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1. 发明公开

US20240109448A1 MONITORING ISOLATION RESISTANCE TO VALIDATE VEHICLE CHARGER FUNCTIONALITY 审中-公开
公开(公告)号：US20240109448A1
公开(公告)日：2024-04-04
申请号：US17955747
申请日：2022-09-29
申请人： Rivian IP Holdings, LLC
发明人： Aashiv Vij , Steven Schulz , Ming Li , Lixiang Wei
IPC分类号： B60L53/62 , B60L53/14 , G01R1/20 , G01R1/28 , H02J7/00
CPC分类号： B60L53/62 , B60L53/14 , G01R1/203 , G01R1/28 , H02J7/0031
摘要： Monitoring isolation resistance to validate vehicle charger functionality is provided. A system can include a first one or more resistors connected to a first terminal of a first direct current bus of a charger. The charger can be configured to deliver power to a first electric vehicle. The system can include a controller comprising circuitry. The controller can be configured to determine a resistance at the first one or more resistors. The controller can control delivery of power to the first electric vehicle responsive to a comparison of the resistance at the first one or more resistors with a threshold.

2. 发明公开

US20240027542A1 LOAD TESTING DEVICE 审中-公开
公开(公告)号：US20240027542A1
公开(公告)日：2024-01-25
申请号：US18273203
申请日：2022-01-31
申请人： TATSUMI RYOKI CO., LTD
发明人： Toyoshi KONDO
IPC分类号： G01R31/42 , G01R31/34 , G01R1/20
CPC分类号： G01R31/42 , G01R31/343 , G01R1/203 , G01R1/206
摘要： A load testing device includes a terminal unit, a main relay unit, a resistance unit, and a housing. The main relay unit and the switch group are used to switch a connection state between the first R-phase resistor group and the second R-phase resistor group between series and parallel, switch a connection state between the first S-phase resistor group and the second S-phase resistor group between series and parallel, and switch a connection state between the first T-phase resistor group and the second T-phase resistor group between series and parallel. A first accommodation region to a third accommodation region are located between a fourth accommodation region and a fifth accommodation region. The second accommodation region is located between the first accommodation region and the third accommodation region. The first accommodation region accommodates the first R-phase resistor group and the second R-phase resistor group.

3. 发明公开

US20230417805A1 CURRENT SENSING MODULE, VEHICLE SYSTEM AND METHOD OF PERFORMING CURRENT SENSING AND FAILURE DIAGNOSIS 审中-公开
公开(公告)号：US20230417805A1
公开(公告)日：2023-12-28
申请号：US18212156
申请日：2023-06-20
申请人： CYNTEC CO., LTD.
发明人： Tzu-Hao Hung , Shu-Wei Hsu
IPC分类号： G01R19/00 , G01R1/20 , G01R19/32 , G01R31/364
CPC分类号： G01R19/0092 , G01R1/203 , G01R19/32 , G01R31/364
摘要： A current sensing module includes a shunt resistor for receiving and sensing a current, a digital sensing circuit, and an analog sensing circuit. The shunt resistor includes a connecting part, a first resistive part and a second resistive part coupled in series to the first resistive part via the connecting part. The digital sensing circuit is coupled to the first resistive part for measuring a first analog voltage of the first resistive part when the current flows through the first resistive part, and providing a first digital measuring value associated with the first analog voltage. The analog sensing circuit is coupled to the second resistive part for measuring a second analog voltage of the second resistive part when the current flows through the second resistive part, and providing a second analog measuring value associated with the second analog voltage.

