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    • 1. 发明授权
    • Ultraviolet curable resin composition and photo solder resist including the same
    • 紫外线固化型树脂组合物及含有它的光阻焊剂
    • US06964813B2
    • 2005-11-15
    • US10450464
    • 2001-12-06
    • Soichi Hashimoto
    • Soichi Hashimoto
    • C08F8/08C08F283/06C08F290/12C08F290/14C08F299/00C08F299/02C08G59/14C08G59/42C08L63/10G03F7/038H05K3/28B32B27/38C08L63/00
    • C08G59/1494C08F8/00C08F283/06C08F290/126C08F290/142C08F299/00C08F2800/20C08F2810/30C08G59/4292C08L63/10G03F7/038G03F7/0388H05K3/287Y10S428/901Y10T428/31511C08L2666/22C08F8/14C08F2220/325
    • An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy-group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group to obtain an intermediate product, and then reacting the intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in its molecule; (C) a photo-polymerization initiator; (D) a diluent; and (E) an ultraviolet curable resin obtained by reacting a novolac epoxy compound (e) with the ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with the saturated or unsaturated polybasic acid anhydride (c). The ultraviolet curable resin (E) has an acid value of 10 mgKOH/g or more and less than 45 mgKOH/g.
    • 提供了紫外线固化树脂组合物,其显影宽度和分辨率优异,并且具有良好的焊料耐热性和耐镀金性。 该树脂组合物包含(A)通过将包含具有环氧基的烯属不饱和单体(i)的烯键式不饱和单体组分与烯属不饱和单体(i)聚合而制备的含环氧基的聚合物(a) 具有羧基的不饱和单体(b)以获得中间产物,然后使中间产物与饱和或不饱和多元酸酐(c)反应; (B)分子中具有至少两个环氧基的环氧化合物; (C)光聚合引发剂; (D)稀释剂; 和(E)通过使酚醛清漆环氧化合物(e)与具有羧基的烯键式不饱和单体(b)反应得到的紫外线固化树脂,然后使得到的中间产物与饱和或不饱和多元酸酐(c)反应。 紫外线固化性树脂(E)的酸值为10mgKOH / g以上且小于45mgKOH / g。
    • 4. 发明授权
    • Photothermosetting composition comprising acrylated epoxy resin
    • 含有丙烯酸酯化环氧树脂的光热固化组合物
    • US06555592B2
    • 2003-04-29
    • US09793631
    • 2001-02-27
    • Chao-Hui TsengFu-Lung Chen
    • Chao-Hui TsengFu-Lung Chen
    • G03F7004
    • G03F7/032C08F283/10C08G59/4292C08L63/10G03F7/0388H05K3/287
    • A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.
    • 描述了含有基础树脂(A),光聚合性单体或光致抗体(B),光引发剂(C),含有至少两个环氧基的环氧化合物(D)和有机溶剂的光热固化组合物。 基础树脂(A)含有至少两个环氧基,不饱和一元酸(b),饱和或不饱和二元酸(c)和饱和或不饱和酸酐(d)的环氧化合物(a)根据 (a)/(b)/(c)的比例为1:0.90〜0.95:0.025〜0.050,基础树脂的酸值在40〜49mg KOH / g的范围内。 将该光热固化成分涂布在基板上,然后通过烘烤干燥,通过光照射,显影,紫外线照射或加热,并固化形成焊接掩模。
    • 5. 发明申请
    • Polymerizable compounds and compositions
    • 可聚合的化合物和组合物
    • US20020143108A1
    • 2002-10-03
    • US10054360
    • 2002-01-22
    • Joachim E. KleeUwe Walz
    • C08F267/04
    • C08L67/07A61K6/0017A61K6/0023A61K6/083A61K6/087A61K6/09C08F283/02C08F290/06C08F290/061C08F290/064C08G18/835C08G59/10C08G59/12C08G59/1466C08G59/1494C08G59/4292C08G63/52C08G2270/00Y10S525/922C08L33/00C08L43/02C08L63/00C08L75/16
    • An esterified macromonomer within the scope of the general formula: 1 wherein Z is an organic moiety, R1 is hydrogen or a substituted or unsubstituted alkyl having from 1 to 12 carbon atoms, oxyalkyl having from 1 to 12 carbon atoms, alkenyl having from 2 to 12 carbon atoms, cycloalkyl having from 5 to 12 carbon atoms, aryl having from 6 to 12 carbon atoms or aralkyl having from 7 to 12 carbon atoms, each E independently is a hydroxyl group, an organic ester moiety or an inorganic ester containing moiety and at least one E is an ester containing moiety, n and m each independently is an integer from 2 to 12. The esterified macromonomer is obtainable by esterification of at least a portion of the nullOH groups of a macromonomer having at least one terminal double bond with at least one derivative of an inorganic or organic acid which introduces pendant groups exhibiting at least one acid moiety selected from the group of consisting of nullCOOH, nullPO3H2, nullSO3H, nullBO2H or salts thereof. The number of the acid moieties is chosen such that a polymer obtained by polymerizing those monomers has an adhesive strength to dentine of at least 2 MPa.
    • 在通式范围内的酯化大分子单体:其中Z是有机部分,R 1是氢或具有1至12个碳原子的取代或未取代的烷基,具有1至12个碳原子的烷氧基,具有2至12个的烯基 碳原子,具有5至12个碳原子的环烷基,具有6至12个碳原子的芳基或具有7至12个碳原子的芳烷基,每个E独立地是羟基,有机酯部分或含无机酯的部分, 至少一个E是含酯部分,n和m各自独立地为2至12的整数。酯化的大分子单体可通过至少一部分具有至少一个末端双键的大分子单体的-OH基团酯化得到 引入具有至少一个选自-COOH,-PO 3 H 2,-SO 3 H,-BO 2 H或其盐的至少一个酸基部分的侧基的无机或有机酸的至少一种衍生物。 选择酸部分的数量使得通过聚合这些单体获得的聚合物对牙本质的粘合强度至少为2MPa
    • 6. 发明申请
    • Photothermosetting component
    • 光热组件
    • US20020120031A1
    • 2002-08-29
    • US09793631
    • 2001-02-27
    • Fu-Lung Chen
    • C08G002/00
    • G03F7/032C08F283/10C08G59/4292C08L63/10G03F7/0388H05K3/287
    • This invention is to provide a kind of photothermosetting component, which was composed of a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. A base resin (A) is composed of containing at least two epoxy groups of epoxide compound (a), containing at least two double bonds of unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the typical ratio. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.
    • 本发明提供一种由基础树脂(A),光聚合性单色
      剂或光引发剂(B),光引发剂(C),含有至少两个环氧基(D)的环氧化合物组成的光热组分, 和有机溶剂。 基础树脂(A)由含有至少两个环氧化合物(a)的环氧基组成,含有至少两个不饱和一元酸(b)的双键,饱和或不饱和二元酸(c)和饱和或不饱和二元酸 不饱和酸酐(d)根据典型比例。 将该光热固化成分涂布在基板上,然后通过烘烤干燥,通过光照射,显影,紫外线照射或加热,并固化形成焊接掩模。