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1. 发明申请

US20160172386A1 COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS 审中-公开
标题翻译：用于薄膜晶体管和平板显示器中的金属化的铜合金屏障层
公开(公告)号：US20160172386A1
公开(公告)日：2016-06-16
申请号：US15048335
申请日：2016-02-19
申请人： Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
发明人： Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
IPC分类号： H01L27/12 , H01L29/786 , H01L23/532 , H01L29/49
CPC分类号： H01L27/1244 , B81C1/00 , B81C1/00031 , B81C1/00404 , B81C1/00523 , B81C1/00547 , C21D1/00 , C21D9/00 , C21D2201/00 , C21D2211/00 , C21D2251/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/14 , G06F3/041 , G06F3/0412 , G06F3/044 , G06F2203/04103 , H01B1/026 , H01L23/53238 , H01L29/4908 , H01L29/6675 , H01L29/78603 , H01L29/78666 , H01L2924/0002 , Y10T428/12611 , Y10T428/1266 , Y10T428/12681 , Y10T428/12687 , Y10T428/12694 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12743 , Y10T428/1275 , Y10T428/12806 , Y10T428/12812 , Y10T428/12819 , Y10T428/12826 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , H01L2924/00
摘要： In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
摘要翻译：在各种实施例中，诸如薄膜晶体管的电子器件包括具有导体层的电极，并且在导体层下方设置阻挡层，该阻挡层包括Cu和一种或多种难熔金属元素的合金，所述难熔金属元素选自Ta，Nb ，Mo，W，Zr，Hf，Re，Os，Ru，Rh，Ti，V，Cr和Ni。

2. 发明申请

US20150262725A1 COMPOSITE CONDUCTOR 审中-公开
标题翻译：复合导体
公开(公告)号：US20150262725A1
公开(公告)日：2015-09-17
申请号：US14626336
申请日：2015-02-19
申请人： Hitachi Metals, Ltd.
发明人： Hideyuki SAGAWA , Keisuke FUJITO
IPC分类号： H01B1/02 , C22C9/00 , C22C14/00 , B32B15/01 , B32B15/20
CPC分类号： C22C9/00 , B32B1/08 , B32B15/01 , B32B15/043 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2307/202 , B32B2457/00 , C22C14/00 , Y10T428/12438 , Y10T428/12806 , Y10T428/12812
摘要： A composite conductor is composed of a core including a titanium or a titanium alloy, a cladding layer including a copper and being provided to clad an outer periphery of the core, and an intermetallic compound layer being formed by diffusions of the titanium or titanium alloy included in the core and the copper included in the cladding layer, and being provided between the core and the cladding layer.
摘要翻译：复合导体由包括钛或钛合金的芯体，包含铜的包覆层构成并且被设置成包覆芯的外周，并且包括由包含钛或钛合金的扩散形成的金属间化合物层在包层中包含的芯和铜中，并且设置在芯和包覆层之间。

3. 发明授权

US09066564B2 Decorative article and timepiece 有权
标题翻译：装饰品和钟表
公开(公告)号：US09066564B2
公开(公告)日：2015-06-30
申请号：US13960080
申请日：2013-08-06
申请人： Seiko Epson Corporation
发明人： Yuzuru Tsukamoto , Atsushi Kawakami
IPC分类号： G04B37/22 , A44C27/00 , B32B9/04 , B32B15/04 , G04B37/00 , C23C14/00 , C23C14/02 , C23C14/06 , B22F7/04 , C23C28/00
CPC分类号： A44C27/006 , B22F7/04 , B32B9/04 , B32B15/04 , C23C14/0015 , C23C14/024 , C23C14/0664 , C23C28/321 , C23C28/34 , G04B37/00 , G04B37/22 , Y10T428/12812
摘要： A decorative article comprises a substrate being primarily composed of at least any of Ti and stainless steel in at least part of a surface vicinity thereof; a first coat being formed on the substrate and being primarily composed of TiCN; a second coat being formed on a side of the first coat opposite a side facing the substrate and being composed of stainless steel; wherein a combined C content ratio and N content ratio in the first coat is equal to or more than 2.0 wt % and less than or equal to 19 wt %.
摘要翻译：装饰品包括在其表面附近的至少一部分中主要由至少任意Ti和不锈钢构成的基材; 主要由TiCN组成的第一涂层，第二涂层形成在第一涂层的与衬底相对的一侧上，并由不锈钢构成; 其中所述第一涂层中的组合C含量比和N含量比等于或大于2.0重量％且小于或等于19重量％。