4. 发明公开

US20230408547A1 PROBE-CARD MULTILAYER WIRING SUBSTRATE AND PROBE CARD 审中-公开
公开(公告)号：US20230408547A1
公开(公告)日：2023-12-21
申请号：US18029676
申请日：2020-11-17
申请人： Japan Electronic Materials Corporation
发明人： Satoshi ABE , Tetsuo FUJIMOTO , Yusuke HARADA , Shinya HORI
IPC分类号： G01R1/073 , G01R1/20 , G01R1/44
CPC分类号： G01R1/07314 , G01R1/44 , G01R1/203
摘要： An object of the present invention is to provide a multilayer wiring substrate for probe card capable of preventing deterioration of a thin film resistor 30. Provided is a multilayer wiring substrate (an ST substrate) 15 for probe card, the multilayer wiring substrate being provided on a wiring path between an external terminal 120 and a probe 17 of a probe card 100, and having a base insulating film 41 formed on a top surface of the multilayer wiring substrate, in which the multilayer wiring substrate 15 includes: a thin film resistor 30 including a thin film formed on the base insulating film 41 and to which a pair of connection electrodes 33 are connected; an embedded heat sink 31 that is embedded to face the thin film resistor 30 via the base insulating film 41 and includes a material having a thermal conductivity higher than that of the base insulating film 41; and a cover insulating film 43 that is formed in a region corresponding to the thin film resistor 30 and covers the thin film resistor 30, and the embedded heat sink 31 includes a heat dissipating portion 50 that is not covered with the base insulating film 41 outside a region in which the cover insulating film 43 is formed.

5. 发明公开

US20230341440A1 RESISTORS, CURRENT SENSE RESISTORS, BATTERY SHUNTS, SHUNT RESISTORS, AND METHODS OF MAKING 审中-公开
公开(公告)号：US20230341440A1
公开(公告)日：2023-10-26
申请号：US18096951
申请日：2023-01-13
申请人： VISHAY DALE ELECTRONICS, LLC
发明人： Todd Wyatt , Tom Bertsch , Joshua Johnson , Aaron Krause , Sara Vo , Darin Glenn
IPC分类号： G01R1/20 , H01C7/13 , H01C1/148 , H01C17/232
CPC分类号： G01R1/203 , H01C7/13 , H01C1/148 , H01C17/232
摘要： A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.

6. 发明授权

US11789045B2 Current sensing circuit 有权
公开(公告)号：US11789045B2
公开(公告)日：2023-10-17
申请号：US17830487
申请日：2022-06-02
申请人： uPI semiconductor corp.
发明人： Chao-Chung Huang , Kuo-Jen Kuo , Yi-Xian Jan
IPC分类号： G01R19/00 , G01R1/20 , H03F3/343 , G01R19/10
CPC分类号： G01R19/0092 , G01R1/203 , G01R19/10 , H03F3/343
摘要： A current sensing circuit includes a filtering circuit, an amplifier, a first resistor, a first transistor and a second transistor. The filtering circuit is coupled to two terminals of a sensing resistor. The amplifier has a first input terminal, a second input terminal and an output terminal. The second input terminal is coupled to the filtering circuit. The first resistor is coupled between the filtering circuit and the first input terminal of amplifier. A control terminal of the first transistor is coupled to the output terminal of amplifier, and its first terminal is coupled to the first input terminal of amplifier and its second terminal is grounded through a second resistor. A control terminal of the second transistor is coupled to the output terminal of amplifier, and its first terminal is coupled to the second input terminal of amplifier and its second terminal is grounded through a third resistor.

7. 发明公开

US20230266368A1 CURRENT MEASURING APPARATUS WITH REDUNDANT CURRENT MEASUREMENT 审中-公开
公开(公告)号：US20230266368A1
公开(公告)日：2023-08-24
申请号：US18005345
申请日：2021-04-20
申请人： Isabellenhütte Heusler GmbH & Co. KG
发明人： Jan MARIEN , Benedikt KRAMM
IPC分类号： G01R15/20 , G01R1/20
CPC分类号： G01R15/207 , G01R1/203
摘要： The invention relates to a current measuring apparatus for redundant measurement of an electric current (I) with a low-resistance current measuring resistor (1) for current measurement according to the four-lead technique and with a magnetic field sensor (14). The invention provides that the electric current (I) to be measured in the current measuring apparatus is divided into a main current path with a main current (11) and a secondary current path with a secondary current (12), the main current path and the secondary current path together forming a parallel circuit. The low-resistance current measuring resistor (1) is arranged in the main current path and has the main current (11) flowing through it, while the magnetic field sensor (14) is arranged in the secondary current path and measures the secondary current (12).

