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1. 发明申请

US20180120807A1 Method and Computer Program Product for Controlling the Positioning of Patterns on a Substrate in a Manufacturing Process 审中-公开
公开(公告)号：US20180120807A1
公开(公告)日：2018-05-03
申请号：US15129521
申请日：2016-08-04
申请人： KLA-Tencor Corporation
发明人： Slawomir Czerkas , Frank Laske
IPC分类号： G05B19/402
CPC分类号： G05B19/402 , G03F9/7003 , G05B2219/45028 , G05B2219/45031
摘要： In a method for controlling the positioning of patterns on a substrate in a manufacturing process at least one registration measurement is conducted with a registration tool on at least one pattern formed in at least one layer on the substrate by a previous process step of the manufacturing process. From the registration measurement a position of the at least one pattern in a coordinate system is determined. The determined position of the at least one pattern is fed into an automatic process control of a manufacturing system for controlling a setup of the manufacturing system for a subsequent process step of the manufacturing process. The manufacturing process may be a wafer manufacturing process with a silicon substrate. Complementary information may be collected in addition to performing the registration measurement and fed to the automatic process control. The process steps may for example include lithography steps, etching steps, layer deposition.

2. 发明授权

US07493186B2 Method and algorithm for the control of critical dimensions in a thermal flow process 失效
标题翻译：用于控制热流过程中关键尺寸的方法和算法
公开(公告)号：US07493186B2
公开(公告)日：2009-02-17
申请号：US11613238
申请日：2006-12-20
申请人： Colin J. Brodsky , Michael M. Crouse , Allen H. Gabor
发明人： Colin J. Brodsky , Michael M. Crouse , Allen H. Gabor
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G03F7/70508 , G03F7/70558 , G03F7/70625 , G03F7/70875 , G05B2219/32182 , G05B2219/32187 , G05B2219/32188 , G05B2219/37224 , G05B2219/45028 , H01L22/12 , H01L22/20
摘要： A method of controlling one or more critical dimension (CD) features, dependent upon at least a first and a second processing parameter, with a single metrology step, while still enabling decoupled feedback to the first and the second processing parameter, includes an initial process characterization; producing a production piece; a single metrology step to determine the critical dimensions of the produced features; solving a system of equations simultaneously for individual feedback correction values for the first and second processing parameters; and applying the individual feedback correction values to their respective processing parameters.
摘要翻译：一种基于至少第一和第二处理参数的单个度量步骤来控制一个或多个关键维度（CD）特征的方法，同时仍然使能到第一和第二处理参数的解耦反馈，包括初始过程表征生产一块; 一个单一的度量步骤来确定所产生的特征的关键尺寸; 针对第一和第二处理参数的各个反馈校正值同时求解方程组; 以及将各个反馈校正值应用于它们各自的处理参数。

3. 发明授权

US07256491B2 Thermal interconnect systems methods of production and uses thereof 失效
标题翻译：热互连系统的生产方法及其用途
公开(公告)号：US07256491B2
公开(公告)日：2007-08-14
申请号：US10538821
申请日：2004-06-04
申请人： Mark Fery , Nancy Dean
发明人： Mark Fery , Nancy Dean
IPC分类号： H01L23/10 , H01L21/00
CPC分类号： G05B19/41865 , G05B2219/31411 , G05B2219/32267 , G05B2219/32271 , G05B2219/45028 , H01L23/3735 , H01L23/42 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y02P80/40 , Y02P90/20 , H01L2924/00
摘要： A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述的热转印材料包括：散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料以及至少一个焊料材料，其中焊料材料直接沉积到散热器部件的底面上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

