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1. 发明申请

US20190227243A1 FIBER OPTIC CONNECTOR SUB-ASSEMBLIES AND FIBER OPTIC CONNECTORS INCLUDING THE SAME 审中-公开
公开(公告)号：US20190227243A1
公开(公告)日：2019-07-25
申请号：US16374011
申请日：2019-04-03
申请人： CORNING OPTICAL COMMUNICATIONS LLC
发明人： Adra Smith Baca , Rebecca Lynn Burt , Jeffrey Dean Danley , Darrin Max Miller , Dennis Craig Morrison
IPC分类号： G02B6/38 , C09J161/02 , C09J171/08 , C09J179/08 , C09J181/04
CPC分类号： G02B6/3861 , C09J161/02 , C09J171/08 , C09J179/08 , C09J181/04
摘要： A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends without there being an optical fiber present in the ferrule bore.

2. 发明授权

US10035936B2 A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use 有权
公开(公告)号：US10035936B2
公开(公告)日：2018-07-31
申请号：US14955168
申请日：2015-12-01
申请人： James B. Fraivillig
发明人： James B. Fraivillig
IPC分类号： C09J179/08 , H01L23/00 , C09J5/06 , H01L23/373 , C08G73/10 , C08K3/22 , C08K3/38 , C08K3/08 , C08K7/24
CPC分类号： C09J179/08 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08K2003/0806 , C08K2003/2227 , C08K2003/385 , C09J5/06 , C09J2479/08 , H01L23/3737 , H01L24/03 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/0381 , H01L2224/04026 , H01L2224/2731 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29387 , H01L2224/29499 , H01L2224/32245 , H01L2224/75251 , H01L2224/75272 , H01L2224/83022 , H01L2224/8309 , H01L2224/83204 , H01L2224/83211 , H01L2224/83424 , H01L2224/83856 , H01L2224/83862 , H01L2224/8388 , H01L2224/83885 , H01L2224/83907 , H01L2924/01005 , H01L2924/0503 , H01L2924/05432 , H01L2924/07025 , H01L2924/10272 , H01L2924/1033 , H01L2924/15724 , H01L2924/3512 , H01L2924/3641 , H01L2924/00014 , H01L2924/00012
摘要： A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.

3. 发明授权

US10011685B2 Polyarylether ketone imide adhesives 有权
公开(公告)号：US10011685B2
公开(公告)日：2018-07-03
申请号：US15068249
申请日：2016-03-11
申请人： THE BOEING COMPANY
发明人： Christopher H. Childers , Gregg R. Bogucki , Christopher S. Steinman , Stephen R. Heinz
IPC分类号： H01B3/30 , C08G73/10 , C08K7/06 , C08K7/14 , C08L79/08 , C09J179/08 , C09D179/08 , C08J5/24 , C08J7/04 , B29C67/00 , B29C65/48 , B29C65/00 , B29K79/00 , B29K105/06 , B29K307/04 , B29K309/08 , B29L31/30 , B33Y10/00 , B33Y70/00
CPC分类号： C08G73/1071 , B29C65/02 , B29C65/4815 , B29C65/483 , B29C65/5057 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/742 , B29K2063/00 , B29K2079/085 , B29K2105/06 , B29K2105/167 , B29K2307/04 , B29K2309/08 , B29L2031/3076 , B29L2031/3082 , B29L2031/3085 , B33Y10/00 , B33Y70/00 , C08G61/127 , C08G73/105 , C08G2261/3442 , C08G2261/45 , C08G2261/60 , C08J5/24 , C08J7/047 , C08J2379/08 , C08K7/02 , C08K7/04 , C08K7/06 , C08K7/14 , C08L79/08 , C09D179/08 , C09J165/00 , C09J179/08
摘要： Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV):

4. 发明授权

US10002813B2 Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same 有权
公开(公告)号：US10002813B2
公开(公告)日：2018-06-19
申请号：US14650594
申请日：2014-01-16
申请人： TORAY INDUSTRIES, INC.
发明人： Akira Shimada , Koichi Aoki
IPC分类号： C09J179/08 , H01L23/29 , H01L23/495 , C09J163/00 , C08G59/40 , C09J9/00 , H01L23/373 , C08K3/22 , C08K3/28 , C08K3/38
CPC分类号： H01L23/295 , C08G59/4042 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08K2201/003 , C09J7/28 , C09J9/00 , C09J163/00 , C09J179/08 , C09J2201/122 , C09J2201/602 , C09J2400/163 , C09J2479/08 , H01L23/293 , H01L23/3737 , H01L23/49568 , H01L2924/0002 , Y10T428/2804 , Y10T428/31721 , H01L2924/00
摘要： The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

