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1. 发明授权

US10569377B2 Robotic sharpening system 有权
公开(公告)号：US10569377B2
公开(公告)日：2020-02-25
申请号：US15898278
申请日：2018-02-16
申请人： Omnisharp, LLC
发明人： Jacob Robinson , Lynn Sarcione , Russell Aldridge , Marc Christenson , Mathius Jules , Joshua Bennett
IPC分类号： B24B49/12 , B24B3/40 , B24B53/007 , B24B41/06 , B24B49/16
摘要： An apparatus, system, and a method for sharpening a cutting tool. The system sharpens cutting tools by manipulating the tool, measuring the three dimensional profile of the tool, and then grinding the tool. The apparatus consists of a robot capable of six degrees of motion, a gripping mechanism, a force-torque sensor capable of at least two directions of force and/or torque, a three dimensional scanning subsystem, a loading subsystem, a user interface, an initial orientation scan subsystem, a data processing and robot control subsystem, and at least one grinding system comprising two counter-rotating grinding wheels. The method automates the grinding process so that dull cutting tools can be placed into the loading system, sharpened by the system, and then ejected fully honed.

2. 发明授权

US10464186B2 Method of polishing work and method of dressing polishing pad 有权
公开(公告)号：US10464186B2
公开(公告)日：2019-11-05
申请号：US15394274
申请日：2016-12-29
申请人： Fujikoshi Machinery Corp. , Kanazawa Institute of Technology
发明人： Kazutaka Shibuya , Jun Yanagisawa , Yoshio Nakamura , Michio Uneda , Kenichi Ishikawa
IPC分类号： B24B49/18 , B24B37/005 , B24B53/007 , B24B53/017 , B24B37/20 , B24B37/04 , B24B53/06 , B24B53/08
摘要： The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.

3. 发明授权

US10166645B2 Centerless grinding machine 有权
公开(公告)号：US10166645B2
公开(公告)日：2019-01-01
申请号：US15293752
申请日：2016-10-14
申请人： KOYO MACHINE INDUSTRIES CO., LTD.
发明人： Shizuki Sasakura , Naohiko Wakayama
IPC分类号： B24B5/26 , B24B53/007 , B24B51/00 , B24B53/04 , B24B41/02 , B24B53/00 , B24B53/047 , B24B53/053 , B24B5/22 , B24B49/18
摘要： A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.

4. 发明申请

US20180236623A1 Robotic Sharpening System 审中-公开
公开(公告)号：US20180236623A1
公开(公告)日：2018-08-23
申请号：US15898278
申请日：2018-02-16
申请人： Fonthill LLC
发明人： Jacob Robinson , Lynn Sarcione , Russell Aldridge , Marc Christenson , Mathius Jules , Joshua Bennett
IPC分类号： B24B3/40 , B24B49/12 , B24B49/16 , B24B41/06 , B24B53/007
CPC分类号： B24B3/40 , B24B3/54 , B24B41/066 , B24B49/12 , B24B49/16 , B24B53/003 , B24B53/007 , B24B53/075
摘要： An apparatus, system, and a method for sharpening a cutting tool. The system sharpens cutting tools by manipulating the tool, measuring the three dimensional profile of the tool, and then grinding the tool. The apparatus consists of a robot capable of six degrees of motion, a gripping mechanism, a force-torque sensor capable of at least two directions of force and/or torque, a three dimensional scanning subsystem, a loading subsystem, a user interface, an initial orientation scan subsystem, a data processing and robot control subsystem, and at least one grinding system comprising two counter-rotating grinding wheels. The method automates the grinding process so that dull cutting tools can be placed into the loading system, sharpened by the system, and then ejected fully honed.

5. 发明授权

US09744638B2 Method for decoating a glass panel 有权
公开(公告)号：US09744638B2
公开(公告)日：2017-08-29
申请号：US14768039
申请日：2014-09-29
申请人： LISEC AUSTRIA GMBH
发明人： Daniel Marat , Leopold Mader
IPC分类号： B24B7/24 , B24B9/10 , C03B33/07 , B24B53/007 , C03C23/00
CPC分类号： B24B7/241 , B24B7/242 , B24B7/245 , B24B7/247 , B24B9/10 , B24B53/007 , C03B33/074 , C03C23/0075 , C03C2218/328
摘要： When decoating a glass panel (3), a decoating tool (6) with a circular-cylindrical grinding element (8) is used, which element is set to rotate around its axis. In the end face of the grinding element (8) that is used when the active face (9) is decoated, a hole (10) and at least one radial groove (11) are provided. The decoating tool (6) is placed at a spot (A) on the glass panel (3) in a movement (arrow 13) that is oriented at an acute angle to the plane of the glass panel (3), which lies between the ends (B) and (C) of the strip-shaped decoating area (14) and moves first to the one end (B) (arrow 15) and then to the other end (C) (arrow 16) in order to strip coating from the glass panel (3) in the decoating area (14).

