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    • 2. 发明申请
    • Airflow Heatsink For Led Devices
    • 用于LED设备的气流散热器
    • US20160245493A1
    • 2016-08-25
    • US14025466
    • 2013-09-12
    • Brian EustaceMichael DavisChristian Jensen
    • Brian EustaceMichael DavisChristian Jensen
    • F21V29/00
    • F21V29/81F21V29/673F21Y2115/10
    • Disclosed is an LED lighting system with improved airflow and heat dissipation qualities. In one embodiment, the system comprises a heatsink mounted to an LED chip, and a fan assembly blowing air into the heatsink. The fan assembly includes a plurality of fans, the wind tunnels of the plurality of fans providing greater airflow in the center of the heatsink than a conventional one-fan configuration. In a further aspect, the disclosed system comprises a light head assembly in which cool air enters the light head assembly via the bottom and rear, and hot air is drawn out of the top of the light head assembly. An airflow path is created by selectively placing fans, baffles, walls, and openings in the lighting assembly.
    • 公开了具有改善的气流和散热特性的LED照明系统。 在一个实施例中,系统包括安装到LED芯片的散热器和将空气吹入散热器的风扇组件。 风扇组件包括多个风扇,多个风扇的风洞在散热器的中心提供比常规单风扇配置更大的气流。 在另一方面,所公开的系统包括光头组件,其中冷空气经由底部和后部进入光头组件,并且热空气从光头组件的顶部被拉出。 通过选择性地将风扇,挡板,墙壁和开口放置在照明组件中来创建气流路径。
    • 3. 发明申请
    • MODULAR HEAT SINK
    • 模块式散热器
    • US20160153647A1
    • 2016-06-02
    • US14900364
    • 2014-06-10
    • KONINKLIJKE PHILIPS N.V.
    • Lihua LINHuaizhou LIAO
    • F21V29/71F21V29/83F21V29/81
    • F21V29/71F21V17/002F21V29/81F21V29/83F21Y2115/10
    • A modular heat dissipation assembly (2) used for a light emitting device (100) is presented. It comprises a base (22), which comprises a first number of arrangements (23), for thermally coupling to a light source (31) of the light emitting device (100); and a second number of heat conducting elements (21) which are attached to the base (22) via the arrangements (23), and the second number varies from zero to a maximum equal to the first number, so that a thermal capacity of the modular heat dissipation assembly matches a predetermined thermal load of the light emitting device. In one aspect, configurations to maintain a chimney effect with the modular heat dissipation assembly are presented. A luminaire comprising such a heat dissipation assembly and the manufacturing method for the heat dissipation assembly are also presented.
    • 提出了一种用于发光器件(100)的模块化散热组件(2)。 它包括一个底座(22),它包括第一数量的装置(23),用于热耦合到发光装置(100)的光源(31); 以及第二数量的热传导元件(21),其经由所述布置(23)附接到所述基座(22),并且所述第二数量从零变为等于所述第一数量的最大值,使得所述热容量 模块化散热组件匹配发光器件的预定热负荷。 在一个方面,提出了使用模块化散热组件来维持烟囱效应的构造。 还提供了一种包括这种散热组件的灯具和用于散热组件的制造方法。
    • 6. 发明申请
    • EXTERNAL CELLULAR HEAT SINK STRUCTURE
    • 外部细胞热结构
    • US20130032322A1
    • 2013-02-07
    • US13423318
    • 2012-03-19
    • Takeho HSU
    • Takeho HSU
    • F28F7/00
    • F28F3/02F21V29/74F21V29/81F21W2131/103F21Y2115/10
    • An external cellular heat sink structure includes a base and a heat dissipating body integrally formed on the base. The heat dissipating body includes a plurality of hollow cellular units, wherein the neighboring cellular units are connected together, and each cellular unit has at least two openings for communicating the connected cellular units with each other. Thus, the cellular unit can provide the larger dissipation area, and each opening can let the gas pass and disperse the gas so that the time and possibility for the gas to contact the heat dissipating surface are lengthened and increased, respectively, and the heat dissipation efficiency is increased.
    • 外部细胞散热器结构包括基部和在基部上整体形成的散热体。 散热体包括多个中空细胞单元,其中相邻的细胞单元连接在一起,并且每个蜂窝单元具有至少两个用于将连接的蜂窝单元彼此通信的开口。 因此,蜂窝单元可以提供更大的耗散面积,并且每个开口可以使气体通过并分散气体,使得气体接触散热表面的时间和可能性分别被延长和增加,并且散热 效率提高。
    • 10. 发明申请
    • REAR-LOADED LIGHT EMITTING DIODE MODULE FOR AUTOMOTIVE REAR COMBINATION LAMPS
    • 用于汽车后组合灯的后负载发光二极管模块
    • US20090296416A1
    • 2009-12-03
    • US12259725
    • 2008-10-28
    • Hong LuoZhaoHuan Liu
    • Hong LuoZhaoHuan Liu
    • B60Q1/00
    • F21V29/763F21K9/00F21S41/147F21S41/19F21S41/192F21S41/334F21S43/14F21S43/19F21S43/30F21S45/47F21S48/215F21V7/0008F21V29/004F21V29/74F21V29/75F21V29/80F21V29/81F21V29/89F21Y2115/10
    • A rear-loading LED module for a rear combination lamp is disclosed. One or more LEDs are mounted on a printed circuit board that mechanically holds them at the focus of a faceted, parabolic reflector. Light from the LEDs diverges transversely and horizontally, and is collimated by the reflector, and the reflected collimated light is directed in a generally longitudinal direction out of the rear combination lamp, toward the viewer. The LED module itself is generally longitudinally oriented, and is insertable longitudinally into the interior of the reflector from a hole at the vertex of the reflector. The printed circuit board, an optional thermal pad adjacent to the printed circuit board, and a thermally conductive layer adjacent to the optional thermal pad are all generally planar layers, are all generally parallel to each other, and may optionally all have the same footprint. Together, the printed circuit board, the thermal pad and the thermally conductive layer may all form a generally planar ledge.
    • 公开了一种用于后组合灯的后装LED组件。 一个或多个LED安装在印刷电路板上,机械地将它们保持在刻面的抛物线反射器的焦点处。 来自LED的光横向和横向发散,并被反射器准直,并且反射的准直光沿大致纵向方向被引导出后组合灯朝向观察者。 LED模块本身通常纵向定向,并且可从反射器顶点处的孔纵向插入到反射器的内部。 印刷电路板,与印刷电路板相邻的可选热垫,以及与可选的热垫相邻的导热层都通常是平面层,它们大体上彼此平行,并且可以任选地都具有相同的覆盖。 印刷电路板,热垫和导热层可以一起形成大致平坦的凸缘。