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1. 发明公开

US20240260179A1 PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20240260179A1
公开(公告)日：2024-08-01
申请号：US18426547
申请日：2024-01-30
申请人： IBIDEN CO., LTD.
发明人： Jun SAKAI , Shiho SHIMADA
IPC分类号： H05K1/02 , H05K1/05 , H05K3/16
CPC分类号： H05K1/0298 , H05K1/053 , H05K3/16 , H05K2201/0209 , H05K2201/0338 , H05K2203/0723
摘要： A printed wiring board includes a conductor layer, an outermost insulating layer formed on the conductor layer and having an opening exposing a portion of the conductor layer, and a metal post formed in the opening of the outermost insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer such that the metal post has a height exceeding a surface of the outermost insulating layer and has a portion exceeding a height of the outermost insulating layer, the seed layer of the metal post has a first layer and a second layer formed on the first layer. The portion exceeding the height of the outermost insulating layer is formed such that a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer.

2. 发明公开

US20240107685A1 PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20240107685A1
公开(公告)日：2024-03-28
申请号：US18475288
申请日：2023-09-27
申请人： IBIDEN CO., LTD.
发明人： Susumu KAGOHASHI , Jun SAKAI , Kyohei YOSHIKAWA , Takuya INISHI
IPC分类号： H05K3/46 , H05K1/03 , H05K1/11 , H05K3/06 , H05K3/16
CPC分类号： H05K3/4688 , H05K1/0306 , H05K1/0313 , H05K1/116 , H05K3/062 , H05K3/16 , H05K3/4608 , H05K2201/0209 , H05K2201/0212 , H05K2201/0338 , H05K2203/0369
摘要： A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

3. 发明授权

US09956396B2 Thin film for a lead for brain applications 有权
公开(公告)号：US09956396B2
公开(公告)日：2018-05-01
申请号：US13762426
申请日：2013-02-08
申请人： Medtronic Bakken Research Center B.V.
发明人： Edward Willem Albert Young , Hoa Thi Mai Pham , Martinus Lambertus Wilhelmus Vorstenbosch , Ke Wang
IPC分类号： A61N1/00 , A61N1/05 , A61N1/36 , H05K3/10 , H05K1/11 , H05K3/16 , H05K3/28
CPC分类号： A61N1/0534 , A61N1/05 , A61N1/3606 , A61N1/36125 , H05K1/11 , H05K3/108 , H05K3/16 , H05K3/28 , H05K2203/1322
摘要： A thin film for a lead for brain applications includes at least one section comprising a high conductive metal and a low conductive metal, whereby the low conductive metal is a biocompatible metal and has a lower electrical conductivity than the high conductive metal and whereby the high conductive metal is at least partially encapsulated by the low conductive metal. Furthermore, the present invention relates to a method of manufacturing a thin film for a lead for brain applications and a deep brain stimulation system.

4. 发明授权

US09903015B2 Substrate with transparent electrode and method for manufacturing same 有权
公开(公告)号：US09903015B2
公开(公告)日：2018-02-27
申请号：US14653805
申请日：2013-12-18
申请人： KANEKA CORPORATION
发明人： Hironori Hayakawa , Takashi Kuchiyama , Kenji Yamamoto
IPC分类号： B32B15/04 , C23C14/34 , H05K1/09 , C23C14/08 , G06F3/044 , H05K3/16
CPC分类号： C23C14/34 , B32B2307/412 , B32B2307/702 , B32B2457/208 , C23C14/086 , C23C14/3414 , G06F3/044 , G06F2203/04103 , H05K1/09 , H05K3/16 , H05K2201/0326 , H05K2201/10053 , H05K2203/1194
摘要： A substrate with a transparent electrode which includes an amorphous transparent electrode layer on a transparent film substrate. When a bias voltage of 0.1 V is applied to the amorphous transparent electrode layer, the layer has continuous regions where a current value at a voltage-applied surface is 50 nA or more. Each of the continuous regions has an area of 100 nm2 or more and the number of the continuous regions is 50/μm2 or more. In one embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. In another embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. With respect to the substrate with a transparent electrode according to the present invention, the transparent electrode layer may be crystallized in a short period of time.