5. 发明授权

US09796816B2 Poly(amide-imide) block copolymer, article including same, and display device including the article 有权
公开(公告)号：US09796816B2
公开(公告)日：2017-10-24
申请号：US14886576
申请日：2015-10-19
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Chung Kun Cho , Kalinina Fedosya , Kovalev Mikhail , Androsov Dmitry , Won-Cheol Jung , Yoon Seok Ko
IPC分类号： C08G73/14 , B32B15/00 , C09D179/08 , C09J179/08 , C08L79/08 , H01L51/00 , C08G69/32 , C08G73/10 , G02F1/1333
CPC分类号： C08G73/14 , C08G69/32 , C08G73/1042 , C08L79/08 , C09D179/08 , C09J179/08 , G02F1/133305 , H01L51/0097 , Y02E10/549 , Y02P70/521
摘要： A poly(amide-imide) block copolymer that includes: a first segment including a structural unit represented by Chemical Formula 1C, and a second segment including a structural unit represented by Chemical Formula 2: In Chemical Formula 1C and Chemical Formula 2, R5 to R13, and n3 to n8 are the same as in the specification.

6. 发明申请

US20170166784A1 ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS 有权
公开(公告)号：US20170166784A1
公开(公告)日：2017-06-15
申请号：US14967353
申请日：2015-12-13
申请人： James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
发明人： James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
IPC分类号： C09J9/00 , H01L25/00 , H01L23/00 , C09J183/04 , C09J11/06 , C09J179/08 , C09J179/04 , H01L25/065 , C09J11/04
CPC分类号： C09J9/00 , B82Y30/00 , B82Y40/00 , C08K3/041 , C08K5/5425 , C08K5/544 , C08K5/5465 , C08K5/548 , C08K7/24 , C08K2201/01 , C09J11/04 , C09J11/06 , C09J179/04 , C09J179/08 , C09J183/04 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68363 , H01L2224/05624 , H01L2224/05647 , H01L2224/05684 , H01L2224/11831 , H01L2224/13147 , H01L2224/13184 , H01L2224/13562 , H01L2224/13565 , H01L2224/1369 , H01L2224/16147 , H01L2224/27444 , H01L2224/27452 , H01L2224/27612 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32145 , H01L2224/73204 , H01L2224/81005 , H01L2224/81141 , H01L2224/81191 , H01L2224/81201 , H01L2224/81903 , H01L2224/83005 , H01L2224/83192 , H01L2224/83201 , H01L2224/8385 , H01L2224/83855 , H01L2224/83856 , H01L2224/83895 , H01L2224/9202 , H01L2224/9211 , H01L2224/94 , H01L2225/06544 , Y10S977/742 , Y10S977/833 , Y10S977/843 , H01L2924/01006 , H01L2924/00014 , H01L2924/01029 , H01L2924/00012 , H01L2224/81 , H01L2224/83
摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

7. 发明授权

US09650550B2 Polyimide precursor composition, method of producing polyimide precursor composition, method of producing polyimide molded article, polyimide molded article, liquid crystal alignment film, passivation film, wire coating material, and adhesive film 有权
公开(公告)号：US09650550B2
公开(公告)日：2017-05-16
申请号：US14263229
申请日：2014-04-28
申请人： FUJI XEROX CO., LTD.
发明人： Tsuyoshi Miyamoto , Kana Miyazaki
IPC分类号： C08G73/00 , C09J7/00 , C09J179/08 , H01B3/30 , C09K19/56 , C09D179/08 , C08G73/10 , G02B1/04
CPC分类号： C09J179/08 , C08G73/105 , C08G73/1067 , C08G73/1071 , C09D179/08 , C09J2479/08 , C09K19/56 , G02B1/04 , H01B3/306 , C08L33/24 , C08K5/17 , C08K5/357 , C08K5/3445 , C08K5/3435
摘要： A polyimide precursor composition includes a resin having a repeating unit represented by the following Formula (I) and having an imidization ratio equal to or less than 0.2, a cyclic amine compound, and an acyclic aliphatic amine compound, wherein the resin, the cyclic amine compound, and the acyclic aliphatic amine compound are dissolved in an aqueous solvent: wherein in Formula (I), A represents a tetravalent organic group and B represents a divalent organic group.

8. 发明申请

US20170107400A1 ULTRA-THIN POLYIMIDE FILM, AND MANUFACTURE AND ASSEMBLY THEREOF 审中-公开
公开(公告)号：US20170107400A1
公开(公告)日：2017-04-20
申请号：US15293112
申请日：2016-10-13
申请人： TAIMIDE TECHNOLOGY INCORPORATION
发明人： Yen-Po Huang
IPC分类号： C09D179/08 , C08L79/08 , C08G73/10 , C09J179/08
CPC分类号： C09D179/08 , C08G73/1003 , C08G73/1046 , C08G73/105 , C08G73/1071 , C08L79/08 , C08L2203/16 , C09J179/08
摘要： A polyimide film structure includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer. The base layer includes a polyimide, and a filler made of a siloxane polymer present at a weight ratio between about 5 wt % and about 40 wt % based on the total weight of the base layer. Moreover, the present application also describes a method of fabricating the polyimide film structure, and its assembly on a substrate.

