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1. 发明公开

US20240276648A1 FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE PULSED LIGHT-INDUCED ZINC MASS TRANSFER 审中-公开
公开(公告)号：US20240276648A1
公开(公告)日：2024-08-15
申请号：US18561934
申请日：2022-03-30
申请人： The Penn State Research Foundation
发明人： Ning Yi , Yuyan Gao , Antonino Lo Verso, Jr. , Jia Zhu , Daniel Erdely , Robert Lavelle , Huanyu Cheng
IPC分类号： H05K3/14 , A61B5/28 , A61B5/296 , H05K1/09
CPC分类号： H05K3/143 , A61B5/28 , A61B5/296 , H05K1/092 , H05K3/146 , H05K2203/0156 , H05K2203/0557 , H05K2203/083 , H05K2203/1131 , H05K2203/1173
摘要： The invention includes methods of forming electronic circuitry on a target surface using intense pulsed light-induced mass transfer (IPLMT) of metal nanoparticles (NPs) by applying a pliable mask to a target surface, coating a carrier film with metal NPs, mounting the carrier film to the target surface and over the pliable mask so that the pliable mask is sandwiched between the target surface and the metal NPs. and exposing the metal NPs to light energy to cause atoms of the metal NPs to evaporate and transport through openings of the pliable mask and condense on the target surface, producing a conductive pattern of condensed metal on the target surface. Certain implementations may utilize a kirigami-patterned pliable mask to enhance conformity to a freeform 3D target surface. In certain implementations, zinc (Zn) may be formed by IPLMT of Zn NPs to the target surface.

2. 发明申请

US20180255667A1 ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20180255667A1
公开(公告)日：2018-09-06
申请号：US15756114
申请日：2017-03-27
申请人： OMRON CORPORATION
发明人： Wakahiro KAWAI
IPC分类号： H05K9/00 , H05K1/18 , H05K5/04 , H05K3/12
CPC分类号： H05K9/0084 , H01L21/565 , H01L21/568 , H01L23/00 , H01L23/3135 , H01L23/552 , H05K1/0218 , H05K1/182 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/125 , H05K3/282 , H05K3/288 , H05K5/04 , H05K2201/0715 , H05K2201/0723 , H05K2201/09118 , H05K2203/0156 , H05K2203/0191 , H05K2203/1316 , H05K2203/1469
摘要： The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

3. 发明申请

US20180206333A1 EMBEDDING DISCRETE COMPONENTS HAVING VARIABLE DIMENSIONS IN A SUBSTRATE 审中-公开
公开(公告)号：US20180206333A1
公开(公告)日：2018-07-19
申请号：US15919620
申请日：2018-03-13
申请人： International Business Machines Corporation
发明人： Lei Shan
IPC分类号： H05K1/02 , H05K1/18 , H05K3/34
CPC分类号： H05K1/0231 , H05K1/183 , H05K1/184 , H05K3/305 , H05K3/3405 , H05K3/3494 , H05K2201/10015 , H05K2203/0156 , H05K2203/1394
摘要： Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.

4. 发明授权

US09986633B2 Embedding discrete components having variable dimensions in a substrate 有权
公开(公告)号：US09986633B2
公开(公告)日：2018-05-29
申请号：US15184125
申请日：2016-06-16
申请人： International Business Machines Corporation
发明人： Lei Shan
IPC分类号： H05K3/30 , H05K1/02 , H05K1/18 , H05K3/34
CPC分类号： H05K1/0231 , H05K1/183 , H05K1/184 , H05K3/305 , H05K3/3405 , H05K3/3494 , H05K2201/10015 , H05K2203/0156 , H05K2203/1394
摘要： Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.

5. 发明授权

US09699909B2 Wiring board with built-in electronic component 有权
公开(公告)号：US09699909B2
公开(公告)日：2017-07-04
申请号：US14455012
申请日：2014-08-08
申请人： IBIDEN CO., LTD.
发明人： Naohito Ishiguro , Yasushi Inagaki
IPC分类号： H05K1/18 , H05K7/00 , H05K3/46
CPC分类号： H05K1/185 , H01L2224/16227 , H01L2924/15311 , H05K3/4602 , H05K3/4644 , H05K2201/10 , H05K2201/10015 , H05K2201/10507 , H05K2203/0156
摘要： A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.

6. 发明授权

US08959760B2 Printed wiring board and method for manufacturing same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08959760B2
公开(公告)日：2015-02-24
申请号：US13209483
申请日：2011-08-15
申请人： Ayao Niki , Kazuhisa Kitajima
发明人： Ayao Niki , Kazuhisa Kitajima
IPC分类号： H05K3/02 , H05K3/10 , H05K3/46 , H05K3/00 , H05K1/11 , H05K3/06
CPC分类号： H05K3/4682 , H05K1/113 , H05K3/0058 , H05K3/025 , H05K3/06 , H05K3/108 , H05K2201/096 , H05K2203/0152 , H05K2203/0156 , H05K2203/0228 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.
摘要翻译：一种印刷电路板的制造方法，其特征在于，具备：金属箔固定在所述支撑基板上的支撑板，在所述金属箔上形成树脂绝缘层，在所述树脂绝缘层上形成开口，在所述树脂绝缘层上形成导电电路层，通过导体在开口中形成以电连接导电电路和金属箔，分离支撑板和金属箔，以及从金属箔外部端子形成以电连接到另一基板或电子部件。