4. 发明申请

US20140363933A1 COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS 有权
标题翻译：用于薄膜晶体管和平板显示器中的金属化的铜合金屏障层
公开(公告)号：US20140363933A1
公开(公告)日：2014-12-11
申请号：US14296796
申请日：2014-06-05
申请人： Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
发明人： Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
IPC分类号： H01L29/66
CPC分类号： H01L27/1244 , B81C1/00 , B81C1/00031 , B81C1/00404 , B81C1/00523 , B81C1/00547 , C21D1/00 , C21D9/00 , C21D2201/00 , C21D2211/00 , C21D2251/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/14 , G06F3/041 , G06F3/0412 , G06F3/044 , G06F2203/04103 , H01B1/026 , H01L23/53238 , H01L29/4908 , H01L29/6675 , H01L29/78603 , H01L29/78666 , H01L2924/0002 , Y10T428/12611 , Y10T428/1266 , Y10T428/12681 , Y10T428/12687 , Y10T428/12694 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12743 , Y10T428/1275 , Y10T428/12806 , Y10T428/12812 , Y10T428/12819 , Y10T428/12826 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , H01L2924/00
摘要： In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
摘要翻译：在各种实施例中，诸如薄膜晶体管的电子器件包括具有导体层的电极，并且在导体层下方设置阻挡层，该阻挡层包括Cu和一种或多种难熔金属元素的合金，所述难熔金属元素选自Ta，Nb ，Mo，W，Zr，Hf，Re，Os，Ru，Rh，Ti，V，Cr和Ni。

5. 发明授权

US08647561B2 Composite cutting inserts and methods of making the same 有权
标题翻译：复合切削刀片及其制造方法
公开(公告)号：US08647561B2
公开(公告)日：2014-02-11
申请号：US12179999
申请日：2008-07-25
申请人： X. Daniel Fang , David J. Wills , Prakash K. Mirchandani
发明人： X. Daniel Fang , David J. Wills , Prakash K. Mirchandani
IPC分类号： B22F3/02 , B22F7/02 , C22C1/06 , C22C29/00
CPC分类号： B22F7/062 , B22F2998/00 , C22C29/00 , C22C29/08 , Y10T407/27 , Y10T428/12576 , Y10T428/12611 , Y10T428/12771 , Y10T428/12806 , Y10T428/12812 , Y10T428/24942 , Y10T428/24983 , Y10T428/252 , Y10T428/30 , Y10T428/31678 , B22F2207/01 , B22F2207/11 , B22F2207/13
摘要： Embodiments of the present invention include methods of producing a composite article. A method comprises introducing a first powdered metal grade from a feed shoe into a first portion of a cavity in a die and a second powdered metal grade from the feed shoe into a second portion of the cavity, wherein the first powder metal grade differs from the second powdered metal grade in chemical composition or particle size. Further methods are also provided. Embodiments of the present invention also comprise composite inserts for material removal operations. The composite inserts may comprise a first region and a second region, wherein the first region comprises a first composite material and the second region comprises a second composite material.
摘要翻译：本发明的实施方案包括生产复合制品的方法。一种方法包括将第一粉末金属级从进料靴引入模具中的空腔的第一部分中，以及将第二粉末金属级从进料槽引入空腔的第二部分，其中第一粉末金属级与第二种粉末状金属级化学成分或粒度。还提供了其他方法。本发明的实施例还包括用于材料去除操作的复合插入件。复合插入件可以包括第一区域和第二区域，其中第一区域包括第一复合材料，第二区域包括第二复合材料。

6. 发明申请

US20110234091A1 NON-EVAPORABLE GETTER FOR FIELD-EMISSION DISPLAY 审中-公开
标题翻译：用于场发射显示的不可蒸发火箭
公开(公告)号：US20110234091A1
公开(公告)日：2011-09-29
申请号：US13046948
申请日：2011-03-14
申请人： Tadayuki Yoshitake , Takuto Moriguchi , Yoichi Ando
发明人： Tadayuki Yoshitake , Takuto Moriguchi , Yoichi Ando
IPC分类号： H01J17/24 , B05D1/36 , B32B15/04
CPC分类号： H01J31/127 , H01J29/94 , H01J2329/948 , Y10T428/12812
摘要： The present invention provides a non-evaporable getter for an FED which can remove a plurality of types of gases. The non-evaporable getter for the FED has a first layer containing titanium, and a second layer containing crystalline zirconium layered on the first layer. The average value of crystalline grain sizes of the crystalline zirconium is 3 nm or more but 20 nm or less.
摘要翻译：本发明提供一种能够除去多种类型的气体的FED的非蒸发性吸气剂。用于FED的非蒸发性吸气剂具有包含钛的第一层和在第一层上层压的包含结晶锆的第二层。结晶锆的晶粒尺寸的平均值为3nm以上且20nm以下。

