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1. 发明授权

US10070514B2 High current switch 有权
公开(公告)号：US10070514B2
公开(公告)日：2018-09-04
申请号：US15339037
申请日：2016-10-31
申请人： Ellenberger & Poensgen GmbH
发明人： Wolfgang Ullermann , Peter Meckler , Manuel Engewald , Matthias Schwarz , Ewald Schneider , Markus Miklis
IPC分类号： H05K1/02 , H01L25/07 , H02M7/00 , H01L23/00 , F02N11/08 , H05K3/34
CPC分类号： H05K1/0263 , F02N11/087 , F02N2011/0874 , H01H45/00 , H01L24/48 , H01L25/072 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H02M7/00 , H05K3/3421 , H05K2201/0382 , H05K2201/09054 , H05K2201/09063 , H05K2201/10166 , H05K2201/10272 , H05K2201/10553 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , H01L2924/00
摘要： A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.

2. 发明申请

US20180027646A1 CIRCUIT ASSEMBLY, ELECTRICAL JUNCTION BOX, AND MANUFACTURING METHOD FOR CIRCUIT ASSEMBLY 审中-公开
公开(公告)号：US20180027646A1
公开(公告)日：2018-01-25
申请号：US15542783
申请日：2015-12-28
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Tatsuya Sumida
IPC分类号： H05K1/02 , H05K3/10 , H05K7/20
CPC分类号： H05K1/0204 , H05K1/0209 , H05K3/0064 , H05K3/10 , H05K3/202 , H05K3/4007 , H05K7/1432 , H05K7/20854 , H05K7/209 , H05K2201/0382 , H05K2201/062 , H05K2201/066 , H05K2201/10272 , H05K2201/10409
摘要： A circuit assembly includes a circuit board having an insulating board in which a conductive path is formed on an insulating plate and a plurality of busbars that are bonded to one side of the insulating board, an insulating layer that is printed to the plurality of busbars so as to couple adjacent ones of the plurality of busbars to each other, a heat dissipation member on which the insulating layer is placed and which is configured to dissipate heat conducted from the insulating layer, a fixing member that is configured to fix the circuit board and the heat dissipation member to each other in a state in which the insulating layer is sandwiched between the heat dissipation member and the plurality of busbars.

3. 发明申请

US20170048971A1 HIGH CURRENT SWITCH 审中-公开
标题翻译：高电流开关
公开(公告)号：US20170048971A1
公开(公告)日：2017-02-16
申请号：US15339037
申请日：2016-10-31
申请人： Ellenberger & Poensgen GmbH
发明人： Wolfgang ULLERMANN , Peter MECKLER , Manuel ENGEWALD , Matthias SCHWARZ , Ewald SCHNEIDER , Markus MIKLIS
IPC分类号： H05K1/02 , H01L25/07 , H01L23/00
CPC分类号： H05K1/0263 , F02N11/087 , F02N2011/0874 , H01L24/48 , H01L25/072 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014 , H01L2924/13091 , H02M7/00 , H05K3/3421 , H05K2201/0382 , H05K2201/09054 , H05K2201/09063 , H05K2201/10166 , H05K2201/10272 , H05K2201/10553 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.
摘要翻译：除了具有控制连接和第一传输连接以及第二传输连接的第一半导体开关之外，具有第一母线，第二母线的大电流开关，特别是用于机动车辆的高电流开关。第一传输连接被放置成与第一母线直接接触，并且第二传输连接被放置成与第二母线直接电接触。

4. 发明申请

US20160165733A1 ELECTRONIC DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子器件嵌入式基板及其制造方法
公开(公告)号：US20160165733A1
公开(公告)日：2016-06-09
申请号：US14963690
申请日：2015-12-09
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Bong-Soo KIM
IPC分类号： H05K1/18 , H05K3/00 , H05K3/40 , H05K3/30
CPC分类号： H05K1/183 , H05K1/186 , H05K3/0047 , H05K3/325 , H05K3/326 , H05K3/4602 , H05K3/4697 , H05K2201/0382 , H05K2201/0394 , H05K2203/107
摘要： An electronic device embedded substrate and a method of manufacturing the same includes a substrate comprising a cavity formed therein, and an electronic device embedded in the cavity. The substrate and method thereof also include a first support pattern part formed on one surface of the substrate and pressing the electronic device to restrict a movement of the electronic device within the cavity, and a second support pattern part formed on another surface of the core substrate facing opposite to the one surface and extended toward an inside of the cavity to support the electronic device.
摘要翻译：电子器件嵌入式基板及其制造方法包括：基板，其包括形成在其中的空腔;以及嵌入在该空腔中的电子器件。基板及其方法还包括形成在基板的一个表面上的第一支撑图案部分，并且按压电子装置以限制电子装置在空腔内的移动，以及形成在芯基板的另一表面上的第二支撑图案部分面向一个表面的相反侧并且朝向空腔的内部延伸以支撑电子设备。

