive plug is configured to be electrically coupled with the first conductive plug and third conductive plug is configured to function as an anti-stiction bump, forming a MEMS device electrically coupled with the second conductive feature, and forming a bonding pad on the silicon substrate and surrounded by the second conductive plug.

9. 发明申请

US20170073214A1 MEMS DEVICE 审中-公开
标题翻译： MEMS器件
公开(公告)号：US20170073214A1
公开(公告)日：2017-03-16
申请号：US15363431
申请日：2016-11-29
申请人： Murata Manufacturing Co., Ltd.
发明人： Junya Matsuoka , Nobuaki Tsuji , Yuki Ueya , Tsuyoshi Okami , Takashi Mizota
IPC分类号： B81B3/00 , G01C19/5769 , G01P15/02 , B81C1/00
CPC分类号： B81B3/0013 , B81B3/001 , B81B3/0051 , B81B2201/0235 , B81B2201/0242 , B81C1/00968 , G01C19/5769 , G01P15/02 , H01L29/84
摘要： A MEMS device including a fixed member and a movable member supported via a resilient body. The MEMS device includes an impact alleviation mechanism provided at a position where the movable member and the fixed member collide during operation. The impact alleviation mechanism includes a stopper provided to either the fixed member or the movable member and that protrude to be parallel between sides of the two members with at least one side edge fixed to the respective member. Moreover, the impact alleviation mechanism includes an elongate protruding member provided on the other of the fixed member and the movable member. The elongate protruding member and the stopper are configured such that as collision force increases between the movable member and the fixed member during operation, an abutment area of an outer edge position of the elongate protruding member approaches the fixed side edge of the stopper.
摘要翻译：一种MEMS装置，包括固定构件和通过弹性体支撑的可动构件。 MEMS装置包括设置在可动件和固定件在操作期间碰撞的位置处的冲击减轻机构。冲击减轻机构包括设置在固定构件或可动构件上的止动件，并且突出地平行于两个构件的侧面之间的至少一个侧边缘固定到相应构件。此外，冲击缓解机构包括设置在固定构件和可动构件的另一个上的细长突出构件。细长突出构件和止动件构造成使得在操作期间随着可移动构件和固定构件之间的碰撞力增加，细长突出构件的外边缘位置的邻接区域接近止动件的固定侧边缘。

10. 发明申请

US20170055085A1 SILICON MICROPHONE WITH SUSPENDED DIAPHRAGM AND SYSTEM WITH THE SAME 审中-公开
标题翻译：硅胶麦克风带有悬挂的胶片和系统
公开(公告)号：US20170055085A1
公开(公告)日：2017-02-23
申请号：US15307301
申请日：2014-06-27
申请人： GOERTEK INC.
发明人： Zhe Wang
IPC分类号： H04R19/04 , H04R19/00 , B81B3/00
CPC分类号： H04R19/04 , B81B3/001 , B81B3/0051 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/04 , B81B2207/015 , B81C2203/0714 , H04R19/005 , H04R2201/003
摘要： A silicon microphone with a suspended diaphragm and a system with the same are provided, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm disposed above the back hole of the silicon substrate and separated from the silicon substrate; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between; and a precisely defined support mechanism, disposed between the diaphragm and the backplate with one end thereof fixed to the edge of the diaphragm and the other end thereof fixed to the backplate, wherein the diaphragm and the backplate are used to form electrode plates of a variable condenser. The microphone with a suspended diaphragm can improve the repeatability and reproducibility in performance and can reduce the diaphragm stress induced by the substrate.
摘要翻译：提供具有悬挂隔膜的硅麦克风及其系统，所述麦克风包括：在其中设置有后孔的硅基板; 柔性膜，其设置在所述硅衬底的所述背孔的上方并与所述硅衬底分离; 设置在隔膜上方的穿孔背板，夹在其间的气隙; 以及精确限定的支撑机构，其设置在隔膜和背板之间，其一端固定在隔膜的边缘，另一端固定在背板上，其中隔膜和背板用于形成可变的电极板冷凝器具有悬挂隔膜的麦克风可以提高性能的重复性和再现性，并可以减少由基板引起的隔膜应力。

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