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1. 发明申请

US20180246067A1 ARRANGEMENT AND METHOD FOR INFLUENCING AND/OR DETECTING A DYNAMIC OR STATIC PEOPERTY OF A SUPPORT STRUCTURE 审中-公开
公开(公告)号：US20180246067A1
公开(公告)日：2018-08-30
申请号：US15757648
申请日：2016-08-29
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
发明人： Dirk MAYER , Rogério SALLOUM
IPC分类号： G01N29/22 , H01L41/053 , H01L41/09 , G01N29/04 , G01N29/24
CPC分类号： G01N29/223 , B32B3/08 , B32B3/266 , B32B5/024 , B32B5/12 , B32B5/26 , B32B7/12 , B32B2250/20 , B32B2260/023 , B32B2260/046 , B32B2262/02 , B32B2262/101 , B32B2262/106 , B32B2307/20 , B32B2307/202 , B32B2307/206 , B32B2419/00 , B32B2605/08 , B32B2605/18 , G01N1/00 , G01N29/04 , G01N29/2437 , H01L41/053 , H01L41/0533 , H01L41/08 , H01L41/09 , H01L41/23
摘要： An arrangement and a method are described for influencing and/or detecting a dynamic or static property of a support structure which has a support structure surface, with at least one planar first actuator element that includes at least one electrically and/or magnetically activated transducer material, and a fiber composite material which joins the first actuator element indirectly or directly to the support structure surface in a planar, which has at least one first fiber layer and a curable matrix. The first fiber layer at least partially covers the first actuator element resting indirectly or directly on the support structure surface, protrudes beyond the first actuator element on both sides along at least a spatial direction running parallel to the support structure surface, and permanently adheres directly to at least some areas of the support structure surface at least in the regions protruding beyond the first actuator element by means of the curable matrix.

2. 发明授权

US09887345B2 Piezo-stack with passivation, and a method for the passivation of a piezo-stack 有权
公开(公告)号：US09887345B2
公开(公告)日：2018-02-06
申请号：US14369377
申请日：2012-12-19
申请人： Continental Automotive GmbH
发明人： Thomas Richter , Harald Johannes Kastl , Claus Zumstrull
IPC分类号： H01L41/083 , H01L41/053 , H01L41/22 , H01L41/23 , H01L41/338 , H01L41/277
CPC分类号： H01L41/083 , H01L41/053 , H01L41/0533 , H01L41/23 , H01L41/277 , H01L41/338 , Y10T29/42
摘要： A piezo-stack includes a plurality of lateral surfaces and a first passivation layer applied to a first lateral surface. The first passivation layer terminates flush with opposing lateral surfaces that adjoin the first lateral surface.

3. 发明申请

US20180033952A1 ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME 审中-公开
公开(公告)号：US20180033952A1
公开(公告)日：2018-02-01
申请号：US15646399
申请日：2017-07-11
申请人： TAIYO YUDEN CO., LTD.
发明人： Shinji YAMAMOTO , Jumpei KONNO , Takashi MIYAGAWA
IPC分类号： H01L41/23 , H01L41/053 , H03H9/25 , H01L41/312 , H03H3/08 , H01L41/047 , H01L41/29
CPC分类号： H01L41/23 , H01L41/0475 , H01L41/0533 , H01L41/1873 , H01L41/29 , H01L41/312 , H01L2224/81192 , H01L2224/97 , H03H3/02 , H03H3/08 , H03H9/0523 , H03H9/059 , H03H9/14541 , H03H9/25
摘要： A method of fabricating an electronic device, the method including: arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and bonding a pad located on the lower surface of the device chip and the bump by applying an ultrasonic wave to the device chip from an upper surface of the device chip.

4. 发明申请

US20180033951A1 METHOD FOR PRODUCING HERMETIC PACKAGE 审中-公开
公开(公告)号：US20180033951A1
公开(公告)日：2018-02-01
申请号：US15552535
申请日：2016-02-25
申请人： Nippon Electric Glass Co., Ltd.
发明人： Toru SHIRAGAMI
IPC分类号： H01L41/23 , C04B37/04 , H01L41/053
CPC分类号： H01L41/23 , B32B18/00 , C04B37/045 , C04B2235/5436 , C04B2235/5463 , C04B2235/9607 , C04B2235/963 , C04B2237/10 , C04B2237/32 , C04B2237/343 , C04B2237/52 , C04B2237/592 , C04B2237/708 , H01L23/02 , H01L23/08 , H01L23/10 , H01L41/053 , H03H3/02
摘要： A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.

