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1. 发明授权

US09759623B2 Pressure measuring cell 有权
公开(公告)号：US09759623B2
公开(公告)日：2017-09-12
申请号：US14647527
申请日：2013-10-29
申请人： ENDRESS+HAUSER GMBH+CO. KG
发明人： Ulfert Drewes , Nils Ponath , Andreas Rossberg , Elke Schmidt
IPC分类号： G01L19/06 , G01L9/00
CPC分类号： G01L19/06 , G01L9/0044 , G01L19/0618
摘要： A pressure measuring cell includes an elastic measuring membrane which is contactable with a first pressure on a first side and with a second pressure on a second side facing away from the first side. The measuring membrane is deflectable as a function of a difference between the first pressure and the second pressure, wherein the measuring membrane pressure-tightly isolates a first volume, which is facing the first side of the measuring membrane, from a second volume, which is facing the second side of the measuring membrane. The pressure measuring cell further includes a transducer for transducing the pressure dependent deflection of the measuring membrane into an electrical or optical signal. The measuring membrane has in the equilibrium state of the measuring membrane compressive stresses at least at the surface of the measuring membrane at least in a radial edge region, in which in the deflected state of the measuring membrane under pressure loading tensile stress maxima occur.

2. 发明申请

US20170089788A1 MANUFACTURING CATHETER SENSORS 审中-公开
公开(公告)号：US20170089788A1
公开(公告)日：2017-03-30
申请号：US15227370
申请日：2016-08-03
申请人： Silicon Microstructures, Inc.
发明人： Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
IPC分类号： G01L9/00
CPC分类号： G01L19/14 , G01L9/0044 , G01L9/0057 , G01L19/0069
摘要： Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.

3. 发明申请

US20160377496A1 PRESSURE SENSOR DEVICE WITH A MEMS PIEZORESISTIVE ELEMENT ATTACHED TO AN IN-CIRCUIT CERAMIC BOARD 审中-公开
标题翻译：具有连接到电路板陶瓷板的MEMS PIEZORESISTIVE元件的压力传感器装置
公开(公告)号：US20160377496A1
公开(公告)日：2016-12-29
申请号：US15181975
申请日：2016-06-14
申请人： Continental Automotive Systems, Inc.
发明人： Jen-Huang Albert Chiou , Benjamin C. Lin , Eric Matthew Vine
IPC分类号： G01L9/00 , G01B7/16
CPC分类号： G01L9/008 , G01B7/16 , G01L9/0044 , G01L9/0055 , G01L19/0007 , G01L19/0076 , G01L19/04 , G01L19/148 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.
摘要翻译：具有附接到在线陶瓷板的MEMS压阻式压力感测元件的压力传感器装置包括通过将多层陶瓷烧结在一起形成的单片陶瓷电路板。电路板的底部具有空腔，其形成有从陶瓷电路板形成的材料层。作为层之一的陶瓷膜片具有周边边缘。隔膜的厚度使得由边缘限定的隔膜响应于施加的压力而偏转。附着在陶瓷电路板的顶侧的MEMS压阻式压力感测元件产生响应于陶瓷膜片偏转的输出信号。携带加压流体（液体或气体）的导管可以使用陶瓷电路板的底部上的密封件直接附接到陶瓷电路板，陶瓷电路板通过底部包围空腔的开口。

4. 发明申请

US20160313199A1 Pressure Sensor 审中-公开
标题翻译：压力传感器
公开(公告)号：US20160313199A1
公开(公告)日：2016-10-27
申请号：US15035838
申请日：2014-11-12
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Atsushi KAZAMA , Junji ONOZUKA , Hiroshi ONUKI , Miho TOBITA , Masayuki HIO
IPC分类号： G01L9/00
CPC分类号： G01L9/0055 , G01L9/0044 , G01L19/0038 , G01L19/0084 , G01L19/04
摘要： In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed. The pressure sensor is a pressure sensor obtained by arranging, on a diaphragm having a long side and a short side, a sensor chip in which four strain gauges having the same characteristic and constituting a bridge circuit are provided, the pressure sensor being for detecting, in the bridge circuit, voltage output that is in proportion to a pressure applied to the diaphragm, and the pressure sensor is configured as follows: the four strain gauges are arranged to be adjacent to one another in the vicinity of the center of the diaphragm so that two strain gauges are arranged along the short side and the other two strain gauges are arranged along the long side; and the diaphragm has a thin portion in a long-side direction seen from the sensor chip.
摘要翻译：在具有应变仪设置在隔膜上的结构的压力传感器中，抑制了由应变计的位置偏移引起的传感器特性的变化，并且抑制了响应于温度变化的传感器输出的变化。压力传感器是通过在具有长边和短边的隔膜上布置传感器芯片而获得的压力传感器，其中设置有具有相同特性并构成桥接电路的四个应变计，所述压力传感器用于检测，在桥式电路中，与施加到隔膜的压力成比例的电压输出，并且压力传感器的构造如下：四个应变片布置成在隔膜中心附近彼此相邻，两个应变计沿着短边排列，另外两个应变计沿长边排列; 并且隔膜在从传感器芯片观察的长边方向上具有薄的部分。