5. 发明申请

US20160044782A1 MULTILAYER WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE FOR PROBE CARD 有权
标题翻译：多层布线基板及其制造方法及基板用于探针卡
公开(公告)号：US20160044782A1
公开(公告)日：2016-02-11
申请号：US14919058
申请日：2015-10-21
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshihito Otsubo , Toru Meguro , Tatsunori Kan
IPC分类号： H05K1/09 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/42 , H05K1/02 , H05K3/46
CPC分类号： H05K1/09 , H01L21/4867 , H01L23/49822 , H01L2224/16225 , H01L2924/0002 , H01L2924/19105 , H05K1/0298 , H05K1/112 , H05K1/115 , H05K3/0058 , H05K3/3436 , H05K3/4038 , H05K3/4084 , H05K3/42 , H05K3/4629 , H05K3/4644 , H05K3/4667 , H05K2201/0376 , H05K2201/0382 , H05K2201/09545 , H05K2201/09627 , H05K2201/09836 , H05K2201/09845 , H05K2201/1006 , H05K2203/0278 , H05K2203/063 , H05K2203/068 , H05K2203/1126 , H01L2924/00
摘要： A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.
摘要翻译：可以获得能够实现更高密度的布线结构的多层布线基板。提供了一种多层布线基板，其中堆叠在第一绝缘层的底表面上的包括第一绝缘层和第二绝缘层的多层体包括印刷布线电极; 印刷布线电极通过印刷和烧结导电浆料形成; 印刷布线电极分别包括位于第二绝缘层上的第一布线电极部分和分别连接到第一布线电极部分的第二布线电极部分; 并且第二布线电极部分别分别延伸到通孔中，并且还暴露在第一绝缘层的顶表面处。

6. 发明授权

US09183488B2 Antenna sheet, data carrier with non-contact IC, and method for manufacturing antenna sheet 有权
标题翻译：天线片，非接触IC数据载体，天线片制造方法
公开(公告)号：US09183488B2
公开(公告)日：2015-11-10
申请号：US13138918
申请日：2010-04-28
申请人： Hiroyoshi Gotou
发明人： Hiroyoshi Gotou
IPC分类号： G06K19/06 , G06K19/077 , H05K3/40
CPC分类号： G06K19/07783 , G06K19/07754 , H05K3/4038 , H05K3/4084 , H05K2201/0129 , H05K2201/0355 , H05K2201/0379 , H05K2201/0382 , H05K2201/0394 , H05K2201/10098 , H05K2203/0195 , H05K2203/107 , Y10T29/49016 , Y10T29/49018
摘要： A method for manufacturing an antenna sheet, includes: a pressing step in which an overlapped portion of an antenna coil and/or a connection pattern formed from a metal material and provided on one surface of a substrate formed from a thermoplastic resin, and a conductive member formed from a metal material and provided on the other surface of the substrate is pressed using a pressing unit at least from the surface of one side of the substrate; and a welding steps in which the overlapped portion of the antenna coil and/or the connection pattern and the conductive member is welded.
摘要翻译：一种天线片的制造方法，其特征在于，包括：加压工序，在所述加压工序中，将由天线线圈和/或由金属材料形成的连接图案的重叠部分设置在由热塑性树脂形成的基板的一个表面上，由金属材料形成的并且设置在基板的另一个表面上的部件至少从基板的一侧的表面使用压制单元进行加压; 以及其中焊接天线线圈和/或连接图案和导电构件的重叠部分的焊接步骤。

7. 发明申请

US20150302291A1 METHOD FOR MANUFACTURING ANTENNA SHEET 审中-公开
标题翻译：制造天线片的方法
公开(公告)号：US20150302291A1
公开(公告)日：2015-10-22
申请号：US14753843
申请日：2015-06-29
申请人： TOPPAN PRINTING CO., LTD.
发明人： Hiroyoshi GOTOU
IPC分类号： G06K19/077 , H05K3/40
CPC分类号： G06K19/07783 , G06K19/07754 , H05K3/4038 , H05K3/4084 , H05K2201/0129 , H05K2201/0355 , H05K2201/0379 , H05K2201/0382 , H05K2201/0394 , H05K2201/10098 , H05K2203/0195 , H05K2203/107 , Y10T29/49016 , Y10T29/49018
摘要： A method for manufacturing an antenna sheet. The method is for connecting at least one of an antenna coil and a connection pattern, to a conductive member. The at least one of the antenna coil and the connection pattern is provided on one surface of a substrate and the conductive member is provided on the other surface of the substrate. The method includes a pressing process performed to form a first through hole to the substrate, wherein the first through hole passes through the substrate, and to bring the at least one of the antenna coil and the connection pattern, and the conductive member into contact with each other. The method also includes a melting process performed to melt the at least one of the antenna coil and the connection pattern, and the conductive member to each other.
摘要翻译：一种天线片的制造方法。该方法用于将天线线圈和连接图案中的至少一个连接到导电构件。天线线圈和连接图案中的至少一个设置在基板的一个表面上，并且导电构件设置在基板的另一个表面上。该方法包括对基板形成第一通孔进行压制处理，其中第一通孔穿过基板，并使天线线圈和连接图案中的至少一个与导电部件接触彼此。该方法还包括将天线线圈和连接图案中的至少一个和导电构件彼此熔化的熔化过程。

