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    • 1. 发明授权
    • Electro chemical deposition and replenishment apparatus
    • 电化学沉积和补充装置
    • US09005409B2
    • 2015-04-14
    • US13445457
    • 2012-04-12
    • David GuarnacciaArthur KeiglerDemetrius PapapanayiotouJohannes Chiu
    • David GuarnacciaArthur KeiglerDemetrius PapapanayiotouJohannes Chiu
    • C25D17/02C25D21/22C25D17/00C25D7/12
    • C25D21/22C25D7/123C25D17/001C25D17/002
    • An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment is removably coupled to the frame and containing an anolyte and having an anode facing the surface of the substrate, the anode fluid compartment further having a ion exchange membrane disposed between the anode and the surface of the substrate, the anode fluid compartment removable from the frame as a unit with the ion exchange membrane and the anode. The holder, the anode and the membrane are arranged in the frame so that ions from the anode pass through the ion exchange membrane into and primarily replenish ions in the process electrolyte depleted by ion deposition onto the surface of the substrate.
    • 一种适于将金属沉积在基底表面上的电化学沉积装置,该装置具有构造成保持工艺电解质的框架。 衬底保持器可移除地联接到框架,衬底保持器将衬底支撑在处理电解质中。 阳极流体隔室可拆卸地联接到框架并且包含阳极电解液并且具有面向基底表面的阳极,阳极流体隔室还具有设置在阳极和基底表面之间的离子交换膜,阳极流体隔室 作为与离子交换膜和阳极的单元从框架中移除。 保持器,阳极和膜被布置在框架中,使得来自阳极的离子通过离子交换膜进入并且主要补充通过离子沉积耗尽的工艺电解质中的离子到衬底的表面上。
    • 2. 发明申请
    • ELECTRO CHEMICAL DEPOSITION AND REPLENISHMENT APPARATUS
    • 电化学沉积和补充装置
    • US20120298502A1
    • 2012-11-29
    • US13445217
    • 2012-04-12
    • Demetrius PapapanayiotouArthur KeiglerDavid GuarnacciaJonathan HanderJohannes Chiu
    • Demetrius PapapanayiotouArthur KeiglerDavid GuarnacciaJonathan HanderJohannes Chiu
    • C25B15/08
    • C25D21/22C25D17/001C25D17/002C25D17/06C25D21/10
    • A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment having a second cathode for immersion in a secondary catholyte, and having a second ion exchange membrane being a monovalent selective membrane separating the secondary catholyte from the process electrolyte.
    • 一种适用于在具有第一阳极和第一阴极的基板电化学沉积设备中补充处理电解质中的离子的过程电解质补充模块,所述补充模块具有第二阳极。 处理电解质再循环隔室设置在框架中,其被构造成使得处理电解质在补充模块和沉积设备之间循环。 阳极室耦合到具有第二阳极(即可溶性阳极)的工艺电解质再循环室,用于浸渍在次级阳极液中,并且具有第一离子交换膜是将次级阳极液与工艺电解质分离的阳离子构件。 阴极室设置在耦合到处理电解质再循环隔间的框架中,该隔室具有用于浸入次级阴极电解液中的第二阴极,并且具有第二离子交换膜是将次级阴极电解液与工艺电解质分开的一价选择膜。
    • 3. 发明申请
    • Device and Method for Removing Foreign Matter from Process Solutions
    • 从工艺解决方案中去除外来物质的装置和方法
    • US20070256940A1
    • 2007-11-08
    • US11659589
    • 2005-08-08
    • Alexander SchifferReinhard Schwarz
    • Alexander SchifferReinhard Schwarz
    • C02F1/461B01D17/06B01D35/06
    • C25D21/22C02F1/46C02F1/46104C02F9/00C02F2001/425C02F2101/20C02F2201/46115C25C7/00
    • The invention relates to a device for removing foreign matter from process solutions. Said device comprises an electrolytic system having at least one cell divided up by at least two current-carrying dividing walls which define at least one connecting chamber, and at least one anode and one cathode compartment. An auxiliary cycle (51) is guided through the connecting compartment (5), a cation exchanger (8) being disposed therein. The invention also relates to a method for removing foreign matter form process solutions, whereby the process solution (1*) is supplied to an anode compartment (2) of an inventive device, a voltage is supplied to the electrodes (3, 9) of the electrolytic system, solution is taken from the at least one connecting compartment (5) and is applied to a strongly acid H+ cation exchanger (8) and the solution running off from the cation exchanger is supplied to at least one connecting compartment (5). The invention also relates to a method for regenerating a cation exchanger whereby first cations bound by the cation exchanger (8) are removed by treatment with anionic complexing agents and the cation exchanger (8) is then readjusted to the H+ charged state by adding a regenerant acid.