5. 发明申请

US20160257561A1 PRESSURE SENSOR HAVING A BOSSED DIAPHRAGM 审中-公开
标题翻译：压力传感器
公开(公告)号：US20160257561A1
公开(公告)日：2016-09-08
申请号：US15049314
申请日：2016-02-22
申请人： Honeywell International Inc.
发明人： Carl Stewart , Richard Davis , Gilberto Morales
IPC分类号： B81C1/00 , G01L9/00
CPC分类号： B81C1/00158 , B81B3/0021 , B81B3/007 , B81B2201/0264 , B81B2203/0127 , B81C2201/014 , B81C2201/0198 , B81C2203/0728 , G01L7/08 , G01L9/0042 , G01L9/0044 , G01L9/0047 , G01L9/0054 , G01L9/0055
摘要： A method includes forming a mask that defines a masked area and an unmasked area on a front side of a substrate, and implanting a buried layer corresponding to the unmasked area on the front side of the substrate. The method also includes forming an epitaxial layer having a back side on the front side of the substrate and on a front side of the buried layer, and creating an opening into a back side of the substrate up to a back side of the epitaxial layer and a back side of the one or portions of the buried layer.
摘要翻译：一种方法包括形成掩模，其在衬底的正面上限定掩蔽区域和未掩蔽区域，以及在衬底的正面上注入对应于未掩模区域的掩埋层。该方法还包括在衬底的正面和掩埋层的前侧上形成具有背面的外延层，并且在衬底的背面形成直到外延层的背面的开口，并且掩埋层的一个或多个部分的背面。

6. 发明申请

US20160252419A1 A METHOD FOR PREVENTING GASES AND FLUIDS TO PENETRATE A SURFACE OF AN OBJECT 审中-公开
标题翻译：用于防止气体和流体渗透物体表面的方法
公开(公告)号：US20160252419A1
公开(公告)日：2016-09-01
申请号：US15033037
申请日：2013-10-28
申请人： INFICON GMBH
发明人： Per BJORKMAN , Bjorgvin HJORVARSSON
IPC分类号： G01L19/06 , C23C16/455 , G01L7/08 , C23C14/14 , C23C22/02 , C23C8/06 , C23C14/02
CPC分类号： G01L19/0627 , C23C8/06 , C23C8/10 , C23C14/021 , C23C14/14 , C23C16/45525 , C23C22/02 , C23C28/323 , C23C28/325 , G01L7/082 , G01L9/0044
摘要： The present invention relates to a method for preventing gases and fluids to penetrate a surface of an object, comprising the steps of: depositing (S1) an amorphous metal (5) on a surface of an object (4); forming (S2) a continuous layer of the amorphous metal (5) on the surface of the object (4); binding (S3) the amorphous metal (5) to the surface of the object by chemical binding; and passivation (S4) of a surface of the amorphous metal (5) facing away from the surface of the object (4).
摘要翻译：本发明涉及一种防止气体和流体穿透物体表面的方法，包括以下步骤：在物体（4）的表面上沉积（S1）非晶态金属（5）; 在所述物体（4）的表面上形成（S2）所述非晶态金属（5）的连续层; 通过化学结合将非晶态金属（5）结合（S3）到物体的表面; 以及所述非晶金属（5）的表面远离所述物体（4）的表面的钝化（S4）。

7. 发明申请

US20150276533A1 Low Pressure Sensor and Flow Sensor 审中-公开
标题翻译：低压传感器和流量传感器
公开(公告)号：US20150276533A1
公开(公告)日：2015-10-01
申请号：US14719848
申请日：2015-05-22
申请人： Amphenol Thermometrics, Inc.
发明人： Nickolai S. Belov , Lihua Li , Kim Vu , Dinh Vu
IPC分类号： G01L9/06 , G01R33/09 , G01R33/07
CPC分类号： G01R33/09 , B81B3/001 , B81B3/0072 , B81B7/0061 , B81B2201/025 , G01L9/0042 , G01L9/0044 , G01L9/0047 , G01L19/0092 , G01L19/0618 , G01R33/07
摘要： A device/method for sensing a physical parameter, including a sensor die and a stress-sensitive circuit. The sensor die includes a semiconductor substrate and a cavity that creates an elastic element that bends in response to the physical parameter exerted on the sensor die. The elastic element includes at least at least one rigid island formed within the cavity, a thin area surrounding the at least one rigid island and having smaller thickness than the rigid island, and at least one stress concentrator at least partially formed in the thin area of the elastic element on the side of the substrate opposite the cavity. The stress-sensitive circuit includes at least one stress-sensitive component formed in the thin area of the elastic element. The at least one stress concentrator increases stress in the locations of the at least one stress-sensitive component resulting in an increase of the device sensitivity to the physical parameter.
摘要翻译：用于感测物理参数的装置/方法，包括传感器管芯和应力敏感电路。传感器管芯包括半导体衬底和空腔，其产生响应于施加在传感器管芯上的物理参数而弯曲的弹性元件。所述弹性元件包括形成在所述空腔内的至少一个刚性岛，围绕所述至少一个刚性岛的薄区域，并且具有比所述刚性岛更小的厚度，以及至少部分地形成在所述刚性岛的薄区域中的至少一个应力集中器衬底侧的弹性元件与空腔相对。应力敏感电路包括形成在弹性元件的薄区域中的至少一个应力敏感部件。所述至少一个应力集中器增加所述至少一个应力敏感部件的位置中的应力，导致对所述物理参数的装置灵敏度的增加。