8. 发明申请

US20150264812A1 LAMINATE INCLUDING CONDUCTIVE CIRCUIT PATTERNS 审中-公开
标题翻译：包括导电电路图案的层压板
公开(公告)号：US20150264812A1
公开(公告)日：2015-09-17
申请号：US14724242
申请日：2015-05-28
申请人： TECNOMAR OY
发明人： Tom MARTTILA
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , B32B37/1292 , B32B38/10 , B32B2310/0843 , B32B2457/08 , G08B13/244 , H05K1/0366 , H05K1/0386 , H05K3/027 , H05K3/046 , H05K3/386 , H05K3/4046 , H05K3/4084 , H05K2201/0284 , H05K2201/0355 , H05K2201/0382 , H05K2201/0394 , H05K2201/09563 , H05K2203/0522 , H05K2203/1388 , H05K2203/1394 , H05K2203/1545 , Y10T29/49156
摘要： A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.
摘要翻译：层压体包含导电电路图案，基底材料和粘合剂图案或其它粘结。每个导电电路图案和衬底材料通过粘合剂图案或其他结合物相互连接，其尺寸和形状基本上与每个导电电路图案的主要轮廓相匹配。每个导电电路图案具有细线和薄的间隙空间，通过去除导电材料在粘合剂图案的顶部图案化或其他结合图案，使得电路图案的细间线空间可以具有粘合剂图案或其它粘合物的残留物。在导电电路图案的主要轮廓之外，除了主轮廓的边缘区域之外，基底材料基本上不含粘合剂或其它粘合物。

9. 发明申请

US20150036303A1 HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE 有权
标题翻译：高频信号传输线和电子设备
公开(公告)号：US20150036303A1
公开(公告)日：2015-02-05
申请号：US14520504
申请日：2014-10-22
申请人： Murata Manufacturing Co., Ltd.
发明人： Kuniaki YOSUI , Noboru KATO
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14
CPC分类号： H05K1/025 , H01P3/08 , H01P3/085 , H05K1/0221 , H05K1/0225 , H05K1/0298 , H05K1/115 , H05K1/147 , H05K1/148 , H05K2201/0382
摘要： A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line and including a plurality of openings arranged along the signal line. The dielectric layer positioned at an end of the first side in the direction of lamination includes an undulating portion provided on a first principal surface located on the first side in the direction of lamination, such that the undulating portion overlaps with the openings when viewed in a plan view in the direction of lamination.
摘要翻译：高频信号传输线包括：介质元件组件，其包括彼此层压的多个电介质层，设置在电介质元件组件处的线性信号线;以及第一接地导体，其设置在层叠相对方向上的第一侧上并且包括沿信号线布置的多个开口。位于层叠方向上的第一侧端部的电介质层包括设置在层叠方向上位于第一侧的第一主表面上的起伏部分，使得当以层叠方式观察时起伏部分与开口重叠在层叠方向的平面图。

10. 发明授权

US08121394B2 Method for manufacturing electronic device 有权
标题翻译：电子设备制造方法
公开(公告)号：US08121394B2
公开(公告)日：2012-02-21
申请号：US12050598
申请日：2008-03-18
申请人： Takashi Miyauchi
发明人： Takashi Miyauchi
IPC分类号： G06K9/00
CPC分类号： H05K3/323 , G02F1/1303 , G02F1/1309 , G02F1/13452 , H01L2224/2929 , H01L2224/293 , H01L2224/81903 , H01L2224/83851 , H01L2924/00011 , H05K1/0269 , H05K2201/0108 , H05K2201/0382 , H05K2203/163 , H01L2224/29075
摘要： A method for manufacturing an electronic device is provided. The method includes: pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate; obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate; measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film; calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation.
摘要翻译：提供了一种用于制造电子设备的方法。该方法包括：通过各向异性导电膜将电子部件的多个端子分别压接到形成在透明基板的表面上的多个电极，以将电子部件安装在透明基板上; 通过从透明基板的背面安装有电子部件的透明基板成像来获得电极的图像; 使用电极的图像测量每个所述电极的压痕数量，当电极被各向异性导电膜中的导电颗粒挤压时形成凹陷; 计算每个电极在整个透明基板上的压痕数量的平均值和标准偏差; 并根据平均值和标准偏差计算每个电极的压痕数量小于参考值的概率。

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