会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Communication system die stack
    • 通信系统模块
    • US09091820B2
    • 2015-07-28
    • US13914049
    • 2013-06-10
    • Freescale Semiconductor, Inc.
    • Tab A. StephensPerry H. PelleyMichael B. McShane
    • G02B6/26G02B6/42G02B6/35G02B26/08
    • G02B6/3502G02B26/0833
    • A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks (130, 140, 150, 160, 170) include integrated deflectable MEMS optical beam waveguides (e.g., 190) at each die edge to provide optical communications (182-185) in and between die stacks by supplying deflection voltages to a plurality of deflection electrodes (195-197) positioned on and around each MEMS optical beam waveguide (193-194) to provide two-dimensional alignment and controlled feedback to adjust beam alignment and establish optical communication links between die stacks.
    • 描述了高密度,低功率,高性能的信息系统,方法和装置,其中垂直取向的处理器和存储器管芯堆叠(130,140,​​150,160,170)包括集成的可偏转的MEMS光束波导(例如,190) 每个管芯边缘通过向位于每个MEMS光束波导(193-194)上和周围的多个偏转电极(195-197)提供偏转电压来在管芯堆叠内和之间提供光通信(182-185) 尺寸对准和受控反馈以调整光束对准并建立管芯堆叠之间的光通信连接。