5. 发明授权

US09882540B2 Method for manufacturing surface acoustic wave apparatus 有权
公开(公告)号：US09882540B2
公开(公告)日：2018-01-30
申请号：US14704716
申请日：2015-05-05
申请人： KYOCERA Corporation
发明人： Toru Fukano
IPC分类号： H03H3/08 , H03H9/10 , H01L41/23 , H03H3/007 , H03H9/05 , H03H9/145 , H01L41/27 , H05K3/34 , H05K1/14 , H03H9/00
CPC分类号： H03H3/08 , H01L41/23 , H01L41/27 , H01L2224/11 , H01L2224/94 , H01L2924/16235 , H03H3/007 , H03H9/008 , H03H9/0576 , H03H9/059 , H03H9/1071 , H03H9/1092 , H03H9/14582 , H03H2003/0071 , H05K1/144 , H05K3/3426 , Y10T29/42 , Y10T29/49005 , Y10T29/49144 , Y10T29/49155
摘要： Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.

6. 发明申请

US20170332176A1 MICROMECHANICAL COMPONENT AND METHOD FOR PACKAGING A SUBSTRATE HAVING A MICRO-ELECTROMECHANICAL MICROPHONE STRUCTURE WHICH INCLUDES AT LEAST ONE PIEZOELECTRIC LAYER 审中-公开
公开(公告)号：US20170332176A1
公开(公告)日：2017-11-16
申请号：US15585333
申请日：2017-05-03
申请人： Robert Bosch GmbH
发明人： Daniel Pantel , Fabian Purkl , Kerrin Doessel
IPC分类号： H04R17/02 , H01L41/113 , H01L41/053 , H01L41/23 , H04R1/04
CPC分类号： H04R17/02 , B81B7/0061 , B81B2201/0257 , H01L41/0533 , H01L41/1132 , H01L41/1134 , H01L41/23 , H01L2224/48137 , H04R1/04 , H04R17/025 , H04R31/00 , H04R2201/003
摘要： A micromechanical component having a substrate which includes a micro-electromechanical microphone structure, the micro-electromechanical microphone structure encompassing at least one piezoelectric layer and at least one polymer mass as at least part of a packaging of the substrate fitted with the micro-electromechanical microphone structure, which is in contact with at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure. A method is also described for packaging a substrate having a micro-electromechanical microphone structure encompassing at least one piezoelectric layer by developing at least a portion of a packaging of the substrate fitted with the micro-electromechanical microphone structure from at least one polymer mass, and the at least one polymer mass being applied directly on at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure.

7. 发明申请

US20170317264A1 ULTRASONIC TRANSDUCER AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20170317264A1
公开(公告)日：2017-11-02
申请号：US15581169
申请日：2017-04-28
申请人： CANON KABUSHIKI KAISHA
发明人： Toshio Tomiyoshi
IPC分类号： H01L41/08 , H01L41/23 , B06B1/10 , H01L41/27 , B06B1/06
CPC分类号： H01L41/0825 , B06B1/0292 , B06B1/06 , B06B1/10 , H01L41/0533 , H01L41/23 , H01L41/27
摘要： In an ultrasonic transducer manufacturing method, an ultrasonic device is mounted on a substrate, and a protective film having an acoustic matching layer thereon is prepared. Then, the protective film having the acoustic matching layer thereon is placed over the ultrasonic device such that the acoustic matching layer is in contact with the ultrasonic device.

8. 发明授权

US09651441B2 Pressure sensor device with high sensitivity and high accuracy 有权
公开(公告)号：US09651441B2
公开(公告)日：2017-05-16
申请号：US14704012
申请日：2015-05-05
申请人： Continental Automotive Systems, Inc.
发明人： Jen-Huang Albert Chiou , Shiuh-Hui Steven Chen
IPC分类号： G01L9/00 , H01L41/332 , H01L41/23 , H01L41/312 , H01L41/113 , B81B3/00 , B81B7/02 , B81C1/00
CPC分类号： G01L9/0054 , B81B3/00 , B81B7/02 , B81C1/00 , G01L9/0042 , G01L9/0047 , G01L9/0052 , H01L41/1132 , H01L41/23 , H01L41/312 , H01L41/332
摘要： The voltages output from a low-pressure MEMS sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device with corner trench. Nonlinearity increased by thinning the diaphragm is reduced by simultaneously creating a cross stiffener to the bottom side of the diaphragm. A rim, anchors, and a stiffener pad can also be added to further stiffen the thinner diaphragm and further reduce pressure nonlinearity.

