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1. 发明申请

US20180151532A1 WIRE BONDING APPARATUS 审中-公开
公开(公告)号：US20180151532A1
公开(公告)日：2018-05-31
申请号：US15571694
申请日：2015-12-25
申请人： KAIJO CORPORATION
发明人： Riki JINDO , Akio SUGITO
IPC分类号： H01L23/00 , B23K1/06 , B23K1/00 , B23K3/06 , B23K3/08
CPC分类号： H01L24/78 , B23K1/0016 , B23K1/06 , B23K3/063 , B23K3/08 , B23K20/007 , B23K2101/36 , B23K2101/42 , H01L24/45 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/78 , H01L2224/7801 , H01L2224/78268 , H01L2224/78301 , H01L2224/78353 , H01L2224/78621 , H01L2224/789 , H01L2224/78901 , H01L2224/78925 , H01L2224/85045 , H01L2224/85205 , H01L2224/859 , H01L2924/14 , H01L2924/00014
摘要： To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

2. 发明申请

US20180114733A1 METHOD AND APPARATUS FOR DETECTING AND REMOVING DEFECTIVE INTEGRATED CIRCUIT PACKAGES 审中-公开
公开(公告)号：US20180114733A1
公开(公告)日：2018-04-26
申请号：US15437737
申请日：2017-02-21
申请人： Texas Instruments Incorporated
发明人： Zheng Qing Fan , Hui Yin , Qing Bo Wu , Tian Sheng Chen , Guan Quan Wen , Ding Han
IPC分类号： H01L21/66 , H01L21/56 , H01L21/48 , H01L23/544 , H01L21/67 , H01L23/00 , H01L23/495 , H01L23/31
CPC分类号： H01L22/20 , H01L21/4821 , H01L21/561 , H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L22/12 , H01L23/3107 , H01L23/3114 , H01L23/49541 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48247 , H01L2224/49176 , H01L2224/73265 , H01L2224/75901 , H01L2224/7598 , H01L2224/78901 , H01L2224/7898 , H01L2224/83908 , H01L2224/859 , H01L2224/92247 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A method for making integrated circuit (IC) packages includes providing a leadframe strip having a plurality of leadframe units and providing the leadframe strip to an operating station. The operating station is operable to perform one or more tests on the plurality of leadframe units in the making of IC packages. The method includes obtaining a database that has the locations of leadframe units in the leadframe strip stored in the database. The method also includes performing the one or more tests on the plurality of leadframe units and updating the database in response to the results of the testing.

3. 发明申请

US20170016950A1 Screening Methodology to Eliminate Wire Sweep in Bond and Assembly Module Packaging 审中-公开
标题翻译：筛选方法，消除绑定和装配模块包装中的电线扫描
公开(公告)号：US20170016950A1
公开(公告)日：2017-01-19
申请号：US15278373
申请日：2016-09-28
申请人： International Business Machines Corporation
发明人： Stephen Peter Ayotte , Michael Russell Uy Gonzales , Mark Tiam Weng Lam
IPC分类号： G01R31/04 , G01R31/02
CPC分类号： G01R31/041 , G01R31/025 , G01R31/048 , G01R31/2896 , H01L24/78 , H01L24/85 , H01L2224/78901 , H01L2224/859 , H01L2924/00014 , H01L2924/3862 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.
摘要翻译：一批电子模块的质量控制测试。对制造的电子模块进行一系列测试，包括对先前测试模块的故障率敏感的测试。具体来说，对模块批次进行由两相组成的第一测试。然后响应于在第一测试阶段的故障模块的子集中的线扫失失败的检测来执行进一步的筛选。进一步的筛选是通过第一个测试阶段的模块，并排除了第一个测试阶段失败的模块。

4. 发明申请

US20160364854A1 Inspection system and method for defect analysis of wire connections 审中-公开
标题翻译：电线连接缺陷分析检测系统及方法
公开(公告)号：US20160364854A1
公开(公告)日：2016-12-15
申请号：US15180837
申请日：2016-06-13
申请人： WiTrins s.r.o
发明人： Roman Franz Wieser
IPC分类号： G06T7/00 , H04N5/225 , H04N5/33 , H04N5/369
CPC分类号： G06T7/0004 , G01B11/0608 , G01B11/24 , G01N21/956 , G01N2021/95661 , G06T2207/10024 , G06T2207/10048 , G06T2207/30148 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/859 , H04N5/2256 , H04N5/332 , H04N5/3692
摘要： The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the product so as to extend within the detection plane, the inspection system comprising a second projection device, the second projection device having at least one illuminating means (27), the illuminating means being capable of projecting diffuse light onto the product, light of the diffuse light reflected by the product in the detection plane being detectable by means of the line scan camera.
摘要翻译：本发明涉及一种用于对产品（12）的基板（13）和半导体部件（15,16）之间的导线连接（11）进行缺陷分析的检查系统（10），所述检查系统包括第一投影装置（24），行扫描照相机（28）和处理装置，所述第一投影装置具有至少一个狭缝投影装置（25），所述狭缝投影装置能够将光狭缝（33）投射到丝线（21）上，22），线垂直扫描照相机的检测平面（39）中由线反射的光狭缝的光优选地垂直于衬底表面（14）可以通过线扫描照相机检测到，通过所述处理装置从所述行扫描照相机的多个行扫描图像信息导出所述乘积的分析图像信息，其中所述狭缝投影装置相对于所述行扫描照相机被布置成使得所述光狭缝罐投影到产品上以便在检测平面内延伸，检查系统包括第二投影装置，第二投影装置具有至少一个照明装置（27），该照明装置能够将漫射光投射到产品上，由检测平面中的产品反射的漫射光的光可以通过行扫描照相机检测。

