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    • 3. 发明申请
    • METHOD OF COATING A SUBSTRATE SO AS TO PROVIDE A CONTROLLED IN-PLANE COMPOSITIONAL MODULATION
    • US20160340774A1
    • 2016-11-24
    • US15113099
    • 2014-02-13
    • MIMSI MATERIALS AB
    • Konstantinos SarakinosDaniel Magnfalt
    • C23C14/34C23C14/32C23C14/06C23C14/28
    • C23C14/3485C23C14/0641C23C14/0688C23C14/28C23C14/325C23C14/3464
    • The present disclosure provides a method of coating a substrate so as to provide a controlled in-plane compositional modulation. The method comprises providing a first target of a first material or material composition, providing a second target (104, 204, 304) of a second material or material composition, different from the first material or material composition; activating the first and second targets (103, 104; 203 204; 303, 304) to release particles by evaporation, sublimation or sputtering; and causing the released particles to impinge onto the substrate (102, 202, 302) such that the substrate is coated. Activation of one of the targets (103, 104; 203 204; 303, 304) includes providing a series of activation pulses, such that pulsed evaporation, sublimation or sputtering of particles is provided, while the other one of the targets (103, 104; 203 204; 303, 304) is substantially passive. The first and second target materials or material compositions present a respective homologous temperature, defined as a ratio (Ts/Tmi) of the substrate temperature (Ts) to the target material melting temperature (Tmi) of the target material (i) having the lowest melting temperature (Tmi), a miscibility (ΔHmixAB), as defined by a mixing enthalpy of the target materials or material compositions, wherein the mixing enthalpy of the materials greater than zero is defined as immiscible and a mixing enthalpy of the materials less than zero is defined as miscible; and a two-dimensional or three-dimensional growth mode. In the method, the homologous temperature is greater than 0.1 and less than 0.5 and the amount of material deposited per pulse train from each target material is greater than 0.1 monolayer and less than 100 monolayers, preferably less than 50 monolayers, less than 10 monolayers or less than 2 monolayers.
    • 4. 发明申请
    • ELECTROMAGNETIC SHIELD
    • 电磁屏蔽
    • US20160289816A1
    • 2016-10-06
    • US14778503
    • 2014-03-20
    • NORITAKE CO., LIMITEDNORITAKE ITRON CORPORATION
    • Hitoshi TSUJITadami MAEDAIsamu KANDA
    • C23C14/18C23C14/00C23C14/58H05K9/00C23C14/24
    • C23C14/185C23C14/0036C23C14/06C23C14/0688C23C14/24C23C14/34C23C14/5873H05K9/0084H05K9/0094H05K9/0096
    • There is provided an inexpensive electromagnetic shield that can achieve exceptional shielding and display visibility characteristics, and provide high environmental resistance as necessary. In an electromagnetic shield (1), an intermediate layer (3) is formed on a glass substrate (2) comprising soda lime glass, an electroconductive layer (4) of Al is formed thereon, and openings (5) are formed by wet etching on the intermediate layer (3) and the electroconductive layer (4) after these layers have been formed by sputtering or vacuum deposition. Furthermore, an ITO layer (6) is formed on the entire glass surface including the intermediate layer (3) and the electroconductive layer (4) after the openings (5) are formed. In this configuration, the intermediate layer (3) comprises a mixture of at least one metal selected from chromium, molybdenum, and tungsten, and at least one oxide selected from oxides of silicon, oxides of aluminum, and oxides of titanium.
    • 提供了一种廉价的电磁屏蔽,可以实现卓越的屏蔽和显示可视性,并根据需要提供高耐环境性。 在电磁屏蔽(1)中,在包括钠钙玻璃的玻璃基板(2)上形成中间层(3),在其上形成有Al的导电层(4),并且通过湿蚀刻形成开口(5) 在通过溅射或真空沉积形成这些层之后,在中间层(3)和导电层(4)上。 此外,在形成开口(5)之后,在包括中间层(3)和导电层(4)的整个玻璃表面上形成ITO层(6)。 在该构造中,中间层(3)包含选自铬,钼和钨中的至少一种金属和选自硅氧化物,铝的氧化物和钛的氧化物的至少一种氧化物的混合物。