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1. 发明授权

US1023604A Metal-casting. 失效
标题翻译：金属铸造。
公开(公告)号：US1023604A
公开(公告)日：1912-04-16
申请号：US1911636270
申请日：1911-06-30
申请人： GEN ELECTRIC
发明人： WEINTRAUB EZECHIEL
CPC分类号： C22C9/00 , B23K1/19 , H01L2224/34 , H01L2224/43 , H01L2924/00014 , H01L2924/01012 , H01L2924/00012 , H01L2224/45099 , H01L2224/37099 , H01L2224/37599

2. 发明申请

US20170309556A1 ELECTRONIC PART MOUNTING HEAT-DISSIPATING SUBSTRATE 审中-公开
公开(公告)号：US20170309556A1
公开(公告)日：2017-10-26
申请号：US15523478
申请日：2015-11-20
申请人： NSK Ltd.
发明人： Shigeru SHIMAKAWA , Takashi SUNAGA , Takaaki SEKINE , Teruyoshi KOGURE , Ryoichi SUZUKI
IPC分类号： H01L23/495 , H01L49/02
CPC分类号： H01L23/49568 , B62D5/0406 , G01R1/203 , H01L23/12 , H01L23/36 , H01L23/48 , H01L23/49524 , H01L23/49531 , H01L23/49537 , H01L23/49558 , H01L23/49861 , H01L23/50 , H01L24/34 , H01L24/37 , H01L25/071 , H01L28/20 , H01L2224/34 , H01L2224/37147 , H01L2224/37599 , H02K11/33 , H05K1/181 , H05K3/202 , H05K2201/09881 , H01L2924/00014 , H01L2924/00012
摘要： An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

3. 发明申请

US20190198424A1 POWER MODULE WITH BUILT-IN POWER DEVICE AND DOUBLE-SIDED HEAT DISSIPATION AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20190198424A1
公开(公告)日：2019-06-27
申请号：US15956771
申请日：2018-04-19
申请人： RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
发明人： Wai Kin Raymond Lam , Ho Wai Derek Leung , Aibing Chen , Weidong Gao
IPC分类号： H01L23/40 , H01L23/492
CPC分类号： H01L23/40 , H01L23/492 , H01L2224/34 , H01L2924/13055
摘要： Disclosed is a power module with built-in power device and double-sided heat dissipation and a manufacturing method thereof. The power module includes a first base plate including a first organic insulating base material, a first electrical insulating heat dissipation body, a first metal layer, and a patterned second metal layer; a second base plate including a second organic insulating base material and a second electrical insulating heat dissipation body. A third metal layer thermally connected to a side of the second electrical insulating heat dissipation body is formed at the outer side of the second base plate. A fourth metal layer thermally connected to the second electrical insulating heat dissipation body is formed at another side of the second electrical insulating heat dissipation body. The fourth metal layer is formed with a concave power device accommodating space, and the power device is arranged in the accommodating space.

4. 发明申请

US20170200691A1 POWER MODULE 有权
公开(公告)号：US20170200691A1
公开(公告)日：2017-07-13
申请号：US15324085
申请日：2015-10-09
申请人： MITSUBISHI ELECTRIC CORPORATION
发明人： Junji FUJINO , Yoshihisa UCHIDA , Shohei OGAWA , Soichi SAKAMOTO , Tatsunori YANAGIMOTO
IPC分类号： H01L23/00
CPC分类号： H01L24/45 , H01L23/48 , H01L24/09 , H01L24/33 , H01L24/48 , H01L24/49 , H01L2224/05552 , H01L2224/05647 , H01L2224/29109 , H01L2224/29111 , H01L2224/29123 , H01L2224/29124 , H01L2224/32225 , H01L2224/34 , H01L2224/37124 , H01L2224/37599 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48491 , H01L2224/48647 , H01L2224/49111 , H01L2224/49113 , H01L2224/49433 , H01L2224/73265 , H01L2224/83801 , H01L2924/00014 , H01L2924/2076 , H01L2224/05599 , H01L2224/45099 , H01L2924/00012
摘要： A power module is fabricated, employing a clad metal that is formed by pressure-laminating aluminum and copper, in such a manner that the aluminum layer of the clad metal is bonded such as by ultrasonic bonding to the surface electrode of the power semiconductor chip and a wire is bonded to the copper layer thereof to establish electrical circuit. The clad metal is thermally treated in advance at a temperature higher than the operating temperature of the power semiconductor chip to sufficiently form intermetallic compounds at the interface between the aluminum layer and the copper layer for the intermetallic compounds so as not to grow in thickness after the bonding processes.

