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1. 发明公开

US20240164027A1 MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20240164027A1
公开(公告)日：2024-05-16
申请号：US18479125
申请日：2023-10-02
申请人： Innolux Corporation
发明人： Ying-Jen Chen , Yan-Zheng Wu
IPC分类号： H05K3/46
CPC分类号： H05K3/4635 , H05K3/4697 , H05K3/0014
摘要： A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.

2. 发明公开

US20230304834A1 CONFORMAL APERTURE ENGINE SENSORS AND MESH NETWORK 审中-公开
公开(公告)号：US20230304834A1
公开(公告)日：2023-09-28
申请号：US18325254
申请日：2023-05-30
申请人： Fractal Antenna Systems, Inc.
发明人： Nathan Cohen , Alexander Shelman-Cohen
IPC分类号： G01D11/30 , H05K1/14 , H05K3/46 , H05K3/36
CPC分类号： G01D11/30 , H05K1/144 , H05K3/4635 , H05K3/361 , G01D7/00
摘要： Wireless sensor devices are described which harvest energy and provide an antenna or antennas for wireless communication on a relatively small form factor, preferably one that is co-extensive with a largest component of the device, e.g., an antenna layer or sensor layer. The devices are able to sense and/or control certain specific parameters of a system; store energy, e.g., in a supercapacitor system or battery system; transmit that as information/signals via a wireless link, e.g., RF or optical link; receive information from other devices and relay that information. Such devices accordingly may be self-powered and wireless devices, and not dependent on a separate device or form factor to provide a power source. Such devices can be entirely autonomous or substantially so, can be mobile or fixed, and may require little servicing over a period of time. The devices can be used as sensor nodes in a wireless mesh network.

3. 发明授权

US10645799B2 High-frequency and high-transmission speed FPC with FRCC and preparation method thereof 有权
公开(公告)号：US10645799B2
公开(公告)日：2020-05-05
申请号：US16118454
申请日：2018-08-31
申请人： Kunshan Aplus Tec. Corporation
发明人： Bo-sian Du , Chihming Lin , Chienhui Lee
IPC分类号： B21C37/00 , H05K1/02 , H05K1/03 , H05K3/46 , H05K1/09 , B32B15/08
CPC分类号： H05K1/024 , H05K1/028 , H05K1/0353 , H05K1/09 , H05K3/4635 , H05K3/4688 , B32B15/08 , H05K1/0242 , H05K1/0393 , H05K2201/0141 , H05K2201/0154 , Y10T428/12438
摘要： A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 μm. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 μm. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.

4. 发明授权

US09887446B2 Signal transmission cable and communication device module 有权
公开(公告)号：US09887446B2
公开(公告)日：2018-02-06
申请号：US14873283
申请日：2015-10-02
申请人： Murata Manufacturing Co., Ltd.
发明人： Kuniaki Yosui
IPC分类号： H01P1/213 , H03H7/01 , H01P1/203 , H01F17/00 , H01F27/00 , H04B1/38 , H05K1/02 , H05K1/16 , H03H1/00 , H05K1/14 , H05K1/18 , H05K3/46
CPC分类号： H01P1/2135 , H01F17/00 , H01F27/00 , H01P1/203 , H03H7/0115 , H03H7/0123 , H03H2001/0085 , H04B1/38 , H05K1/0216 , H05K1/0231 , H05K1/0239 , H05K1/147 , H05K1/162 , H05K1/165 , H05K1/186 , H05K3/4635 , H05K2201/10098 , H05K2201/10189
摘要： A signal transmission cable including a high-Q value band-elimination filter includes a first signal line conductor pattern including a first capacitor conductor portion and an inductor conductor portion on a first base layer. The first capacitor conductor portion includes a flat conductor, and the inductor conductor portion has a spiral shape. A second signal line conductor pattern including a second capacitor conductor portion is provided on a second base layer. The inductor conductor portion constitutes an inductor, and the first and second capacitor conductor portions and the first base layer constitute a capacitor. The inductor and the capacitor are connected in parallel by transmission conductor portions on the first and second base layers and an interlayer-connector conductor on the first base layer.

