专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20180274116A1 PLATING APPARATUS AND METHOD FOR DETERMINING PLATING BATH CONFIGURATION 审中-公开
公开(公告)号：US20180274116A1
公开(公告)日：2018-09-27
申请号：US15925490
申请日：2018-03-19
申请人： EBARA CORPORATION
发明人： Mitsuhiro SHAMOTO , Masashi SHIMOYAMA
IPC分类号： C25D3/38 , C25D5/18 , C25D17/00 , C25D17/12 , C25D7/12 , H05K3/24 , H01L21/288 , H01L21/768 , C25D21/10 , C25D21/08
CPC分类号： C25D3/38 , C25D5/18 , C25D7/00 , C25D7/123 , C25D17/001 , C25D17/005 , C25D17/008 , C25D17/06 , C25D17/12 , C25D21/08 , C25D21/10 , C25D21/12 , H01L21/2885 , H01L21/76843 , H01L21/76873 , H05K3/187 , H05K3/241 , H05K2203/1518
摘要： There is provided a plating apparatus for plating a rectangular substrate using a substrate holder holding the rectangular substrate. The plating apparatus comprises a plating bath configured to store the substrate holder holding the rectangular substrate, and an anode disposed inside the plating bath so as to face the substrate holder. The substrate holder includes an electrical contact configured to feed two opposite sides of the rectangular substrate. The rectangular substrate and the anode are placed inside the plating bath so as to satisfy the relationship of 0.59×L1−43.5 mm≤D1≤0.58×L1−19.8 mm, where L1 is the shortest distance between a substrate center of the rectangular substrate and the electrical contact, and D1 is the distance between the rectangular substrate and the anode.

2. 发明授权

US10001754B2 Support for treating micromechanical components 有权
公开(公告)号：US10001754B2
公开(公告)日：2018-06-19
申请号：US14782624
申请日：2014-03-26
申请人： Universo S.A.
发明人： Gerard Rossier
IPC分类号： B25B1/20 , G04D1/06 , G04D3/00 , G04D3/08 , C25D17/06 , C25D17/00 , C25D17/08 , C25D21/10
CPC分类号： G04D1/06 , C25D17/005 , C25D17/06 , C25D17/08 , C25D21/10 , G04D3/0069 , G04D3/08
摘要： A support for cleaning and/or galvanic deposition including a carrier structure including attachment points for watch hands each provided with a hole. The attachment points include at least one rigid pin, if necessary a conductive pin, onto which the hands are threaded via their hole and held apart from each other by a spacer.

3. 发明申请

US20180163320A1 METHOD FOR TREATING SURFACES OF GEOMETRICALLY COMPLEX PARTS, PART-CARRYING DEVICE AND TREATMENT DEVICE 审中-公开
公开(公告)号：US20180163320A1
公开(公告)日：2018-06-14
申请号：US15736365
申请日：2016-06-17
申请人： Maxence RENAUD
发明人： Maxence RENAUD
IPC分类号： C25D17/08 , C25D21/10
CPC分类号： C25D17/08 , C25D11/005 , C25D21/10
摘要： A part-carrier for electrolytically treating geometrically complex parts includes a reinforcement vertically supporting supports that are movable in rotation and designed to carry the parts to be treated, and a control member which, when activated, pivots the movable supports in sequence to either side of a neutral initial position. Application to electroplating.

4. 发明申请

US20170342590A1 MODULATION OF APPLIED CURRENT DURING SEALED ROTATIONAL ELECTROPLATING 审中-公开
公开(公告)号：US20170342590A1
公开(公告)日：2017-11-30
申请号：US15413252
申请日：2017-01-23
申请人： Lam Research Corporation
发明人： Kari Thorkelsson , Jacob Lee Hiester , Yu Ding , Bryan L. Buckalew
IPC分类号： C25D21/12 , C25D7/12 , C25D5/08 , C25D5/18 , C25D17/06 , C25D17/00
CPC分类号： C25D21/12 , C25D5/08 , C25D5/18 , C25D17/001 , C25D17/004 , C25D17/06 , C25D21/10
摘要： The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, the apparatus may switch between a sealed state and an unsealed state, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal. A higher level of applied current or applied voltage may be provided to the substrate when the apparatus is in the sealed state compared to the unsealed state.