5. 发明授权

US08210878B2 Electrical connector 有权
标题翻译：电连接器
公开(公告)号：US08210878B2
公开(公告)日：2012-07-03
申请号：US12942592
申请日：2010-11-09
申请人： Hiroshi Shirai , Yoshikazu Hirata
发明人： Hiroshi Shirai , Yoshikazu Hirata
IPC分类号： H01R13/66
CPC分类号： H01R13/6666 , H01L2224/32245 , H01L2224/34 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/83801 , H01L2924/00014 , H01R12/712 , H01L2924/00 , H01L2224/37099
摘要： An electrical connector, includes a protection circuit for protecting circuits on a circuit board. The electrical connector includes a housing, a plurality of contacts secured to the housing, and a semiconductor device built into the housing. The semiconductor devices include an overvoltage protection device, and the plurality of contacts are grounded through the overvoltage protection device.
摘要翻译：电连接器包括用于保护电路板上电路的保护电路。电连接器包括壳体，固定到壳体的多个触点以及内置于壳体中的半导体器件。半导体器件包括过电压保护器件，并且多个触点通过过电压保护器件接地。

6. 发明申请

US20070217467A1 Laser diode package utilizing a laser diode stack 审中-公开
标题翻译：使用激光二极管叠层的激光二极管封装
公开(公告)号：US20070217467A1
公开(公告)日：2007-09-20
申请号：US11384940
申请日：2006-03-20
申请人： Mark DeFranza , David Dawson , Jason Farmer
发明人： Mark DeFranza , David Dawson , Jason Farmer
IPC分类号： H01S5/00
CPC分类号： H01S5/024 , H01L2224/34 , H01L2224/37599 , H01L2224/49175 , H01L2924/00014 , H01S5/02264 , H01S5/02272 , H01S5/4025 , H01L2224/37099
摘要： A laser diode package is provided. The laser diode package includes a plurality of laser diode submount assemblies, each assembly including a submount to which one or more laser diodes are attached. An electrically isolating pad is attached to the same surface of the submount as the laser diode. A metallization layer is deposited onto the outermost surface of the electrically isolating pad, to which an electrical contact pad is bonded. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the metallization layer. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.
摘要翻译：提供激光二极管封装。激光二极管封装包括多个激光二极管基座组件，每个组件包括附接有一个或多个激光二极管的基座。电绝缘垫连接到基座的与激光二极管相同的表面。金属化层沉积在电绝缘焊盘的最外表面上，电接触焊盘与之结合。诸如导线或带状互连的电互连将激光二极管或二极管连接到金属化层。优选地，激光二极管堆叠通过电气和机械地将每个子安装座的底表面电连接到相邻的底座组件的电接触焊盘而形成。激光二极管堆叠热耦合到冷却块。优选地，导热和电绝缘构件插入在激光二极管叠层和冷却块之间。

7. 发明授权

US09818716B2 Power module 有权
公开(公告)号：US09818716B2
公开(公告)日：2017-11-14
申请号：US15324085
申请日：2015-10-09
申请人： MITSUBISHI ELECTRIC CORPORATION
发明人： Junji Fujino , Yoshihisa Uchida , Shohei Ogawa , Soichi Sakamoto , Tatsunori Yanagimoto
IPC分类号： H01L23/48 , H01L23/00
CPC分类号： H01L24/45 , H01L23/48 , H01L24/09 , H01L24/33 , H01L24/48 , H01L24/49 , H01L2224/05552 , H01L2224/05647 , H01L2224/29109 , H01L2224/29111 , H01L2224/29123 , H01L2224/29124 , H01L2224/32225 , H01L2224/34 , H01L2224/37124 , H01L2224/37599 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48491 , H01L2224/48647 , H01L2224/49111 , H01L2224/49113 , H01L2224/49433 , H01L2224/73265 , H01L2224/83801 , H01L2924/00014 , H01L2924/2076 , H01L2224/05599 , H01L2224/45099 , H01L2924/00012
摘要： A power module is fabricated, employing a clad metal that is formed by pressure-laminating aluminum and copper, in such a manner that the aluminum layer of the clad metal is bonded such as by ultrasonic bonding to the surface electrode of the power semiconductor chip and a wire is bonded to the copper layer thereof to establish electrical circuit. The clad metal is thermally treated in advance at a temperature higher than the operating temperature of the power semiconductor chip to sufficiently form intermetallic compounds at the interface between the aluminum layer and the copper layer for the intermetallic compounds so as not to grow in thickness after the bonding processes.

8. 发明申请

US20110053420A1 Electrical Connector 有权
标题翻译：电气连接器
公开(公告)号：US20110053420A1
公开(公告)日：2011-03-03
申请号：US12942592
申请日：2010-11-09
申请人： Hiroshi Shirai , Yoshikazu Hirata
发明人： Hiroshi Shirai , Yoshikazu Hirata
IPC分类号： H01R13/66
CPC分类号： H01R13/6666 , H01L2224/32245 , H01L2224/34 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/83801 , H01L2924/00014 , H01R12/712 , H01L2924/00 , H01L2224/37099
摘要： An electrical connector, includes a protection circuit for protecting circuits on a circuit board. The electrical connector includes a housing, a plurality of contacts secured to the housing, and a semiconductor device built into the housing. The semiconductor devices include an overvoltage protection device, and the plurality of contacts are grounded through the overvoltage protection device.
摘要翻译：电连接器包括用于保护电路板上电路的保护电路。电连接器包括壳体，固定到壳体的多个触点以及内置于壳体中的半导体器件。半导体器件包括过电压保护器件，并且多个触点通过过电压保护器件接地。

9. 外观设计

USD503691S1 Conductive clip for a semiconductor package 失效
标题翻译：用于半导体封装的导电夹
公开(公告)号：USD503691S1
公开(公告)日：2005-04-05
申请号：US29188754
申请日：2003-08-22
申请人： Martin Standing , Hazel Deborah Schofield
设计人： Martin Standing , Hazel Deborah Schofield
CPC分类号： H01L24/63 , H01L2224/34 , H01L2924/00014 , H01L2224/37099 , H01L2224/37599 , H01L2924/00012

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