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1. 发明申请

US20190013975A1 TRANSMITTER, TRANSMISSION METHOD, RECEIVER, AND RECEPTION METHOD 审中-公开
公开(公告)号：US20190013975A1
公开(公告)日：2019-01-10
申请号：US16065997
申请日：2017-01-04
申请人： SONY CORPORATION
发明人： KENICHI KAWASAKI , HIROYUKI YAMAGISHI , TAKAHIRO TAKEDA
IPC分类号： H04L27/00 , H04B3/52 , H04Q1/24
CPC分类号： H04L27/0002 , H01P3/165 , H01Q13/06 , H04B1/40 , H04B3/52 , H04B17/17 , H04B17/29 , H04Q1/24
摘要： The present technology relates to a transmitter, a transmission method, a receiver, and a reception method, and particularly to a transmitter, a transmission method, a receiver, and a reception method that can keep upsizing and cost increase to a minimum. The transmitter and the receiver have a detection mode and a communication mode as operation modes. The detection mode detects contact between a first waveguide on the side of the transmitter and a second waveguide on the side of the receiver. The communication mode sends or receives a modulated signal, acquired through frequency conversion of a baseband signal, via the first and second waveguides. The transmitter sends a given signal to the first waveguide in the detection mode. The transmitter and the receiver go from the detection mode to the communication mode in response to a given signal received by the receiver via the second waveguide and send and receive the modulated signal via the first and second waveguides in the communication mode. The present technology is applicable, for example, to communication via waveguides.

2. 发明授权

US09825348B2 Signal transmission system, connector apparatus, electronic device, and signal transmission method 有权
公开(公告)号：US09825348B2
公开(公告)日：2017-11-21
申请号：US15083986
申请日：2016-03-29
申请人： Sony Semiconductor Solutions Corporation
发明人： Hidekazu Kikuchi , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
IPC分类号： H04B7/00 , H01P5/02 , H04B7/24 , H01P3/12 , H01P5/107 , H04B3/56 , H01R13/66 , H01R103/00 , H01R13/6461 , H01R24/28 , H01R24/76 , H05K1/02
CPC分类号： H01P5/02 , H01P1/208 , H01P3/12 , H01P3/121 , H01P3/165 , H01P5/024 , H01P5/082 , H01P5/087 , H01P5/1022 , H01P5/107 , H01P5/18 , H01P5/182 , H01P5/188 , H01R13/6461 , H01R13/665 , H01R24/28 , H01R24/76 , H01R2103/00 , H04B3/56 , H04B7/24 , H05K1/0225 , H05K1/0239 , H05K2201/093 , H05K2201/09672 , H05K2201/0969 , H05K2201/09754
摘要： A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

3. 发明申请

US20170207510A1 PRINTED CIRCUIT BOARD STRUCTURE HAVING ELECTROMAGNETIC-TUNNEL EMBEDDED ARCHITECTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20170207510A1
公开(公告)日：2017-07-20
申请号：US15043288
申请日：2016-02-12
申请人： Korea Advanced Institute of Science and Technology
发明人： Hyo Hoon Park , Hyeon Min Bae , Tae Woo Lee
IPC分类号： H01P5/107 , H01P5/08 , H05K1/02 , H01P11/00 , H01P3/16 , H01P5/02
CPC分类号： H01P3/165 , H01P1/042 , H01P3/122 , H01P5/02 , H01P5/087 , H01P5/107 , H01P11/001 , H01P11/006 , H05K1/0243
摘要： Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