5. 发明授权

US09809898B2 Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems 有权
公开(公告)号：US09809898B2
公开(公告)日：2017-11-07
申请号：US13928141
申请日：2013-06-26
申请人： Novellus Systems, Inc.
发明人： Daniel Mark Dinneen , James E. Duncan
IPC分类号： G06K9/00 , G01N21/00 , B23K26/00 , G01R31/26 , H01L21/44 , H04N9/47 , C25D17/00 , H01L21/67 , C25D21/10 , C25D21/12 , H01L21/02 , H01L21/768
CPC分类号： C25D17/001 , C25D21/10 , C25D21/12 , H01L21/02087 , H01L21/0209 , H01L21/67253 , H01L21/76877
摘要： Disclosed herein are electroplating systems for forming a layer of metal on a wafer which include an electroplating module and a wafer edge imaging system. The electroplating module may include a cell for containing an anode and an electroplating solution during electroplating, and a wafer holder for holding the wafer in the electroplating solution and rotating the wafer during electroplating. The wafer edge imaging system may include a wafer holder for holding and rotating the wafer through different azimuthal orientations, a camera oriented for obtaining multiple azimuthally separated images of a process edge of the wafer while it is held and rotated (the process edge corresponding to the outer edge of the layer of metal formed on the wafer), and image analysis logic for determining an edge exclusion distance, wherein the edge exclusion distance is a distance between the wafer's edge and the process edge.

6. 发明申请

US20170274478A1 SOLDER-COATED BALL AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：US20170274478A1
公开(公告)日：2017-09-28
申请号：US15503939
申请日：2015-07-16
申请人： HITACHI METALS, LTD.
发明人： Tsutomu NOZAKA , Hidehito MORI
IPC分类号： B23K35/02 , B23K35/26 , B23K1/00 , B22F9/24 , H01L23/00 , B22F1/02 , C23C18/16 , C23C18/38 , C25D3/60 , C25D5/40 , B23K35/30 , B22F1/00
CPC分类号： B23K35/0244 , B22F1/0003 , B22F1/0048 , B22F1/025 , B22F9/24 , B22F2009/245 , B22F2301/10 , B22F2301/15 , B22F2301/30 , B22F2303/30 , B22F2998/10 , B23K1/0016 , B23K35/262 , B23K35/302 , B23K35/3033 , B23K2101/42 , C22C19/03 , C23C18/1637 , C23C18/1653 , C23C18/1844 , C23C18/38 , C25D3/60 , C25D5/22 , C25D5/40 , C25D21/10 , H01L24/11 , H01L24/13 , H01L2224/11462 , H01L2224/11464 , H01L2224/13014 , H01L2224/13083 , H01L2224/13101 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357
摘要： A solder-coated ball (10A) includes a spherical core containing Ni and P; and a solder layer (12) formed to coat the core (11). A solder-coated ball (10B) further includes a Cu plating layer (13) formed between the core (11) and the solder layer (12). A solder-coated ball (10C) further includes an Ni plating layer (14) formed between the Cu plating layer (13) and the solder layer (12).

7. 发明申请

US20170241033A1 SURFACE ELECTROLYTIC TREATMENT APPARATUS FOR GARMENT ACCESSORY PART 审中-公开
公开(公告)号：US20170241033A1
公开(公告)日：2017-08-24
申请号：US15588841
申请日：2017-05-08
申请人： YKK Corporation
发明人： Kenji Hasegawa
IPC分类号： C25D5/22 , A44B1/02 , A44B1/06 , A44B17/00 , C25D21/10 , A44B19/42
CPC分类号： C25D5/22 , C25D3/12 , C25D3/30 , C25D3/38 , C25D17/00 , C25D21/10
摘要： A method for subjecting garment accessories to a surface electrolytic treatment provides various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory and provide a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory.

8. 发明申请

US20170191180A1 SYSTEMS AND METHODS FOR SHIELDING FEATURES OF A WORKPIECE DURING ELECTROCHEMICAL DEPOSITION 审中-公开
公开(公告)号：US20170191180A1
公开(公告)日：2017-07-06
申请号：US15400586
申请日：2017-01-06
申请人： APPLIED Materials, Inc.
发明人： Eric J. Bergman , Jeffrey J. Dennison , Marvin L. Bernt
IPC分类号： C25D17/00 , C25D21/10 , C25D5/08 , C25D17/06 , C25D5/02 , C25D5/04
CPC分类号： C25D17/002 , C25D5/022 , C25D5/04 , C25D17/005 , C25D17/008 , C25D21/10
摘要： In one embodiment, an electroplating cell for depositing a metal onto a surface of a substrate includes an electroplating chamber configured to receive an electrolyte containing metal ions and a substrate having a surface disposed to contact the electrolyte, wherein the surface of the substrate is configured to serve as a cathode and wherein the surface of the substrate includes an anomaly region at or near the outer perimeter of the surface of the substrate, an anode disposed in the electrolyte chamber, a shielding device disposed between the cathode and the anode to shield the anomaly section, an oscillator configured to impart a relative oscillation between the cathode and the shielding device, and a power source to cause an electric field between the anode and the cathode.