8. 发明授权

US11726114B2 Current sensor element, current sensor unit, and method of measuring a current 有权
公开(公告)号：US11726114B2
公开(公告)日：2023-08-15
申请号：US17405469
申请日：2021-08-18
申请人： TE Connectivity Germany GmbH
发明人： Jens Gruendler
IPC分类号： G01R19/00 , G01R31/3828 , G01R1/20 , G01R19/32
CPC分类号： G01R19/0092 , G01R1/203 , G01R19/32 , G01R31/3828
摘要： A current sensor element includes a resistance section, a first electrically conductive connection section connected to a first end of the resistance section and having a first voltage measurement contact, and a second electrically conductive connection section connected to a second end of the resistance section and having a second voltage measurement contact and a third voltage measurement contact. The first electrically conductive connection section and the second electrically conductive connection section are connectable to feed a current to be measured through the resistance section. The first voltage measurement contact, the second voltage measurement contact, and the third voltage measurement contact are arranged in a way that a first resistance between the first voltage measurement contact and the second voltage measurement contact is smaller than a second resistance between the first voltage measurement contact and the third voltage measurement contact.

9. 发明授权

US11714139B2 Electronic load apparatus 有权
公开(公告)号：US11714139B2
公开(公告)日：2023-08-01
申请号：US17371976
申请日：2021-07-09
申请人： CHROMA ATE INC.
发明人： Wen-Chung Chen , Ming-Ing Tsou , Chien-Hsing Huang , Chun-Sheng Hung , Kuan-Hung Lee
IPC分类号： G01R31/40 , G01R19/10 , G01R1/20
CPC分类号： G01R31/40 , G01R1/203 , G01R19/10
摘要： The present disclosure relates to an electronic load apparatus. An embodiment of the present disclosure includes an electronic load apparatus including: a measurement resistor, a reference circuit, a transistor, and a feedback circuit. The measurement resistor includes a first contact, a second contact, a third contact, and a fourth contact. The first contact and the second contact are located at a first end of the measurement resistor. The third contact and the fourth contact are located at a second end of the measurement resistor. A reference power (or a reference voltage) electrically connects to the reference circuit. The reference circuit and the first contact of the measurement resistor are electrically connected. The transistor includes a drain, a gate, and a source. The reference circuit and the gate of the transistor are electrically connected. One of the source and the drain of the transistor electrically connects to the second contact of the measurement resistor. The other one of the drain and the source of the transistor electrically connects to an output terminal of a unit under test. The feedback circuit and the fourth contact of the measurement resistor are electrically connected. The feedback circuit and the reference circuit are electrically connected.

10. 发明公开

US20230221356A1 CURRENT SENSE CIRCUIT HAVING A TEMPERATURE COMPENSATED RESPONSE 审中-公开
公开(公告)号：US20230221356A1
公开(公告)日：2023-07-13
申请号：US18149331
申请日：2023-01-03
申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
发明人： Thomas Patrick DUFFY
IPC分类号： G01R19/32 , G01R1/20 , H01L23/495 , H01L23/00
CPC分类号： G01R19/32 , G01R1/203 , H01L23/49568 , H01L24/48 , H01L28/24 , H01L23/49541 , H01L2924/1424 , H01L2224/48245
摘要： A package for a current sense circuit may include a lead-frame having a shunt resistance configured to generate a shunt voltage, which can be used to measure a current through the lead-frame. The shunt resistance associated with the lead-frame may be highly variable with temperature, which can cause errors in the current measurement. Accordingly, a current sense circuit can include an amplifier with an input resistor having a composite temperature coefficient configured to match a lead-frame temperature coefficient so that an output of the amplifier is compensated to remove variations in the shunt resistance of the lead-frame due to temperature.

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