7. 发明授权

US07998594B2 Methods of bonding pure rhenium to a substrate 有权
标题翻译：将纯铼结合到基底上的方法
公开(公告)号：US07998594B2
公开(公告)日：2011-08-16
申请号：US12028893
申请日：2008-02-11
申请人： Don Mittendorf , Scott Sperl
发明人： Don Mittendorf , Scott Sperl
IPC分类号： B32B15/04
CPC分类号： C23C28/023 , B32B15/01 , C23C18/165 , C23C18/1692 , C23C18/32 , C25D3/50 , Y10T428/12771 , Y10T428/12778 , Y10T428/12806 , Y10T428/12812 , Y10T428/12931 , Y10T428/12944
摘要： Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
摘要翻译：提供了将纯铼粘合到包含材料的基底上的方法。还提供了被配置为与另一部件摩擦接触的非润滑部件。在一个实施例中，仅作为示例，一种方法包括在基底上设置共晶合金以形成内层，该共晶合金基本上由基础合金和一种或多种熔点降低剂组成，并且熔融温度较低比基底材料的熔融温度和铼的熔融温度，将纯铼放置在层之间，并将层间加热至基本等于或大于共晶合金的熔融温度的温度，但也就是说低于基底材料的熔融温度和纯铼的熔融温度，以将纯铼结合到基底上。

8. 发明授权

US07892655B2 Ultrathin copper foil with carrier and printed circuit board using same 有权
标题翻译：超薄铜箔带载体和印刷电路板使用相同
公开(公告)号：US07892655B2
公开(公告)日：2011-02-22
申请号：US11610799
申请日：2006-12-14
申请人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
发明人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
IPC分类号： B32B15/00
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译：一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

9. 发明授权

US07771838B1 Hermetically bonding ceramic and titanium with a Ti-Pd braze interface 有权
标题翻译：用Ti-Pd钎焊界面粘结陶瓷和钛
公开(公告)号：US07771838B1
公开(公告)日：2010-08-10
申请号：US11238603
申请日：2005-09-29
申请人： Tom Xiaohai He , Michael S. Colvin
发明人： Tom Xiaohai He , Michael S. Colvin
IPC分类号： B32B15/04 , B23K103/08 , B23K103/14
CPC分类号： B23K1/19 , A61N1/3605 , A61N1/37205 , A61N1/3756 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/322 , B23K35/325 , B23K2103/14 , B32B15/018 , C22C14/00 , Y10T428/12611 , Y10T428/12618 , Y10T428/12806 , Y10T428/12812 , Y10T428/12875
摘要： A component assembly for use in living tissue comprises: a ceramic part; a metal part; and a titanium palladium (Ti—Pd) interface layer for bonding said ceramic part to the metal part. In one embodiment, the interface layer may be formed from a single titanium layer in contact with a single palladium layer, or in other embodiments, may be at least a three layer laminate (Pd—Ti—Pd). A microstimulator housing comprising a ceramic part, a titanium or titanium alloy part sandwiching the Ti—Pd interlayer may be employed to create a eutectic bond that is strong and hermetic.
摘要翻译：用于生物组织的组件组件包括：陶瓷部件; 金属部分和用于将所述陶瓷部件接合到金属部件的钛钯（Ti-Pd）界面层。在一个实施例中，界面层可以由与单个钯层接触的单个钛层形成，或者在其它实施例中可以是至少三层层压体（Pd-Ti-Pd）。可以使用包含陶瓷部件，夹入Ti-Pd中间层的钛或钛合金部件的微型激励器壳体来产生强而密闭的共晶键。

10. 发明申请

US20100119866A1 LOW-TEMPERATURE SYNTHESIS OF INTEGRATED COATINGS FOR CORROSION RESISTANCE 有权
标题翻译：低温合成用于耐腐蚀性的集成涂层
公开(公告)号：US20100119866A1
公开(公告)日：2010-05-13
申请号：US12268153
申请日：2008-11-10
申请人： John Harry Perepezko , Ridwan Sakidja
发明人： John Harry Perepezko , Ridwan Sakidja
IPC分类号： B32B15/04 , B32B15/01 , C23C16/06
CPC分类号： B32B15/012 , C23C10/34 , C23C10/52 , C23C10/58 , C23C10/60 , C23C28/321 , C23C28/322 , C23C28/325 , C23C28/34 , C23C28/345 , Y10T428/12458 , Y10T428/12493 , Y10T428/12535 , Y10T428/12576 , Y10T428/12757 , Y10T428/12812 , Y10T428/12951 , Y10T428/12972 , Y10T428/26
摘要： Methods for the low-temperature synthesis of an integrated, corrosion-resistant coating structure for metal substrates by means of multi-component pack cementation are provided. The synthesis of the integrated coating structures at low temperatures can avoid or minimize degradation of the mechanical properties of the substrates. The integrated coating structures can increase the lifetime of high temperature steels under severe steam environments and, therefore, provide a technological enabler for the high-temperature operation of steam power generation plants.
摘要翻译：提供了通过多组分封装胶结低温合成金属基底的综合耐腐蚀涂层结构的方法。在低温下综合涂层结构的合成可以避免或最小化基材的机械性能的降解。一体化涂层结构可以在严酷的蒸汽环境下提高高温钢的使用寿命，从而为蒸汽发电厂的高温运行提供技术支撑。

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