9. 发明申请

US20170025672A1 LITHIUM-ION BATTERIES WITH NANOSTRUCTURED ELECTRODES AND ASSOCIATED METHODS OF MAKING 审中-公开
标题翻译：具有纳米结构电极的锂离子电池和相关的制造方法
公开(公告)号：US20170025672A1
公开(公告)日：2017-01-26
申请号：US15287367
申请日：2016-10-06
申请人： WASHINGTON STATE UNIVERSITY
发明人： M. Grant Norton , Uttara Sahaym , Sarah Miller
IPC分类号： H01M4/04 , C25D3/30 , H01M10/0525 , C25D21/10 , C25D7/06 , C25D5/34 , C25D21/02
CPC分类号： H01M4/0452 , C25D3/30 , C25D5/18 , C25D5/34 , C25D7/0614 , C25D21/02 , C25D21/10 , C25D21/12 , C25D21/14 , H01M4/0461 , H01M4/134 , H01M4/1395 , H01M4/387 , H01M4/661 , H01M4/75 , H01M4/80 , H01M10/0525 , H01M2004/027 , Y02E60/122
摘要： Several embodiments related to lithium-ion batteries having electrodes with nanostructures, compositions of such nanostructures, and associated methods of making such electrodes are disclosed herein. In one embodiment, a method for producing an anode suitable for a lithium-ion battery comprising preparing a surface of a substrate material and forming a plurality of conductive nanostructures on the surface of the substrate material via electrodeposition without using a template.
摘要翻译：本文公开了与具有纳米结构电极的锂离子电池，这种纳米结构的组成以及制造这种电极的相关方法相关的几个实施方案。在一个实施方案中，一种用于生产适用于锂离子电池的阳极的方法，包括通过电沉积而不使用模板来制备衬底材料的表面并在衬底材料的表面上形成多个导电纳米结构。

10. 发明授权

US09530653B2 High speed electroplating metallic conductors 有权
标题翻译：高速电镀金属导体
公开(公告)号：US09530653B2
公开(公告)日：2016-12-27
申请号：US15002342
申请日：2016-01-20
申请人： Uri Cohen
发明人： Uri Cohen
IPC分类号： C25D5/08 , H01L21/77 , H01L21/288 , C25D5/02 , H01L21/768 , H05K3/42 , C25D7/12 , C25D21/10 , H01L23/522 , H05K3/06 , H05K3/10 , H01L23/48 , H01L21/321 , H01L23/532
CPC分类号： C25D5/026 , C25D5/022 , C25D5/028 , C25D5/08 , C25D7/123 , C25D21/10 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76843 , H01L21/76873 , H01L21/76877 , H01L21/76879 , H01L21/7688 , H01L23/481 , H01L23/5226 , H01L23/53238 , H01L2924/0002 , H05K3/06 , H05K3/107 , H05K3/423 , H01L2924/00
摘要： One embodiment is a method for producing void-free electroplated metallic conductors inside openings by electrochemical deposition (ECD), said method including steps of: forming at least one opening in a substrate, said at least one opening having an aspect ratio in a range from 8:1 to 28:1; forming at least one barrier layer over the sidewalls of the at least one opening; depositing at least one seed layer over the at least one barrier layer; immersing the substrate in an electrolyte contained in an ECD cell, the ECD cell including at least one anode and a cathode, wherein the electrolyte includes plating metallic ions and at least one inhibitor additive; providing agitation of the electrolyte across the surface of the substrate by moving multiple non-contacting wiping blades relative to the substrate, wherein the agitation facilitates a limiting current density larger by at least an order of magnitude than a limiting current density without the agitation; and applying an average electroplating current density on the substrate, wherein the agitation, the concentrations of the metallic ions and the inhibitor additive, and the average electroplating current density are such as to produce void-free, electroplated metallic filling inside the at least one opening.
摘要翻译：一个实施方案是一种通过电化学沉积（ECD）在开口内产生无空隙的电镀金属导体的方法，所述方法包括以下步骤：在基底中形成至少一个开口，所述至少一个开口的纵横比范围从 8：1到28：1; 在所述至少一个开口的侧壁上形成至少一个阻挡层; 在所述至少一个阻挡层上沉积至少一个种子层; 将所述衬底浸入包含在ECD电池中的电解质中，所述ECD电池包括至少一个阳极和阴极，其中所述电解质包括电镀金属离子和至少一种抑制剂添加剂; 通过相对于基底移动多个非接触式擦拭刮板来提供电解质跨过衬底的表面的搅动，其中搅拌有助于极限电流密度比不受搅拌的极限电流密度大至少一个数量级; 以及在所述衬底上施加平均电镀电流密度，其中所述搅拌，所述金属离子和所述抑制剂添加剂的浓度以及所述平均电镀电流密度在所述至少一个开口内部产生无空隙的电镀金属填充物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式