8. 发明授权

US09040334B2 MEMS integrated pressure sensor devices and methods of forming same 有权
标题翻译： MEMS集成式压力传感器装置及其形成方法
公开(公告)号：US09040334B2
公开(公告)日：2015-05-26
申请号：US13894821
申请日：2013-05-15
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Chia-Hua Chu , Chun-Wen Cheng
IPC分类号： H01L21/00 , B81C1/00 , B81B3/00
CPC分类号： B81C1/00293 , B81B3/0021 , B81B7/0041 , B81B7/007 , B81B7/02 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0264 , B81C1/00134 , B81C1/00309 , B81C2201/013 , B81C2203/0118 , G01C19/56 , G01C19/5769 , G01L9/0044 , G01L19/0076 , G01L19/0092 , G01P15/00 , G01P15/0802 , G01P15/125
摘要： A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.
摘要翻译：方法实施例包括提供包括具有第一和第二部分的多晶硅层的微机电（MEMS）晶片。载体晶片结合到MEMS晶片的第一表面。粘合载体晶片产生第一腔。多晶硅层的第一部分的第一表面暴露于第一腔的压力水平。帽晶片结合到MEMS晶片的与MEMS晶片的第一表面相对的第二表面。接合盖晶片产生包括多晶硅层的第二部分和第三腔的第二腔。多晶硅层的第一部分的第二表面暴露于第三腔的压力水平。第一腔或第三腔暴露于周围环境。

9. 发明申请

US20140242740A1 MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND METHOD OF FABRICATION OF THE SAME 审中-公开
标题翻译：微型超微型PIEZORESISTIVE压力传感器及其制造方法
公开(公告)号：US20140242740A1
公开(公告)日：2014-08-28
申请号：US14187221
申请日：2014-02-22
申请人： Bin Qi
发明人： Bin Qi
IPC分类号： G01L9/00
CPC分类号： B81B3/0027 , B81B2203/0127 , G01L9/0042 , G01L9/0044 , G01L9/0045 , G01L9/0048 , G01L9/0052 , G01L9/0054 , G01L9/0055 , H01L21/764 , H01L28/20
摘要： A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes.
摘要翻译：提供了一种在硅晶片上制造一个或多个超微型压阻式压力传感器的方法。压阻式压力传感器的隔膜通过熔接形成。压阻式压力传感器可以通过硅沉积，光刻和蚀刻工艺形成。

10. 发明授权

US08763467B2 Pressure sensor device 有权
标题翻译：压力传感器装置
公开(公告)号：US08763467B2
公开(公告)日：2014-07-01
申请号：US13419543
申请日：2012-03-14
申请人： Takuya Ishihara , Hidefumi Harada , Masashi Sekine
发明人： Takuya Ishihara , Hidefumi Harada , Masashi Sekine
IPC分类号： G01L9/12 , G01L9/00
CPC分类号： G01L9/12 , G01L9/0044 , G01L9/0072 , G01L19/0084 , G01L19/0618 , G01L19/0636
摘要： A pressure sensor device has a sensor detecting pressure of a gas that is introduced from the outside, a heater for heating the sensor, a package containing the sensor and the heater, a circuit portion producing an output signal that represents the pressure of the gas based on the detection output detected by the sensor, and a circuit containing portion containing the circuit portion. The package and the circuit containing portion are structured from separate cases and are disposed separately with a connecting structural member interposed therebetween. The connecting structural member 90 includes electrode lead pins connecting between the sensor within the package and the circuit portion within the circuit containing portion, insulated pipes for covering the outer peripheries of the electrode lead pins, and coil springs covering the outer peripheries of the insulated pipes.
摘要翻译：压力传感器装置具有检测从外部引入的气体的压力的传感器，用于加热传感器的加热器，包含传感器和加热器的封装，产生表示基于气体的压力的输出信号的电路部分在由传感器检测到的检测输出上，以及包含电路部分的电路容纳部分。封装和电路容纳部分由独立的壳体构成，并且分别设置有插入其间的连接结构构件。连接结构件90包括连接在封装内的传感器与电路容纳部分内的电路部分之间的电极引脚，用于覆盖电极引脚的外周的绝缘管和覆盖绝缘管的外周的螺旋弹簧。

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