4. 发明申请

US20170005529A1 SYSTEM AND METHOD FOR TRANSMITTING DATA OR POWER ACROSS A STRUCTURAL COMPONENT 审中-公开
标题翻译：用于通过结构部件传输数据或功率的系统和方法
公开(公告)号：US20170005529A1
公开(公告)日：2017-01-05
申请号：US15113130
申请日：2015-01-15
申请人： THE WELDING INSTITUTE
发明人： Paul Burling
IPC分类号： H02J50/20 , H02J50/80 , H01P3/16
CPC分类号： H02J50/20 , H01P3/165 , H01Q13/26 , H02J50/80
摘要： A system is disclosed for transmitting data and/or power across a structural component, comprising: a structural component, a first transducer and a second transducer. The structural component is formed of first and second layers which conform to one another, the first layer comprising a dielectric composite material having first and second surfaces, and the second layer comprising a conductive material contacting the first surface of the first layer, whereby the electrical reactance of the first layer is configured for the propagation of electromagnetic surface waves thereacross. The first transducer is on or adjacent the second surface of the first layer of the structural component at a first location, the first transducer being adapted to generate electromagnetic surface waves for carrying data and/or power across the first layer. The second transducer is on or adjacent the second surface of the first layer of the structural component at a second location spaced from the first location, the second transducer being adapted to receive electromagnetic surface waves from the first layer and to retrieve data and/or power from the received electromagnetic surface waves. The electromagnetic surface waves are transmitted from the first transducer to the second transducer by the first layer of the structural component. The dielectric composite material forming the first layer comprises reinforcement elements disposed in a matrix, and the first layer has a bulk region in which both the reinforcement elements and the matrix are present and a first skin region comprising a greater proportion of matrix to reinforcement elements than in the bulk region, the first skin region forming the first surface of the first layer. A vehicle and a network each comprising the system are also provided, as is a method of its manufacture.
摘要翻译：公开了用于跨结构部件传输数据和/或电力的系统，包括：结构部件，第一换能器和第二换能器。结构部件由彼此相符的第一和第二层形成，第一层包括具有第一和第二表面的介电复合材料，第二层包括与第一层的第一表面接触的导电材料，由此电气第一层的电抗被配置为用于传播电磁表面波。第一传感器在第一位置处在结构部件的第一层的第二表面上或邻近第一传感器，第一传感器适于产生电磁表面波，用于在第一层上承载数据和/或电力。所述第二传感器在与所述第一位置间隔开的第二位置处在所述结构部件的第一层的第二表面上或邻近所述第二表面，所述第二传感器适于接收来自所述第一层的电磁表面波并且检索数据和/或功率从接收到的电磁表面波。电磁表面波由结构部件的第一层从第一换能器传递到第二换能器。形成第一层的电介质复合材料包括设置在基体中的增强元件，第一层具有其中存在增强元件和基体两者的主体区域，以及包含比增强元件更大比例的基质与第一皮肤区域在本体区域中，形成第一层的第一表面的第一皮肤区域。还提供了包括系统的车辆和网络，其制造方法也是如此。

5. 发明授权

US09515367B2 Radiating sub-terahertz signal from tapered metallic waveguide into dielectric waveguide 有权
标题翻译：从锥形金属波导辐射亚太赫兹信号到介质波导
公开(公告)号：US09515367B2
公开(公告)日：2016-12-06
申请号：US14939128
申请日：2015-11-12
申请人： Texas Instruments Incorporated
发明人： Juan Alejandro Herbsommer , Robert Floyd Payne , Gerd Schuppener , Baher Haroun
IPC分类号： H01P5/00 , H01Q13/00 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12 , H01P5/107 , H01P5/18
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.
摘要翻译：金属波导安装在多层基板上。金属波导具有由顶部，底部和侧面形成的开口端，该开口端被配置为容纳电介质波导的芯构件，并且相反的锥形端通过使金属波导的顶部通过金属波导的底部下降到接触多层基板。锥形末端的顶点耦合到接地平面元件，并且金属波导的底侧与多人基板接触并耦合到微带线。

6. 发明申请

US20160211566A1 SIGNAL TRANSMISSION SYSTEM, CONNECTOR APPARATUS, ELECTRONIC DEVICE, AND SIGNAL TRANSMISSION METHOD 有权
公开(公告)号：US20160211566A1
公开(公告)日：2016-07-21
申请号：US15083986
申请日：2016-03-29
申请人： Sony Corporation
发明人： Hidekazu KIKUCHI , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
IPC分类号： H01P5/02 , H01P3/12
CPC分类号： H01P5/02 , H01P1/208 , H01P3/12 , H01P3/121 , H01P3/165 , H01P5/024 , H01P5/082 , H01P5/087 , H01P5/1022 , H01P5/107 , H01P5/18 , H01P5/182 , H01P5/188 , H01R13/6461 , H01R13/665 , H01R24/28 , H01R24/76 , H01R2103/00 , H04B3/56 , H04B7/24 , H05K1/0225 , H05K1/0239 , H05K2201/093 , H05K2201/09672 , H05K2201/0969 , H05K2201/09754
摘要： A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