9. 发明申请

US20160198570A1 ADHESIVE COMPOSITION FOR PRINTED WIRING BOARDS, BONDING FILM, COVERLAY, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD 审中-公开
标题翻译：印刷布线，粘合膜，覆盖层，铜箔层压板和印刷线路板的粘合剂组合物
公开(公告)号：US20160198570A1
公开(公告)日：2016-07-07
申请号：US14916191
申请日：2014-09-08
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takayuki YONEZAWA , Shingo KAIMORI , Jun SUGAWARA , Shogo ASAI , Yoshifumi UCHITA , Masaya KAKIMOTO
IPC分类号： H05K1/05 , C09J179/08
CPC分类号： H05K1/056 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B27/38 , B32B2264/10 , B32B2307/202 , B32B2307/306 , B32B2307/7265 , B32B2457/08 , C08G73/1042 , C08G73/105 , C08G73/106 , C08G73/1082 , C08G77/455 , C08K3/34 , C08L63/00 , C09J7/10 , C09J179/08 , C09J183/10 , C09J2463/00 , C09J2479/08 , H05K3/386 , H05K3/4673 , H05K2201/0154 , H05K2201/0162 , C08L79/08
摘要： An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.75 or less, and n is 0.25 or more and 0.65 or less. R1 in formula (1) represents a divalent diamine siloxane residue, and R2 in formula (2) represents a divalent aromatic diamine residue.
摘要翻译：本发明的目的是提供一种用于印刷线路板的粘合剂组合物，该粘合剂组合物具有良好的耐热性。本发明的另一个目的是提供一种用于印刷线路板，覆铜层压板和印刷线路板的覆盖层，它们都使用印刷线路板的粘合剂组合物。本发明提供一种印刷线路板用粘合剂组合物，该粘合剂组合物含有包含下述通式（1）和（2）所示结构单元的硅氧烷改性聚酰亚胺，环氧树脂和无机填料。硅氧烷改性聚酰亚胺的重均分子量（Mw）为25,000以上且15万以下。无机填料的含量相对于100质量份硅氧烷改性聚酰亚胺为10质量份以上且100质量份以下。在式（1）和（2）中，Ar表示四价芳香族四羧酸残基，m为0.35以上且0.75以下，n为0.25以上且0.65以下。式（1）中的R 1表示二价二胺硅氧烷残基，式（2）中的R 2表示二价芳香族二胺残基。

10. 发明申请

US20160168329A1 POLYMIDE RESIN 审中-公开
标题翻译：聚合树脂
公开(公告)号：US20160168329A1
公开(公告)日：2016-06-16
申请号：US14906385
申请日：2014-08-04
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人： Yuuki SATO , Jun MITADERA
IPC分类号： C08G73/10 , C08J5/04 , C09J179/08 , C08J5/18 , D01F6/74
CPC分类号： C08G73/1042 , C08G73/10 , C08G73/1028 , C08G73/1039 , C08G73/106 , C08G73/1064 , C08G73/1082 , C08J5/04 , C08J5/18 , C08J2379/08 , C09J179/08 , D01F6/74
摘要： A polyimide resin containing a repeating structural unit of the following formula (1), a repeating structural unit of the following formula (2), and a repeating structural unit of the following formula (A) or a repeating structural unit of the following formula (B), a content ratio of formula (1) with respect to the total of formula (1) and formula (2) being from 40 to 70 mol %, and a content ratio of formula (A) or formula (B) with respect to the total of formula (1) and formula (2) being more than 0 mol % and 25 mol % or less: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 20 carbon atoms; Ra represents a divalent group containing at least one aromatic ring which is bonded to a monovalent or divalent electron-attracting group; Rb represents a divalent group containing —SO2— or —Si(Rx)(Ry)O— wherein Rx and Ry each independently represent a chain aliphatic group having from 1 to 3 carbon atoms, or a phenyl group; and X1, X2, Xa, and Xb each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.
摘要翻译：含有下式（1）的重复结构单元，下式（2）的重复结构单元和下式（A）的重复结构单元或下式的重复结构单元（ B）相对于式（1）和式（2）的总计，式（1）的含量比为40〜70摩尔％，式（A）或式（B）的含有率相对于（1）和式（2）的总和大于0mol％和25mol％或更少：其中R1表示含有至少一个脂环族烃结构的具有6至22个碳原子的二价基团; R2表示碳原子数为5〜20的二价链脂肪族基团。 Ra表示与单价或二价吸电子基团键合的至少一个芳环的二价基团; R b表示包含-SO 2 - 或-Si（R x）（R y）O的二价基团，其中R x和R y各自独立地表示具有1至3个碳原子的链脂肪族基团或苯基; X1，X2，Xa和Xb各自独立地表示含有至少一个芳香环的含6-22个碳原子的四价基团。

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