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1. 发明申请

US20180294885A1 OPTICAL MODULE 审中-公开
公开(公告)号：US20180294885A1
公开(公告)日：2018-10-11
申请号：US15857855
申请日：2017-12-29
申请人： Hisense Broadband Multimedia Technologies, Ltd. , Hisense Broadband Multimedia Technologies, Ltd.
发明人： Long Zheng
IPC分类号： H04B10/50 , H04B15/02 , H04B10/85
CPC分类号： H05B37/0209 , F21V5/04 , F21V23/005 , F21V29/504 , F21V29/508 , F21V29/83 , G02B6/4206 , G02B6/4214 , G02B6/4246 , G02B6/4251 , G02B6/4256 , G02B6/4274 , G02B6/428 , G02B6/4283 , G02B6/4292 , H04B10/40 , H04B10/503 , H04B10/85 , H04B15/02 , H05K9/0058
摘要： The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

2. 发明申请

US20180035531A1 High Thermal Conductivity Region for Optoelectronic Devices 审中-公开
公开(公告)号：US20180035531A1
公开(公告)日：2018-02-01
申请号：US15224406
申请日：2016-07-29
申请人： Ravi Kiran Nalla , Raymond Kirk Price
发明人： Ravi Kiran Nalla , Raymond Kirk Price
IPC分类号： H05K1/02 , G02B6/42 , H05K3/46 , H05K1/18 , H05K3/32
CPC分类号： H05K1/0206 , G02B6/4267 , G02B6/428 , G02B6/4283 , H05K1/0204 , H05K1/0274 , H05K1/183 , H05K3/32 , H05K3/4697 , H05K2201/10106 , H05K2201/10121 , H05K2201/10416 , H05K2201/2054
摘要： This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.

3. 发明申请

US20170363807A1 OPTICAL MODULE WITH A DUAL LAYER PCBA STRUCTURE 有权
公开(公告)号：US20170363807A1
公开(公告)日：2017-12-21
申请号：US15627838
申请日：2017-06-20
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Zhanwei WANG , Kewu WANG
IPC分类号： G02B6/122 , H04J3/16 , H04L29/06 , G02B6/42 , H05K1/18 , H05K1/03
CPC分类号： G02B6/122 , G02B6/4274 , G02B6/4281 , G02B6/4283 , H04J3/1611 , H04L69/12 , H05K1/0209 , H05K1/03 , H05K1/18 , H05K2201/066
摘要： An optical module with a dual layer printed circuit board assembly (PCBA) structure. The optical module includes a first casing and a second casing, and a first PCBA board and a second PCBA board located between the first casing and the second casing, a plurality of power components arranged on opposing surfaces of at least one of the first PCBA board and the second PCBA board, a layer of thermal superconducting medium of a bent arrangement including a first thermal conducting part and a second thermal conducting part arranged opposite to each other, the first thermal conducting part being thermally connected to the power component, and the second thermal conducting part being thermally connected to at least one of the first casing and the second casing, and at least one insulating layer arranged between the layer of thermal superconducting medium and the power components.

4. 发明申请

US20170315316A1 OPTO-ELECTRIC HYBRID BOARD 有权
公开(公告)号：US20170315316A1
公开(公告)日：2017-11-02
申请号：US15520509
申请日：2015-10-14
申请人： NITTO DENKO CORPORATION
发明人： Naoyuki Tanaka , Yuichi Tsujita
IPC分类号： G02B6/42 , H05K1/02 , H05K3/40 , H05K3/18 , H05K3/06 , G02B6/122 , H05K3/00 , H05K3/16 , H05K3/26
CPC分类号： G02B6/4281 , G02B6/12002 , G02B6/12004 , G02B6/122 , G02B6/4283 , H05K1/0271 , H05K1/0274 , H05K1/028 , H05K3/0023 , H05K3/064 , H05K3/067 , H05K3/16 , H05K3/181 , H05K3/188 , H05K3/26 , H05K3/4007 , H05K2201/10121
摘要： An opto-electric hybrid board includes: an electric circuit board including an insulation layer haying front arid back surfaces, arid electrical interconnect lines formed on the front surface of the insulation layer; and an optical waveguide having a substantially rectangular shape as seen in plan view and provided on the back surface of the insulation layer of the electric circuit board, with a metal layer therebetween. The optical waveguide has at least one end portion disposed in overlapping relation with the metal layer. The at least one end portion of the optical waveguide has corner portions. Each of the corner portions is radiused to have an arcuate shape or has a polygonal shape produced by arranging a plurality of obtuse-angled portions in a substantially arcuate configuration.