9. 发明申请

US20160252068A1 PIEZO ACTUATOR FOR A FUEL INJECTOR, AND FUEL INJECTOR 审中-公开
标题翻译：燃油喷射器用的PIEZO执行器和燃油喷射器
公开(公告)号：US20160252068A1
公开(公告)日：2016-09-01
申请号：US15029409
申请日：2015-06-11
申请人： Continental Automotive GmbH
发明人： Willibald SCHÜRZ , Werner REIM
IPC分类号： F02M63/00 , H01L41/053 , H01L41/083 , H01L41/09
CPC分类号： F02M63/0026 , F02M2200/21 , H01L41/0533 , H01L41/0536 , H01L41/083 , H01L41/09 , H01L41/23
摘要： A piezo actuator for a fuel injector, including: a piezo layer stack having a longitudinal extension; and an insulation layer surrounding the piezo layer stack. The insulation layer has an insulation layer outer surface, facing away from the piezo layer stack, which defines an outer diameter of the insulation layer. In addition, a preloading device for preloading the piezo layer stack is also provided along the longitudinal extension, wherein the preloading device has a preloading device inner surface, facing towards the piezo layer stack, which defines an inner diameter of the preloading device. In a non-assembled state, the outer diameter of the insulation layer is greater that the inner diameter of the preloading device, such that, in an assembled state, the insulation layer is compressed in the preloading device. The invention also relates to a fuel injector having said piezo actuator.
摘要翻译：一种用于燃料喷射器的压电致动器，包括：具有纵向延伸的压电层堆叠; 以及围绕压电层堆叠的绝缘层。绝缘层具有绝缘层外表面，其背离压电层堆叠，其限定绝缘层的外径。另外，沿着纵向延伸部还设置有用于预加载压电层堆叠的预加载装置，其中预加载装置具有面向压电层堆叠的预加载装置内表面，其限定预加载装置的内径。在非组装状态下，绝缘层的外径大于预加载装置的内径，使得在组装状态下，绝缘层在预加载装置中被压缩。本发明还涉及具有所述压电致动器的燃料喷射器。

10. 发明授权

US09379311B1 Apparatus for manufacturing piezoelectric actuators 有权
标题翻译：用于制造压电致动器的装置
公开(公告)号：US09379311B1
公开(公告)日：2016-06-28
申请号：US14172833
申请日：2014-02-04
申请人： Western Digital Technologies, Inc.
发明人： Yih-Jen D. Chen , Robert J. McNab
IPC分类号： H01L41/25 , G11B5/48 , H01L41/253 , H01L41/09 , H01L41/338 , H02N1/00 , H02N2/00
CPC分类号： G11B5/483 , G11B5/4826 , G11B5/4873 , H01L41/053 , H01L41/0533 , H01L41/0986 , H01L41/23 , H01L41/25 , H01L41/253 , H01L41/338 , H02N1/008 , H02N2/22 , Y10T29/42 , Y10T29/49025 , Y10T29/49146 , Y10T29/49155
摘要： An apparatus for peripherally encapsulating a plurality of piezoelectric elements includes a first fixture with a fixture base and a plurality of protrusions extending from the fixture base. Each protrusion includes a distal support surface that is approximately the same size as an exposed portion of a first side of each of the plurality of piezoelectric elements. The apparatus includes first and second alignment combs, each including a plurality of tines that are spaced to position each of the plurality of piezoelectric elements there between. The tines of the second alignment comb are oriented approximately orthogonally relative to the tines of the first alignment comb.
摘要翻译：用于外围封装多个压电元件的装置包括具有固定基座的第一固定件和从夹具基座延伸的多个突起。每个突起包括与多个压电元件中的每一个的第一侧的暴露部分大致相同尺寸的远侧支撑表面。该装置包括第一和第二对准梳，每个梳状物包括多个尖齿，其间隔开以在其间定位多个压电元件。第二对准梳的齿相对于第一对准梳的尖齿大致正交定向。

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