5. 发明申请

US20150380848A1 FLEXIBLE CIRCUIT BOARD 有权
标题翻译：柔性电路板
公开(公告)号：US20150380848A1
公开(公告)日：2015-12-31
申请号：US14845311
申请日：2015-09-04
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru KATO
IPC分类号： H01R12/78
CPC分类号： H01R12/78 , H05K1/147 , H05K1/186 , H05K3/363 , H05K3/4617 , H05K3/4632 , H05K3/4635 , H05K3/4694 , H05K2201/0154
摘要： A flexible circuit board whose entire surface has flexibility includes a first substrate portion and a second substrate portion that are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board. The first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and the second substrate portion includes a plurality of resin layers, which are integrated with one another by intermolecular bonding of a thermoplastic resin.
摘要翻译：整个表面具有柔性的柔性电路板包括彼此相邻并在柔性电路板的平面方向上彼此电连接的第一基板部分和第二基板部分。第一基板部分包括多个树脂层，它们用粘合剂粘合在一起，第二基板部分包括多个树脂层，它们通过热塑性树脂的分子间键合相互结合。

6. 发明授权

US09226410B2 Method of making a flexible circuit 有权
标题翻译：制作柔性电路的方法
公开(公告)号：US09226410B2
公开(公告)日：2015-12-29
申请号：US14375824
申请日：2013-01-24
申请人： Trackwise Designs Limited
发明人： Philip Johnston
IPC分类号： H05K3/46 , H05K1/02 , H05K1/11 , B32B37/10 , H05K3/06
CPC分类号： H05K3/4611 , B32B37/1027 , B32B2457/08 , H05K1/0298 , H05K1/115 , H05K3/06 , H05K3/064 , H05K3/4617 , H05K3/462 , H05K3/4635 , H05K3/4638 , H05K3/4644 , H05K2201/09063 , H05K2203/068 , H05K2203/1545 , H05K2203/167
摘要： A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.
摘要翻译：一种制造多层柔性电路的方法包括提供第一和第二柔性基板，每个柔性基板包括导体层和绝缘体层。第一基板的导体层是图案化的导体层。第一和第二基板使用双带压机层压在一起，基板通过该双层压机连续地移动。该方法可以包括使用蚀刻方法图案化第一衬底的导体层和/或第二衬底的导体层，该蚀刻方法包括通过执行多个相邻和相邻的曝光来将导体层上的干膜抗蚀剂暴露于图案 /或重叠区域。

7. 发明申请

US20150351220A1 MAKING Z-FOLD MICRO-WIRE SUBSTRATE STRUCTURE 有权
标题翻译：制造Z型微型基片结构
公开(公告)号：US20150351220A1
公开(公告)日：2015-12-03
申请号：US14289896
申请日：2014-05-29
申请人： Ronald Steven Cok , Thomas Nathaniel Tombs
发明人： Ronald Steven Cok , Thomas Nathaniel Tombs
IPC分类号： H05K1/02 , H05K3/12 , H05K3/10
CPC分类号： H05K1/028 , G06F3/044 , G06F2203/04103 , H05K1/0274 , H05K1/189 , H05K3/107 , H05K3/1258 , H05K3/22 , H05K3/4635 , H05K2201/0108 , H05K2201/055 , H05K2201/056 , H05K2201/10121 , H05K2201/10128 , Y10T29/4913 , Y10T29/49156 , Y10T29/49158 , Y10T156/1015
摘要： A method of making a folded micro-wire substrate structure includes providing a flexible substrate and first, second, and third portions. One or more electrical conductors are formed on or in the flexible substrate. The flexible substrate is folded with a first fold between the first and second portions so that the first portion is located adjacent to the second portion in a perpendicular direction. The flexible substrate is folded with at least a second fold between the second and third portions so that the second side is between the second portion and the third portion in the perpendicular direction. The folded flexible substrate is secured to form the folded micro-wire substrate structure.
摘要翻译：制造折叠的微线基板结构的方法包括提供柔性基板和第一，第二和第三部分。在柔性基板上或柔性基板上形成一个或多个电导体。柔性基板在第一和第二部分之间以第一折叠折叠，使得第一部分在垂直方向上位于第二部分附近。柔性基板在第二和第三部分之间折叠至少第二折叠，使得第二侧在垂直方向上位于第二部分和第三部分之间。折叠的柔性基板被固定以形成折叠的微线基板结构。

8. 发明申请

US20150305138A1 WRAP-AROUND MICRO-WIRE CIRCUIT METHOD 有权
标题翻译：绕线微线电路方法
公开(公告)号：US20150305138A1
公开(公告)日：2015-10-22
申请号：US14253939
申请日：2014-04-16
申请人： THOMAS NATHANIEL TOMBS , Ronald Steven Cok , Christopher R. Morton
发明人： THOMAS NATHANIEL TOMBS , Ronald Steven Cok , Christopher R. Morton
IPC分类号： H05K1/02 , H05K3/46 , H05K3/12 , H05K3/28 , H05K3/10
CPC分类号： H05K1/028 , G06F3/044 , G06F2203/04103 , H05K1/0274 , H05K1/189 , H05K3/107 , H05K3/1258 , H05K3/22 , H05K3/4635 , H05K2201/0108 , H05K2201/055 , H05K2201/056 , H05K2201/10121 , H05K2201/10128 , Y10T29/4913 , Y10T29/49156 , Y10T29/49158 , Y10T156/1015
摘要： A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.
摘要翻译：制造适于包装的微线电路结构的方法包括提供显示器和柔性基板。柔性基板包括在柔性基板的共同侧上或附近的多个导电微线，并且在柔性基板的接触部分中形成微线电极。一个或多个电路位于柔性基板的电路部分上或电路部分中，并且一个或多个微线将一个或多个电路电连接到相应的微线电极。柔性基板相对于显示器定位，触摸部分位于显示观察侧附近，电路部分位于显示器背面附近，并且柔性基板的边缘部分从显示器观看围绕显示边缘缠绕侧面显示背面。