5. 发明授权

US09841857B2 Conductive pattern laminate and electronic device comprising same 有权
公开(公告)号：US09841857B2
公开(公告)日：2017-12-12
申请号：US14778462
申请日：2014-03-24
申请人： LG CHEM, LTD.
发明人： Ji Young Hwang , Dong Hyun Oh , Hang Suk Choi , Seung Heon Lee , Sungjoon Min
IPC分类号： G06F3/041 , G06F1/16 , G02F1/1333 , G06F3/044 , H05K1/02 , H05K1/03 , H05K3/10 , G06F3/147 , H05K3/00 , H05K3/16
CPC分类号： G06F3/044 , G06F1/1643 , G06F1/1652 , G06F3/147 , G06F2203/04103 , H05K1/0296 , H05K1/0313 , H05K3/0014 , H05K3/10 , H05K3/16 , H05K2201/0326 , H05K2203/0108
摘要： The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.

6. 发明申请

US20170315316A1 OPTO-ELECTRIC HYBRID BOARD 有权
公开(公告)号：US20170315316A1
公开(公告)日：2017-11-02
申请号：US15520509
申请日：2015-10-14
申请人： NITTO DENKO CORPORATION
发明人： Naoyuki Tanaka , Yuichi Tsujita
IPC分类号： G02B6/42 , H05K1/02 , H05K3/40 , H05K3/18 , H05K3/06 , G02B6/122 , H05K3/00 , H05K3/16 , H05K3/26
CPC分类号： G02B6/4281 , G02B6/12002 , G02B6/12004 , G02B6/122 , G02B6/4283 , H05K1/0271 , H05K1/0274 , H05K1/028 , H05K3/0023 , H05K3/064 , H05K3/067 , H05K3/16 , H05K3/181 , H05K3/188 , H05K3/26 , H05K3/4007 , H05K2201/10121
摘要： An opto-electric hybrid board includes: an electric circuit board including an insulation layer haying front arid back surfaces, arid electrical interconnect lines formed on the front surface of the insulation layer; and an optical waveguide having a substantially rectangular shape as seen in plan view and provided on the back surface of the insulation layer of the electric circuit board, with a metal layer therebetween. The optical waveguide has at least one end portion disposed in overlapping relation with the metal layer. The at least one end portion of the optical waveguide has corner portions. Each of the corner portions is radiused to have an arcuate shape or has a polygonal shape produced by arranging a plurality of obtuse-angled portions in a substantially arcuate configuration.

7. 发明授权

US09795039B2 Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices 有权
公开(公告)号：US09795039B2
公开(公告)日：2017-10-17
申请号：US15346043
申请日：2016-11-08
申请人： HARRIS CORPORATION
发明人： Louis Joseph Rendek, Jr.
IPC分类号： H05K1/00 , H05K3/34 , H05K1/16 , H05K3/16 , H05K1/02 , H05K1/11 , H05K3/40 , H05K1/03
CPC分类号： H05K3/3452 , H01L2224/16225 , H05K1/028 , H05K1/03 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/167 , H05K3/16 , H05K3/3436 , H05K3/4038 , H05K2201/0141 , H05K2201/05 , Y02P70/613
摘要： A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