5. 发明授权

US09470740B2 Screening methodology to eliminate wire sweep in bond and assembly module packaging 有权
标题翻译：筛选方法，以消除粘合和组装模块包装中的电线扫描
公开(公告)号：US09470740B2
公开(公告)日：2016-10-18
申请号：US13834039
申请日：2013-03-15
申请人： International Business Machines Corporation
发明人： Stephen Peter Ayotte , Michael Russell Uy Gonzales , Mark Tiam Weng Lam
IPC分类号： G01R31/02 , G01R31/04 , G01R31/28 , H01L23/00
CPC分类号： G01R31/041 , G01R31/025 , G01R31/048 , G01R31/2896 , H01L24/78 , H01L24/85 , H01L2224/78901 , H01L2224/859 , H01L2924/00014 , H01L2924/3862 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.
摘要翻译：一批电子模块的质量控制测试。对制造的电子模块进行一系列测试，包括对先前测试模块的故障率敏感的测试。具体来说，对模块批次进行由两相组成的第一测试。然后响应于在第一测试阶段的故障模块的子集中的线扫失失败的检测来执行进一步的筛选。进一步的筛选是通过第一个测试阶段的模块，并排除了第一个测试阶段失败的模块。

6. 发明授权

US09314869B2 Method of recovering a bonding apparatus from a bonding failure 有权
标题翻译：从接合故障中恢复接合装置的方法
公开(公告)号：US09314869B2
公开(公告)日：2016-04-19
申请号：US13350363
申请日：2012-01-13
申请人： Wai Wah Lee , Jun Feng Li , Wei Boon Wong , Soo Kin Kenny Tan
发明人： Wai Wah Lee , Jun Feng Li , Wei Boon Wong , Soo Kin Kenny Tan
IPC分类号： B23K20/00 , H01L23/00
CPC分类号： B23K20/007 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/78268 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01327 , H01L2924/12036 , H01L2224/45099 , H01L2224/484 , H01L2924/00
摘要： A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.
摘要翻译：公开了一种从接合故障恢复接合装置以恢复用于半导体芯片制造的正常操作状态的方法。接合装置包括：i）用于将导线接合在半导体芯片和基板之间的接合工具; 和ii）位置传感器。具体地说，该方法包括以下步骤：a）位置传感器确定接合工具在接合工具接触表面时的位置，以将线接合到衬底; b）接合装置基于接合工具的位置检测由半导体从基板脱离而引起的接合故障; 以及c）所述接合装置将所述半导体芯片与所述导线分开。

7. 发明授权

US09299653B2 Electronic component and method for producing same 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US09299653B2
公开(公告)日：2016-03-29
申请号：US13696862
申请日：2011-05-09
申请人： Minoru Satoh , Takehiro Yamashita , Atsushi Nagai , Yasuo Adachi
发明人： Minoru Satoh , Takehiro Yamashita , Atsushi Nagai , Yasuo Adachi
IPC分类号： H05K7/04 , H01B1/02 , H01L23/498 , H01B1/16 , H01L23/00 , H01K13/04 , H01L23/15
CPC分类号： H01L23/49883 , H01B1/16 , H01L23/15 , H01L24/45 , H01L24/48 , H01L2224/05553 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48599 , H01L2224/48699 , H01L2224/85399 , H01L2224/859 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： This electronic component is provided with an inorganic substrate, a conductor film formed on a surface of the substrate, and bonding wires bonded to a part of said conductor film, and wire bonding sections are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal.
摘要翻译：该电子部件设置有无机基板，形成在基板的表面上的导体膜和与导体膜的一部分接合的接合引线，并且在电子部件的至少一部分上形成引线接合部。至少形成上述引线接合部分的导体膜的部分包含由Ag或以Ag为主要成分的合金的Ag基金属和涂覆所述Ag基金属的金属氧化物，并且其具有作为成分元素，选自由Al，Zr，Ti，Y，Ca，Mg和Zn组成的组中的任何元素。金属氧化物的涂布量相对于上述Ag系金属100质量份为0.02〜0.1质量份。