4. 发明授权

US07215095B2 Driving apparatus, exposure apparatus, and device manufacturing method 有权
标题翻译：驱动装置，曝光装置和装置的制造方法
公开(公告)号：US07215095B2
公开(公告)日：2007-05-08
申请号：US11031021
申请日：2005-01-10
申请人： Hiroyuki Sekiguchi
发明人： Hiroyuki Sekiguchi
IPC分类号： G05B19/33
CPC分类号： G05B19/414 , G03B27/02 , G03F7/70725 , G03F7/70758 , G03F7/70766 , G03F7/709 , G05B19/404 , G05B2219/41191 , G05B2219/45028 , G05B2219/49257
摘要： A driving apparatus for moving an object. The apparatus includes a first actuator which drives the object in X and Y directions, a second actuator which drives a reaction force counter which receives a reaction force generated when the first actuator drives the object, and a controller which controls the second actuator on the basis of X- and Y-direction positions of the object and X- and Y-direction accelerations of the object so as to cancel, by the second actuator, the reaction force to be received by the reaction force counter when the object is driven by the first actuator.
摘要翻译：用于移动物体的驱动装置。该装置包括在X和Y方向上驱动物体的第一致动器，驱动反作用力计数器的第二致动器，其接收当第一致动器驱动物体时产生的反作用力;以及控制器，其基于物体的X方向和Y方向位置以及物体的X方向和Y方向加速度，以便由第二致动器抵消由反作用力计数器接收的反作用力第一执行器。

5. 发明申请

US20060190119A1 Lithophane-like article and method of manufacture 审中-公开
标题翻译：类似海藻的物品和制造方法
公开(公告)号：US20060190119A1
公开(公告)日：2006-08-24
申请号：US11214532
申请日：2005-08-29
申请人： John Dufort
发明人： John Dufort
IPC分类号： G06F19/00
CPC分类号： A23G3/50 , A23G3/28 , B29C33/38 , B29C33/3842 , B29C45/006 , B29C45/1671 , B29C45/372 , B29C2045/1673 , B29K2995/0029 , B44C1/225 , B44C1/228 , B44C1/24 , B44C3/04 , B44C3/085 , B44F1/06 , G05B19/4099 , G05B19/4205 , G05B2219/36324 , G05B2219/45028 , G05B2219/45163 , G05B2219/45204 , G05B2219/45212 , G05B2219/49006 , G05B2219/49007 , G05B2219/49235
摘要： An article and a method of forming an article, for example formed of plastics, confectionary product, soap, wax or liquid, by determining the intensity of different points of an original image, and forming the article with a thickness at each point of the article related to the intensity of the corresponding point of the original image. Preferable, the article is formed by forming a mould, and moulding the article.
摘要翻译：通过确定原始图像的不同点的强度以及在物品的每个点处形成具有厚度的物品，形成制品的制品和方法，例如由塑料，糖果产品，肥皂，蜡或液体形成的物品与原始图像的对应点的强度相关。优选地，通过形成模具并且模制该制品来形成制品。

6. 发明申请

US20060155414A1 Semiconductor manufacturing apparatus 有权
公开(公告)号：US20060155414A1
公开(公告)日：2006-07-13
申请号：US11371677
申请日：2006-03-08
申请人： Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
发明人： Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
IPC分类号： G06F19/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

7. 发明申请

US20060119829A1 Lithographic apparatus and device manufacturing method 有权
标题翻译：平版印刷设备和器件制造方法
公开(公告)号：US20060119829A1
公开(公告)日：2006-06-08
申请号：US11005480
申请日：2004-12-07
申请人： Henrikus Cox , Koen Johannes Maria Zaal
发明人： Henrikus Cox , Koen Johannes Maria Zaal
IPC分类号： G03B27/58
CPC分类号： G03F7/70725 , G05B2219/45028
摘要： A lithographic apparatus includes an illumination system configured to condition a radiation beam, a patterning device support constructed to support a patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate support constructed to hold a substrate, and a projection system configured to project the patterned radiation beam onto a target portion of the substrate. An actuator assembly is configured to move one of the supports with six degrees of freedom comprising x, y, z, rx, ry and rz directions. A controller controls the actuator assembly, and includes at least one compensator which is designed to dynamically decouple a dynamics of the actuator assembly in the degrees of freedom.
摘要翻译：光刻设备包括被配置为调节辐射束的照明系统，构造成支撑图案形成装置的图案形成装置支撑件，其能够在其横截面中赋予辐射束图案以形成图案化的辐射束，构造的衬底支架以保持基板和配置成将图案化的辐射束投影到基板的目标部分上的投影系统。致动器组件被配置为使包括x，y，z，rx，ry和rz方向的六个自由度中的一个支撑件移动。控制器控制致动器组件，并且包括至少一个补偿器，其被设计成以自由度动态地解耦致动器组件的动力学。