9. 发明授权

US09125334B2 Method for manufacturing multilayer printed circuit board 有权
标题翻译：多层印刷电路板制造方法
公开(公告)号：US09125334B2
公开(公告)日：2015-09-01
申请号：US13192474
申请日：2011-07-28
申请人： Hui Zeng
发明人： Hui Zeng
IPC分类号： H05K3/00 , H05K3/36 , H05K3/20 , H05K3/10 , H05K3/02 , H05K1/00 , H05K3/46
CPC分类号： H05K3/4635 , H05K3/0097 , H05K2201/055 , H05K2201/0715 , Y10T29/49126
摘要： In a method for manufacturing multilayer PCBs having n circuit layers, a double-sided flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising m segments, wherein m=n/2 if n represents an even integer, and m=(n+1)/2 if n represents an odd integer. Each segment includes two foil portions. In a reel to reel process, the strip is treated to form n−2 foil portions of each PCB unit into traces, further remove one foil portion if n represents an odd integer. The other two foil portions are left untreated. Then the strip is cut to separate the PCB units from each other. The PCB unit is folded in such a manner that the traces are arranged between the other two foil portions. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two foil portions.
摘要翻译：在具有n个电路层的多层PCB的制造方法中，提供双面柔性衬底条。条带包括多个PCB单元，每个PCB单元包括m个段，其中如果n表示偶数整数，则m = n / 2，如果n表示奇整数，则m =（n + 1）/ 2。每个片段包括两个箔片部分。在卷轴到卷轴处理中，处理条带以将每个PCB单元的n-2个箔部分形成迹线，如果n表示奇整数则进一步去除一个箔部分。另外两个箔片部分未经处理。然后切割条带以将PCB单元彼此分开。 PCB单元被折叠成使得迹线布置在另外两个箔部分之间。折叠的PCB单元被层压以形成多层基板，并且在两个箔部分中形成迹线。

10. 发明授权

US09082991B2 OLED display device and corresponding flexible printed circuit 有权
标题翻译： OLED显示装置及相应的柔性印刷电路
公开(公告)号：US09082991B2
公开(公告)日：2015-07-14
申请号：US14226766
申请日：2014-03-26
申请人： Shanghai Tianma Micro-Electronics Co., Ltd. , Tianma Micro-Electronics Co., Ltd.
发明人： Yujun Li , Bengang Zhao , Kai Tian
IPC分类号： H01L23/544 , H01L51/00 , H01L27/32
CPC分类号： H01L51/0097 , H01L27/3244 , H01L51/5246 , H05K1/0269 , H05K1/0306 , H05K3/4635 , H05K2201/09918 , H05K2201/10106 , H05K2201/2027
摘要： An Organic Light-Emitting Diode (OLED) display device and a corresponding flexible printed circuit (FPC) are disclosed. The display device includes a first substrate and a second substrate arranged in opposition. In addition, frit is arranged on an inner side of the first substrate, and the display device also includes at least one bonding mark, where the bonding mark includes the frit, and at least one sub-bonding mark arranged on a surface of the first substrate. The at least one sub-bonding mark includes a first portion and a second portion arranged apart from each other, and the first portion and the second portion are arranged at an edge of the frit. The FPC includes at least one auxiliary bonding mark aligning the FPC to the OLED display device, where the at least one auxiliary bonding mark is aligned with the at least one sub-bonding mark of the OLED display device.
摘要翻译：公开了一种有机发光二极管（OLED）显示装置和相应的柔性印刷电路（FPC）。显示装置包括第一基板和布置成相对布置的第二基板。此外，玻璃料布置在第一基板的内侧，并且显示装置还包括至少一个接合标记，其中接合标记包括玻璃料，以及至少一个子接合标记布置在第一基板的表面上基质。所述至少一个子接合标记包括彼此分开布置的第一部分和第二部分，并且所述第一部分和所述第二部分布置在所述玻璃料的边缘。 FPC包括将FPC与OLED显示装置对准的至少一个辅助接合标记，其中至少一个辅助接合标记与OLED显示装置的至少一个子接合标记对准。

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