5. 发明申请

US20170168254A1 OPTICAL TRANSCEIVER 审中-公开
公开(公告)号：US20170168254A1
公开(公告)日：2017-06-15
申请号：US15302231
申请日：2015-03-23
申请人： MITSUBISHI ELECTRIC CORPORATION
发明人： Hiroyuki OZAKI , Naoto HIMURA , Shinya NISHI , Masatoshi KATAYAMA
IPC分类号： G02B6/42 , H04B10/40 , H01S5/022
CPC分类号： G02B6/4277 , G02B6/4246 , G02B6/4256 , G02B6/4283 , H01S5/022 , H04B10/40
摘要： An optical transceiver includes an optical component (3) whose ground is integrated with a signal ground. The optical transceiver includes a conductor (51) that is electrically connected to the optical component (3), and a sheet-like insulator (52) disposed between the conductor (51) and a housing (1) such that a main surface thereof is positioned along an inner wall of the housing (1), and separating the signal ground and a frame ground on the side of the housing (1) from each other.

6. 发明申请

US20160370547A1 ADVANCED MULTI-GIGABIT CONNECTORS, INSERTS, ACTIVE OPTICAL CABLES AND METHODS 有权
标题翻译：高级多功能连接器，插件，主动光纤和方法
公开(公告)号：US20160370547A1
公开(公告)日：2016-12-22
申请号：US14742263
申请日：2015-06-17
申请人： Glenair, Inc.
发明人： Ronald T. Logan, JR. , Leo Kha , Lutz Adrian Mueller , Troy Chase , Narek Hacopian , Matthew P. Flach
IPC分类号： G02B6/42 , H01R43/16 , H01R13/66
CPC分类号： G02B6/4293 , G02B6/4246 , G02B6/4278 , G02B6/428 , G02B6/4283 , G02B6/4284 , H01R12/592 , H01R13/24 , H01R13/6477
摘要： A connector insert arrangement, an active optical cable and methods are described. The connector insert is receivable in a connector housing for removable engagement with a complementary connector. Dielectric inserts each support one or more electrical contacts for access by the complementary connector and each electrical contact is selected as one of a contact pad and a spring probe pin for electrical contact with a complementary spring probe pin and complementary contact pad, respectively, in the complementary connector. A ground body supports the dielectric inserts to maintain a characteristic transmission line impedance along each of a plurality of high speed data paths such that each high speed data path serves as an independent transmission line structure that provides a data transfer rate of at least 1 gigabit per second. An active optical cable is described that can be hermaphroditic.
摘要翻译：描述了连接器插入装置，有源光缆和方法。连接器插件可接收在连接器壳体中，以与互补连接器可拆卸地接合。电介质插件每个支撑一个或多个电触头以供互补连接器接近，并且每个电触点被选择为接触焊盘和弹簧探针之一，用于与互补弹簧探针和互补接触垫电接触，互补连接器。接地体支撑电介质插入件以沿着多个高速数据路径中的每一个保持特性传输线阻抗，使得每个高速数据路径用作提供至少1吉比特的数据传输速率的独立传输线结构第二。描述了可以是雌雄同体的有源光缆。