8. 发明授权

US07027888B2 Semiconductor manufacturing apparatus 失效
标题翻译：半导体制造装置
公开(公告)号：US07027888B2
公开(公告)日：2006-04-11
申请号：US11186455
申请日：2005-07-21
申请人： Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
发明人： Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
IPC分类号： G06F19/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
摘要翻译：半导体制造装置包括：计算单元，具有至少一个用于处理半导体设计信息的计算机; 控制单元，用于根据半导体设计信息的处理结果控制电子辐射; 用于根据控制单元的指令发射电子的写入单元; 和至少一个存储设备。半导体制造装置允许存储装置，计算单元，控制单元和写入单元之间的通信。半导体制造装置还包括可以控制存储装置的通信通路。

9. 发明申请

US20050270857A1 Semiconductor manufacturing apparatus 失效
公开(公告)号：US20050270857A1
公开(公告)日：2005-12-08
申请号：US11186455
申请日：2005-07-21
申请人： Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
发明人： Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
IPC分类号： G03F1/84 , G03F1/86 , G03F7/20 , H01J37/302 , H01J37/317 , H01L21/02 , H01L21/027 , G11C5/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

10. 发明申请

US20050252884A1 Method and system for predicting process performance using material processing tool and sensor data 审中-公开
标题翻译：使用材料加工工具和传感器数据预测工艺性能的方法和系统
公开(公告)号：US20050252884A1
公开(公告)日：2005-11-17
申请号：US10517762
申请日：2003-06-27
申请人： Hieu Lam , Hongyu Yue , John Shriner
发明人： Hieu Lam , Hongyu Yue , John Shriner
IPC分类号： H01L21/3065 , C23F1/00 , G05B19/418 , G05B23/02 , H01L21/66
CPC分类号： H01L22/20 , G05B19/41875 , G05B23/0254 , G05B2219/31357 , G05B2219/32179 , G05B2219/32194 , G05B2219/45028 , G05B2219/45031 , H01J37/32935 , Y02P90/14 , Y02P90/22
摘要： A material processing system including a process tool and a process performance prediction system. The performance prediction system includes sensors coupled to the tool to measure tool data and a controller coupled to the sensors to receive tool data, where the controller is configured to predict the process performance for the tool using the tool data. A method for detecting a fault in a material processing system using a process performance prediction model is also provided. The method includes preparing the tool, initiating a process in the tool, and recording tool data to form to a tool data matrix. The method also includes performing a matrix multiplication of the tool data matrix and a correlation matrix to form predicted process performance data, where the correlation matrix includes the performance prediction model, comparing the predicted data with target data, and determining a fault condition of the processing system from the comparing step.
摘要翻译：一种材料处理系统，包括处理工具和过程性能预测系统。性能预测系统包括耦合到工具以测量工具数据的传感器和耦合到传感器以接收工具数据的控制器，其中控制器被配置为使用工具数据预测工具的过程性能。还提供了使用过程性能预测模型来检测材料处理系统中的故障的方法。该方法包括准备工具，启动工具中的过程，以及记录工具数据以形成工具数据矩阵。该方法还包括执行刀具数据矩阵和相关矩阵的矩阵乘法以形成预测过程性能数据，其中相关矩阵包括性能预测模型，将预测数据与目标数据进行比较，以及确定处理的故障状况系统从比较步骤。

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