8. 发明申请

US20150246411A1 WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING 有权
标题翻译：电线连接装置和线路接合方法
公开(公告)号：US20150246411A1
公开(公告)日：2015-09-03
申请号：US14712927
申请日：2015-05-15
申请人： SHINKAWA LTD.
发明人： NAOKI SEKINE , MOTOKI NAKAZAWA , YONG DU
IPC分类号： B23K20/00 , H01L23/00 , B23K20/10
CPC分类号： B23K20/007 , B23K20/004 , B23K20/005 , B23K20/10 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H01L2224/78301 , H01L2224/78343 , H01L2224/78349 , H01L2224/789 , H01L2224/85186 , H01L2224/85205 , H01L2224/859 , H01L2224/85986 , H01L2924/00014 , H01L2924/3011 , H01L2924/00 , H01L2924/00015 , H01L2924/01012 , H01L2924/0102 , H01L2924/20753 , H01L2924/00012 , H01L2224/4554
摘要： Provided is a wire-bonding apparatus 10 including a capillary 28 through which a wire 30 is inserted, a nonsticking determination circuit 36, and a controller 80. The nonsticking determination circuit 36 applies a predetermined alternating-current electrical signal between the wire held by the capillary and the bonding target, obtains a capacitance value between the wire held by the capillary and the bonding target, determines that the wire is disconnected from the bonding target when the capacitance value decreases after the first bonding operation, and determines that the disconnected wire drops down and is brought into contact with the bonding target when the capacitance value returns to an original value before reaching the second bonding point.
摘要翻译：提供了一种引线接合装置10，其包括插入有导线30的毛细管28，非支架确定电路36和控制器80.非放置确定电路36在由毛细管和接合目标，获得由毛细管保持的线与接合目标之间的电容值，当在第一接合操作之后电容值减小时，确定线与接合目标断开，并且确定断开的线下降当达到第二接合点之前电容值返回到原始值时，与接合目标接触。

9. 发明申请

US20150235981A1 WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION 审中-公开
标题翻译：具有两步自由空气球形成的线接合方法
公开(公告)号：US20150235981A1
公开(公告)日：2015-08-20
申请号：US14552441
申请日：2014-11-24
申请人： Poh Leng Eu , Cheng Choi Yong
发明人： Poh Leng Eu , Cheng Choi Yong
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48465 , H01L2224/78 , H01L2224/78268 , H01L2224/78271 , H01L2224/78301 , H01L2224/85045 , H01L2224/859 , H01L2924/00014 , H01L2924/181 , H01L2924/18165 , H01L2924/2075 , H01L2924/00015 , H01L2224/05599 , H01L2924/20754 , H01L2924/20755 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/00012 , H01L2924/00
摘要： A method of attaching a bond wire to an electrical contact pad includes performing a first electric flame off (EFO) on the end of the bond wire at a first setting to pre-form a free air ball (FAB) on the end of the wire, and performing a second EFO on the end of the bond wire at a second setting, after performing the first EFO, to fully form the FAB.
摘要翻译：将接合线附接到电接触焊盘的方法包括在第一设置处在接合线的端部执行第一电火焰（EFO），以在导线的端部上预先形成自由空气球（FAB）并且在执行所述第一EFO之后，在所述第二设置处，在所述接合线的末端执行第二EFO以完全形成所述FAB。

10. 发明申请

US20150162299A1 INTEGRATED WIRE BONDER AND 3D MEASUREMENT SYSTEM WITH DEFECT REJECTION 审中-公开
标题翻译：集成线束和三维测量系统与缺陷拒绝
公开(公告)号：US20150162299A1
公开(公告)日：2015-06-11
申请号：US14523338
申请日：2014-10-24
申请人： Fairchild Semiconductor Corporation
发明人： Daren W. Keller
IPC分类号： H01L23/00 , H01L21/66 , H01L21/67
CPC分类号： H01L24/78 , H01L21/67253 , H01L21/67282 , H01L21/67288 , H01L22/12 , H01L22/26 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2223/54413 , H01L2223/54433 , H01L2223/54473 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48137 , H01L2224/48177 , H01L2224/48227 , H01L2224/48247 , H01L2224/78753 , H01L2224/789 , H01L2224/78901 , H01L2224/85801 , H01L2224/8585 , H01L2224/859 , H01L2924/00014 , H01L2924/1203 , H01L2924/12033 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/00 , H01L2924/206
摘要： An apparatus comprises a wire bonder system including a wire bonding device, a measuring device and a rejection device. The wire bonding device is configured to attach wire bond type electrical interconnect to an electronic assembly. A wire bond is formed between a first semiconductor device and a second electronic device to form at least a portion of the electronic assembly. The measuring device is configured to perform a three dimensional measurement associated with a wire bond, and the rejection device is configured to identify an electronic assembly for rejection according to the three dimensional wire bond measurement.
摘要翻译：一种装置包括一种包括接线装置，测量装置和拒收装置的引线接合系统。引线接合装置被配置为将引线接合型电互连件附接到电子组件。在第一半导体器件和第二电子器件之间形成引线接合以形成电子组件的至少一部分。测量装置被配置为执行与线接合相关联的三维测量，并且所述拒绝装置被配置为根据三维线接合测量来识别用于拒绝的电子组件。

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