7. 发明申请

US20160282571A1 OPTICAL-MODULE MEMBER, OPTICAL MODULE, AND ELECTRONIC DEVICE 有权
标题翻译：光模块成员，光模块和电子设备
公开(公告)号：US20160282571A1
公开(公告)日：2016-09-29
申请号：US14392134
申请日：2014-07-01
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Makoto FUJIWARA , Shinya ARAI
IPC分类号： G02B6/42 , G02B6/12
CPC分类号： G02B6/4201 , G02B6/12004 , G02B6/122 , G02B6/4214 , G02B6/4236 , G02B6/4245 , G02B6/4246 , G02B6/4249 , G02B6/425 , G02B6/428 , G02B6/4283 , G02B6/4292 , H05K1/0274 , H05K1/141 , H05K2201/10106 , H05K2201/10121
摘要： An optical module-member is provided, including: a layer-shaped optical waveguide; a light-emitting unit substrate including an insulating substrate, light-emitting element-mounting portions where light-emitting elements are configured to be mounted so as to be optically connected to the optical waveguide, and driving element-mounting portions which are electrically connected to the light-emitting element-mounting portions where driving elements for driving the light-emitting elements are configured to be mounted; and a light-receiving unit substrate which is separated from the light-emitting unit substrate, the light-receiving unit substrate including: an insulating substrate, light-receiving element-mounting portions where light-receiving elements are configured to be mounted so as to be optically connected to the optical waveguide, and signal amplification element-mounting portions which are electrically connected to the light-receiving element-mounting portions and where signal amplification elements for amplifying a signal from the light-receiving element are configured to be mounted.
摘要翻译：提供了一种光学模块构件，包括：层状光波导; 发光单元基板，其包括绝缘基板，发光元件安装部分，其中配置为安装以光学连接到所述光波导的发光元件;以及驱动元件安装部，其电连接到用于驱动发光元件的驱动元件的发光元件安装部分被配置为被安装; 以及从所述发光单元基板分离的受光单元基板，所述受光单元基板包括：绝缘基板，受光元件安装部，其中，光接收元件被配置为安装成光连接到光波导，以及信号放大元件安装部分，其电连接到光接收元件安装部分，并且其中用于放大来自光接收元件的信号的信号放大元件被配置为安装。

8. 发明申请

US20160259139A1 SEMICONDUCTOR DEVICE WITH OPTICAL AND ELECTRICAL VIAS 有权
标题翻译：具有光电六面体的半导体器件
公开(公告)号：US20160259139A1
公开(公告)日：2016-09-08
申请号：US15028934
申请日：2014-10-08
申请人： AMS AG
发明人： Jochen KRAFT , Karl ROHRACHER , Jordi TEVA
IPC分类号： G02B6/42 , G02B6/13 , G02B6/12 , H01L23/48 , H01L31/16
CPC分类号： G02B6/4283 , G02B6/12002 , G02B6/13 , G02B6/4274 , G02B6/428 , G02B6/43 , G02B2006/121 , G02B2006/12107 , G02B2006/12121 , G02B2006/12123 , G02B2006/12147 , H01L23/481 , H01L23/522 , H01L31/16 , H01L2224/16225 , H05K1/0274 , H05K1/115 , H05K1/116 , H05K1/181 , H05K3/429 , H05K3/4605 , H05K2201/0939 , H05K2201/09518 , H05K2201/09581 , H05K2201/10174
摘要： The method comprises providing a semiconductor substrate, which has a main surface and an opposite further main surface, arranging a contact pad above the further main surface, forming a through-substrate via from the main surface to the further main surface at a distance from the contact pad and, by the same method step together with the through-substrate via, forming a further through-substrate via above the contact pad, arranging a hollow metal via layer in the through-substrate via and, by the same method step together with the metal via layer, arranging a further metal via layer in the further through-substrate via, the further metal via layer contacting the contact pad, and removing a bottom portion of the metal via layer to form an optical via laterally surrounded by the metal via layer.
摘要翻译：该方法包括提供半导体衬底，其具有主表面和相对的另一个主表面，将接触焊盘布置在另一个主表面上方，从而从主表面到另一个主表面在距离接触焊盘，并且通过与通孔基板通孔相同的方法步骤，在接触焊盘上方形成另外的通孔，在穿通基板中经由中空金属通孔层，并且通过相同的方法步骤连同金属通孔层，在另外的通孔中经由另外的金属通孔层，通过另外的金属通孔层与接触垫接触，以及去除金属通孔层的底部，以形成由金属通孔横向包围的光学通孔层。