7. 发明授权

US09306263B2 Interface between an integrated circuit and a dielectric waveguide using a dipole antenna and a reflector 有权
标题翻译：使用偶极天线和反射器的集成电路和电介质波导之间的接口
公开(公告)号：US09306263B2
公开(公告)日：2016-04-05
申请号：US13854939
申请日：2013-04-01
申请人： Texas Instruments Incorporated
发明人： Juan Alejandro Herbsommer , Eunyoung Seok , Baher Haroun
IPC分类号： H01P5/107 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： An electronic device has a multilayer substrate that has an interface surface configured for interfacing to a dielectric waveguide. A conductive layer on the substrate is etched to form a dipole antenna disposed adjacent the interface surface to provide coupling to the dielectric waveguide. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface.
摘要翻译：电子设备具有多层基板，该多层基板具有被配置为与电介质波导连接的界面。蚀刻衬底上的导电层以形成邻近界面表面设置的偶极天线，以提供与介质波导的耦合。反射器结构形成在与界面表面相对的偶极子天线附近的衬底中。

8. 发明申请

US20160056860A1 WAVEGUIDE, WAVEGUIDE MANUFACTURING METHOD, AND WIRELESS TRANSMISSION SYSTEM 有权
标题翻译：波导，波形制造方法和无线传输系统
公开(公告)号：US20160056860A1
公开(公告)日：2016-02-25
申请号：US14779403
申请日：2014-03-12
申请人： SONY CORPORATION
发明人： Yasuhiro OKADA
IPC分类号： H04B3/52 , H01P11/00 , H01P3/16
CPC分类号： H04B3/52 , H01P3/122 , H01P3/127 , H01P3/14 , H01P3/16 , H01P3/165 , H01P11/006
摘要： A waveguide includes: a dielectric including two surfaces, an electric field intersecting with the two surfaces; metal-plating layers coating the two surfaces of the dielectric, the electric field intersecting with the two surfaces; and a protective layer coating a periphery of the dielectric including the two surfaces coated with the metal-plating layers. A wireless transmission system includes: a sender configured to send a high-frequency signal; and a receiver configured to receive the high-frequency signal. The waveguide is used as a waveguide configured to transmit the high-frequency signal between the sender and the receiver in the wireless transmission system.
摘要翻译：波导包括：包括两个表面的电介质，与两个表面相交的电场; 金属镀层涂覆电介质的两个表面，电场与两个表面相交; 以及涂覆包括涂覆有金属镀层的两个表面的电介质周边的保护层。一种无线传输系统包括：发送器，用于发送高频信号; 以及被配置为接收高频信号的接收器。波导被用作被配置为在无线传输系统中在发送器和接收器之间传输高频信号的波导。

9. 发明授权

US09166269B2 Retractable dielectric waveguide 有权
标题翻译：伸缩电介质波导
公开(公告)号：US09166269B2
公开(公告)日：2015-10-20
申请号：US13907949
申请日：2013-06-02
申请人： Texas Instruments Incorporated
发明人： Baher Haroun , Juan Alejandro Herbsommer
IPC分类号： H01P1/10 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12 , H01P5/107
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A rotatable coupler for dielectric wave guides is described. A first dielectric wave guide (DWG) has an interface surface at a one end of the DWG. A second DWG has a matching interface surface at an end of the second DWG. A rotatable coupling mechanism is coupled to the two DWG ends and is configured to hold the interface surface of the first DWG in axial alignment with the interface surface of the second DWG while allowing the interface surface of the first DWG to rotate axially with respect to the interface surface of the second DWG.
摘要翻译：描述了用于介质波导的可旋转耦合器。第一介质波导（DWG）在DWG的一端具有界面。第二个DWG在第二个DWG的末尾具有匹配的界面。可旋转的联接机构联接到两个DWG端部并且被配置为保持第一DWG的接口表面与第二DWG的界面表面轴向对准，同时允许第一DWG的界面相对于第二DWG轴向旋转第二个DWG的界面。

10. 发明申请

US20140287701A1 Integrated Circuit with Dipole Antenna Interface for Dielectric Waveguide 有权
标题翻译：用于介质波导的偶极天线接口的集成电路
公开(公告)号：US20140287701A1
公开(公告)日：2014-09-25
申请号：US13854939
申请日：2013-04-01
申请人： Texas Instruments Incorporated
发明人： Juan Alejandro Herbsommer , Eunyoung Seok , Baher Haroun
IPC分类号： H01Q1/50 , H04B1/40 , H01Q19/10
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： An electronic device has a multilayer substrate that has an interface surface configured for interfacing to a dielectric waveguide. A conductive layer on the substrate is etched to form a dipole antenna disposed adjacent the interface surface to provide coupling to the dielectric waveguide. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface.
摘要翻译：电子设备具有多层基板，该多层基板具有被配置为与电介质波导连接的界面。蚀刻衬底上的导电层以形成邻近界面表面设置的偶极天线，以提供与介质波导的耦合。反射器结构形成在与界面表面相对的偶极子天线附近的衬底中。

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