    • 本发明涉及一种用于从处理液中除去异物的装置。 所述装置包括具有至少一个细胞的电解系统,所述至少一个细胞由限定至少一个连接室的至少两个载流分隔壁以及至少一个阳极和一个阴极隔室分开。 辅助循环(51)被引导通过连接室(5),阳离子交换器(8)设置在其中。 本发明还涉及一种用于去除异物形成工艺溶液的方法,由此将工艺溶液(1 *)供应到本发明装置的阳极室(2),电压被提供给电极(3,9)的电极 电解体系溶液从至少一个连接室(5)取出,并被施加到强酸H +阳离子交换器(8)上,将从阳离子交换器流出的溶液供给到 至少一个连接隔间(5)。 本发明还涉及一种用于再生阳离子交换剂的方法,其中通过用阴离子络合剂处理除去由阳离子交换剂(8)结合的第一阳离子,然后将阳离子交换剂(8)重新调整至H + SUP>充电状态。
    • 7. 发明申请
    • Method and system for regenerating of plating baths
    • 电镀浴再生方法及系统
    • US20020153254A1
    • 2002-10-24
    • US10137548
    • 2002-05-02
    • Mykrolis Corporation
    • Brett Matthew BelongiaZhen Wu LinJohn E. PillionJieh-Hwa Shyu
    • C25D021/18C25B015/00
    • C25D21/18C25D21/22Y10S210/918
    • The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.
    • 本发明提供一种用于从镀液中选择性地除去一种或多种有机和无机以及还优选一种或多种无机污染物的系统和方法。 更具体地说,本发明的方法涉及与化学氧化剂组合使用能量源,单独或与催化剂结合使氧化电镀槽中的有机污染物的水平达到使电镀浴能够在 适当的化学调整。 氧化处理方法可以是在单程中进行的连续方法或分批方法。 如果需要,残留的有机物和浴中的氯离子通过化学吸附或物理吸附处理从溶液中除去。 通过选择性离子交换树脂或电渗析从电镀浴中除去无机污染物,同时通过过滤除去颗粒和悬浮胶体颗粒,然后再处理处理后的镀液。
    • 8. 发明授权
    • Method and device for regenerating tin-plating solutions
    • 镀锡溶液再生方法及装置
    • US6120673A
    • 2000-09-19
    • US74725
    • 1998-05-07
    • Ulrich ReiterWerner HarnischmacherKlaus FischwasserHans-Wilhelm LieberRalph BlittersdorfAnnette Heuss
    • Ulrich ReiterWerner HarnischmacherKlaus FischwasserHans-Wilhelm LieberRalph BlittersdorfAnnette Heuss
    • B01D61/44C02F1/461C02F1/469C23C18/16C25D21/22C25C1/14
    • C23C18/1617C25D21/22Y10S204/13
    • The invention relates to a method and a device for regenerating exhausted tin-plating solutions which contain tin and copper ions, free complexing agent and complexing agent bound to the copper ions, as well as expended and unexpended reducing agent. By means of a suitable rinsing technique, the rinse water of the tin-plating process is concentrated to a 10 to 15 percent dilution of the process solution. The regenerating solution thus produced is fed to an electrolytic cell. The electrolytic cell comprises a cathode chamber, a middle chamber and an anode chamber. The cathode chamber is separated from the middle chamber by an anion-exchange membrane and the anode chamber is separated from the middle chamber by a cation-exchange membrane. The regenerating solution is initially provided in the cathode chamber. Here, the interfering copper component is cathodically deposited. After an appropriate residence time, the regenerating solution, depleted of copper, is transferred by pumping into the middle chamber where tin enrichment is effected by tin ions diffused from the anode chamber through the cation-exchange membrane. The regenerated solution is subsequently fed back into the tin-plating process.
    • 本发明涉及一种用于再生含有锡和铜离子的排出的镀锡溶液的方法和装置,与铜离子结合的游离络合剂和络合剂,以及消耗和未用的还原剂。 通过合适的冲洗技术,将镀锡工艺的冲洗水浓缩至工艺溶液的10至15%稀释度。 将这样制作的再生溶液送入电解槽。 电解槽包括阴极室,中间室和阳极室。 阴极室通过阴离子交换膜与中间室分离,阳极室通过阳离子交换膜与中间室分离。 再生溶液最初设置在阴极室中。 这里,干扰铜组分被阴极沉积。 在适当的停留时间之后,通过泵送进入中间室来转移耗尽铜的再生溶液,其中通过阳离子交换膜从阳极室扩散的锡离子进行锡富集。 再生的溶液随后被反馈到镀锡过程中。