9. 发明授权

US09417414B2 Optical connector for a card including concave and convex guide portions 有权
标题翻译：一种用于卡片的光学连接器，包括凹凸引导部分
公开(公告)号：US09417414B2
公开(公告)日：2016-08-16
申请号：US13384059
申请日：2010-07-13
申请人： Akihiro Shimotsu , Masayuki Arai
发明人： Akihiro Shimotsu , Masayuki Arai
IPC分类号： G02B6/36 , G02B6/42 , G02B6/38 , G02B6/43
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/4201 , G02B6/4214 , G02B6/426 , G02B6/4274 , G02B6/4281 , G02B6/4283 , G02B6/4293 , G02B6/43
摘要： An optical connector is disclosed. The optical connector includes a cable having formed therein an optical waveguide, a plug having the cable connected thereto, and a connector housing configured to mount thereon the plug. The cable is provided with a cable-side guide portion. The plug is provided with a plug housing which has a plug-side guide portion and is attached to the cable. The connector housing is provided with a connector-side guide portion. The plug-side guide portion is configured to be engaged with the cable-side guide portion to achieve a positioning of the cable and the plug housing and be engaged with the connector-side guide portion to achieve a positioning of the connector housing and the plug.
摘要翻译：公开了一种光连接器。光学连接器包括其中形成有光波导的电缆，具有连接到其上的电缆的插头以及配置成在其上安装插头的连接器壳体。电缆设有电缆侧引导部。插头设置有插头壳体，该插头壳体具有插头侧引导部分并且附接到电缆。连接器壳体设置有连接器侧引导部。插头侧引导部分被配置为与电缆侧引导部分接合以实现电缆和插头壳体的定位并且与连接器侧引导部分接合以实现连接器壳体和插头的定位。

10. 发明授权

US09389362B1 Adaptive optical interconnection of components of an electro-optical circuit 有权
标题翻译：电光电路部件的自适应光互连
公开(公告)号：US09389362B1
公开(公告)日：2016-07-12
申请号：US14941856
申请日：2015-11-16
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Thomas J. Brunschwiler , Antonio La Porta , Bert J. Offrein , Jonas R. Weiss
IPC分类号： G02B6/12 , H01L25/00 , G02B6/138 , G02B6/132 , G02B6/42
CPC分类号： G02B6/12004 , G02B6/138 , G02B6/4255 , G02B6/4283 , G02B6/4292 , H01L21/568 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/24137 , H01L2924/14
摘要： Embodiments include a method for interconnecting components of an optical circuit. The method includes arranging the components on a support layer and embedding them within a material, such that portions of the material that is between the components contact the support layer. The obtained components are positioned with a certain inaccuracy with respect to ideal nominal positions thereof. Next, the support layer is removed to reveal one side of the components, on which side the components are level with said portions of said material. Positions of the components are identified and a set of optical polymer waveguides are adaptively fabricated, on the one side, so as for each of the fabricated polymer waveguides to optically connect subsets of two or more of the components, according to the identified positions of the components. The present invention is further directed to related optical circuits or electro-optical circuits of interconnected components.
摘要翻译：实施例包括用于互连光学电路的部件的方法。该方法包括将部件布置在支撑层上并将其嵌入材料内，使得部件之间的部件接触支撑层。所获得的部件相对于其理想的标称位置具有一定的不准确度。接下来，去除支撑层以露出部件的一侧，在该侧部件与所述材料的所述部分平齐。识别部件的位置，并且在一侧上自适应地制造一组光学聚合物波导，以便根据所识别的位置，制造的聚合物波导中的每一个光学连接两个或更多个部件的子集组件。本发明还涉及相关组件的相关光电路或电光电路。

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