8. 发明授权

US09556510B2 Printing of multiple inks to achieve precision registration during subsequent processing 有权
标题翻译：打印多种油墨以在后续处理中实现精度配准
公开(公告)号：US09556510B2
公开(公告)日：2017-01-31
申请号：US15076236
申请日：2016-03-21
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： Mikhail L. Pekurovsky , Ann M. Gilman , Daniel J. Theis
IPC分类号： H05K3/16 , C23C14/34 , B41F33/00 , B05D1/28 , B05D3/06 , B05D3/00 , B41F3/00 , H05K13/00 , B41F9/10 , B41M3/00 , B41F31/00 , B41F31/02 , B41F31/04 , H05K1/02 , H05K3/12 , H05K3/46 , H05K1/03 , H05K3/24
CPC分类号： B41F33/0081 , B05D1/28 , B05D3/007 , B05D3/067 , B41F3/00 , B41F9/1063 , B41F31/008 , B41F31/02 , B41F31/04 , B41M3/008 , C23C14/34 , H05K1/0269 , H05K1/0283 , H05K1/0393 , H05K3/1275 , H05K3/16 , H05K3/246 , H05K3/4679 , H05K13/0015 , H05K2201/09918 , H05K2203/0143 , H05K2203/1344 , H05K2203/1545 , H05K2203/166
摘要： A method of achieving precision registration in a roll to roll process by simultaneously depositing multiple inks onto a printing roll. One of these inks prints a pattern of fiducial marks onto a substrate while another ink prints a predetermined pattern on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks.
摘要翻译：一种通过将多种油墨同时沉积到印刷辊上来实现辊轧工艺精密配准的方法。这些墨水中的一种将基准标记的图案打印到基板上，而另一墨水在同一基板上印刷预定图案，使得预定图案与基准图案的图案具有可预测的空间关系。因此，即使形成预定图案的墨水是不可见的，或者具有如此低的对比度，使得它在实际上是不可见的，或者甚至已经在随后的处理步骤中被溶解掉，则仍然可以知道预定图案在哪里通过参考基准标记的模式。

9. 发明授权

US09544995B2 Flexible substrate attaching method and flexible substrate attachment structure 有权
标题翻译：柔性基板贴附方法和柔性基板附着结构
公开(公告)号：US09544995B2
公开(公告)日：2017-01-10
申请号：US14761986
申请日：2015-02-10
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Ce Ning , Tao Gao
IPC分类号： H05K1/02 , H05K1/03 , H05K3/06 , H05K3/00 , H05K3/46
CPC分类号： H05K1/028 , H05K1/0306 , H05K3/007 , H05K3/0097 , H05K3/06 , H05K3/16 , H05K3/467 , H05K2201/09781 , H05K2203/016 , H05K2203/167
摘要： The present disclosure relates to the technical field of flexible substrate processing, and discloses a flexible substrate attaching method. The flexible substrate attaching method comprises the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate. In this flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate and the flexible panel can be detached after the manufacture is completed. The present disclosure further provides a flexible substrate attachment structure.
摘要翻译：本公开涉及柔性基板加工的技术领域，并且公开了一种柔性基板附着方法。柔性基板安装方法包括以下步骤：利用第一固定结构将柔性基板预固定在载体基板上; 在柔性基板上形成薄膜，并通过图案化工艺形成薄膜图案; 所述薄膜的图案与所述柔性基板的至少一部分和所述载体基板的至少一部分同时接触，以发挥将所述柔性基板固结到所述载体基板上的功能。在这种柔性基板安装方法中，可以将柔性基板固定在载体基板上，并且在制造完成之后可以将柔性板分离。本公开进一步提供了柔性基板附接结构。

10. 发明授权

US09521752B2 Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices 有权
标题翻译：制造具有形成在LCP焊接掩模上的薄膜电阻器的电子器件和相关器件的方法
公开(公告)号：US09521752B2
公开(公告)日：2016-12-13
申请号：US14490866
申请日：2014-09-19
申请人： HARRIS CORPORATION
发明人： Louis Joseph Rendek, Jr.
IPC分类号： H05K1/00 , H05K1/16 , H05K1/03 , H05K3/16 , H05K3/34
CPC分类号： H05K3/3452 , H01L2224/16225 , H05K1/028 , H05K1/03 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/167 , H05K3/16 , H05K3/3436 , H05K3/4038 , H05K2201/0141 , H05K2201/05 , Y02P70/613
摘要： A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.
摘要翻译：制造电子器件的方法可以包括在衬底上形成至少一个包括焊盘的电路层，并在其中形成至少一个具有掩模开口的液晶聚合物（LCP）焊料掩模。该方法还可以包括在LCP焊接掩模上形成至少一个薄膜电阻器并且将至少一个LCP焊接掩模耦合到衬底，使得至少一个薄膜电阻器耦合到至少一个电路层，并且使得焊盘与掩模开口对准。

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