7. 发明申请

US20150043183A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT 有权
标题翻译：配有电子元器件的接线板
公开(公告)号：US20150043183A1
公开(公告)日：2015-02-12
申请号：US14455012
申请日：2014-08-08
申请人： IBIDEN CO., LTD.
发明人： Naohito ISHIGURO , Yasushi Inagaki
IPC分类号： H05K1/18 , H05K1/11 , H05K1/02
CPC分类号： H05K1/185 , H01L2224/16227 , H01L2924/15311 , H05K3/4602 , H05K3/4644 , H05K2201/10 , H05K2201/10015 , H05K2201/10507 , H05K2203/0156
摘要： A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
摘要翻译：具有内置电子部件的布线基板包括芯基板，基板中的电子部件，基板第一面上的第一上层结构，基板的第二面上的第二上层结构以及基板的第二表面的通路衬底中的导体和第一上层结构，使得通孔导体连接到部件的电极。所述基板具有容纳层，在所述容纳层的第一表面上的第一连接层和在所述容纳层的第二表面上的第二连接层，所述容纳层包括内部布线和绝缘层，并且具有容纳所述部件的空腔，所述第一连接层包括内部布线和绝缘层，并且第二连接层包括内部布线和绝缘层，使得第二连接层包括比第一连接层更多数量的内部布线和绝缘层。

8. 发明授权

US08952507B2 Wiring board and method for manufacturing wiring board 有权
标题翻译：接线板及制造接线板的方法
公开(公告)号：US08952507B2
公开(公告)日：2015-02-10
申请号：US13963246
申请日：2013-08-09
申请人： Ibiden Co., Ltd.
发明人： Toyotaka Shimabe , Keisuke Shimizu , Toshiki Furutani
IPC分类号： H01L23/00 , H05K1/18 , H01L23/495 , H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56
CPC分类号： H05K1/183 , H01L21/4857 , H01L21/568 , H01L23/3107 , H01L23/49589 , H01L23/49822 , H01L24/80 , H01L2924/12042 , H05K1/18 , H05K1/185 , H05K3/007 , H05K3/4602 , H05K2203/0156 , H01L2924/00
摘要： A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.
摘要翻译：布线板包括具有空腔的基板和容纳在基板的空腔中的电子部件。基板的厚度大于电子部件的厚度，使得基板的厚度与电子部件的厚度的比率设定在0.3以上且0.7以下的范围内。

9. 发明授权

US08791783B2 Electronic component to be embedded in substrate and component-embedded substrate 有权
标题翻译：嵌入基板和部件嵌入式基板的电子部件
公开(公告)号：US08791783B2
公开(公告)日：2014-07-29
申请号：US13642469
申请日：2011-05-11
申请人： Masashi Miyazaki , Yuichi Sugiyama , Yoshiki Hamada , Yutaka Hata , Hideki Yokota
发明人： Masashi Miyazaki , Yuichi Sugiyama , Yoshiki Hamada , Yutaka Hata , Hideki Yokota
IPC分类号： H01F27/29 , H01F5/00 , H01L27/08
CPC分类号： H01F27/327 , H01F17/0013 , H01F27/29 , H01F2017/0066 , H01L21/568 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/24227 , H01L2224/73267 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H05K1/165 , H05K1/185 , H05K3/4602 , H05K3/4608 , H05K2201/0355 , H05K2201/086 , H05K2201/1003 , H05K2201/10636 , H05K2201/10674 , H05K2203/0156 , Y02P70/611 , H01L2924/00
摘要： An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.
摘要翻译：嵌入在基板中的电子部件被配置为使得由绝缘体保护的平面线圈被夹在一对磁性层之间。在一个或两个磁性层的预定位置处提供端口或开口或不存在的部分，并且预定位置对应于与平面线圈的端子电极相对的位置。因此，可以对电子设备的尺寸和重量的减小做出贡献。

10. 发明申请

US20130111746A1 METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE 审中-公开
标题翻译：制造多层布线基板的方法
公开(公告)号：US20130111746A1
公开(公告)日：2013-05-09
申请号：US13670629
申请日：2012-11-07
申请人： NGK Spark Plug Co., LTD.
发明人： Shinnosuke MAEDA , Tetsuo SUZUKI , Takuya HANDO , Atsuhiko SUGIMOTO , Satoshi HIRANO , Hajime SAIKI
IPC分类号： H05K3/10
CPC分类号： H05K3/0097 , H05K3/0035 , H05K3/4682 , H05K2203/0156 , H05K2203/061 , H05K2203/1536 , Y10T29/49155
摘要： A method of manufacturing a multilayer wiring substrate includes: a first laminate structure formation step of forming a first laminate structure on a support substrate, the first laminate structure including at least one conductor layer and at least one resin insulation layer; a core substrate formation step of laminating a core substrate on the first laminate structure such that a lower main surface of the core substrate comes in contact with the first laminate structure, the core substrate having a metal layer provided on an upper main surface thereof; and a second laminate structure formation step of forming a second laminate structure on the core substrate such that the second laminate structure covers the metal layer, the second laminate structure including at least one conductor layer and at least one resin insulation layer.
摘要翻译：一种制造多层布线基板的方法包括：在支撑基板上形成第一层压结构的第一层叠结构形成步骤，所述第一层叠结构包括至少一个导体层和至少一个树脂绝缘层; 核心基板形成步骤，将芯基板层叠在第一层叠结构上，使得芯基板的下主表面与第一层叠结构接触，芯基板具有设置在其上主表面上的金属层; 以及第二层叠结构形成步骤，在所述芯基板上形成第二层叠结构，使得所述第二层叠结构覆盖所述金属层，所述第二层叠结构包括至少一个导体层和至少一个树脂绝缘层。

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