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    • 10. 发明申请
    • SYSTEM FOR OVER-MOLDED PCB SEALING RING FOR TEC HEAT EXCHANGERS
    • 用于TEC热交换器的模制PCB密封圈系统
    • US20150233592A1
    • 2015-08-20
    • US14624469
    • 2015-02-17
    • Marlow Industries, Inc.
    • Michael GiraudJeremy Mishler
    • F24F5/00F25B21/02
    • F24F5/0042A47C21/044A47C21/048F24F2013/221F25B21/02
    • A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies.
    • 提供了一种基于热电的空调系统。 该系统包括至少第一供应空气通道和设置在壳体中的单独的第二供应空气通道。 该系统还包括第一热电冷却器(TEC)组件,其形成第一供应空气通道的至少一部分并且被配置为独立地调节第一供应空气通道内的空气。 该系统还包括第二TEC组件,其形成第二供应空气通道的至少一部分并且被配置为独立地调节第二供应空气通道内的空气。 该系统包括用于第一和第二TEC组件中的每一个的印刷电路板(PCB),其中每个PCS构造成在第一TEC和第二TEC之间提供第一和第二TEC组件中的每一个的电连接。 该系统还包括一个模制基底,其被配置为使模制第一和第二TEC组件的第一和第二TECs。