6. 发明授权

US09731400B2 Grinding wheel and cleaning method for grinding chamber 有权
公开(公告)号：US09731400B2
公开(公告)日：2017-08-15
申请号：US14662491
申请日：2015-03-19
申请人： DISCO CORPORATION
发明人： Takahiko Tsuno
IPC分类号： B08B3/02 , B08B9/00 , B08B9/093 , B08B1/00 , B24B53/007 , B24D7/18
CPC分类号： B24B53/007 , B08B1/007 , B08B3/02 , B08B9/00 , B08B9/093 , B24D7/18
摘要： A grinding wheel includes an annular base and a plurality of abrasive members fixed to the lower surface of the base and arranged annularly. The base has a plurality of through holes for discharging a grinding water. The plural through holes radially extend from the inner side surface to the outer side surface of the base. The plural through holes are arranged at given intervals in the circumferential direction of the base so that the grinding water is scattered in different directions from the through holes.

7. 发明申请

US20160375547A1 SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20160375547A1
公开(公告)日：2016-12-29
申请号：US15260439
申请日：2016-09-09
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Yosuke OTSUKA , Masako KODERA , Yukiteru MATSUI
IPC分类号： B24B53/007 , B24B1/00
CPC分类号： B24B53/007 , B24B1/00 , B24B37/04 , B24B37/042 , B24B37/044 , B24B37/10 , B24B37/107 , B24B53/017 , C11D3/0073 , C11D7/265 , C11D7/3209 , C11D7/3245 , C11D7/3281 , C11D11/0047 , H01L21/02065 , H01L21/02074 , H01L21/31053 , H01L21/3212 , H01L21/768
摘要： In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad.

8. 发明申请

US20150290767A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20150290767A1
公开(公告)日：2015-10-15
申请号：US14682774
申请日：2015-04-09
申请人： Ebara Corporation
发明人： Mitsunori SUGIYAMA , Kunimasa MATSUSHITA
IPC分类号： B24B53/007
CPC分类号： B24B53/007 , B24B27/0023 , B24B27/0069 , B24B27/0076 , B24B49/00 , B24B51/00 , H01L21/67219
摘要： A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to the polishing section or the cleaning section to which the test mode is set.
摘要翻译： CMP装置包括抛光单元3，清洁单元4，装载/卸载单元2，传送单元和被配置为控制传送单元中的基板的传送的控制部5。当抛光单元包括多个抛光部分时，或者清洁单元包括多个清洁部分时，控制部分5可以设置操作抛光部分或清洁部分的测试模式以进行一些多次抛光部分或多个清洁部分中的一些使得将基板转移到未设置测试模式的抛光部分或清洁部分，并且使得与基板相对于抛光部分的不同的测试基板或清洁测试模式设置的部分。

9. 发明申请

US20090221217A1 SOLAR PANEL EDGE DELETION MODULE 失效
标题翻译：太阳能板边缘删除模块
公开(公告)号：US20090221217A1
公开(公告)日：2009-09-03
申请号：US12358814
申请日：2009-01-23
申请人： DHRUV GAJARIA , Zhiyong Li , Gopalakrishna B. Prabhu , Yacov Elgar , John Visitacion , Yong Liu , Jeffrey S. Sullivan , Salvador Umotoy , Tai T. Ngo , Michael Marriott , Peter Crundwell , Vinay Shah , Ho Gene Choi , Dennis C. Pierce
发明人： DHRUV GAJARIA , Zhiyong Li , Gopalakrishna B. Prabhu , Yacov Elgar , John Visitacion , Yong Liu , Jeffrey S. Sullivan , Salvador Umotoy , Tai T. Ngo , Michael Marriott , Peter Crundwell , Vinay Shah , Ho Gene Choi , Dennis C. Pierce
IPC分类号： B24B1/00 , B24B19/02 , B24B41/02 , B24B53/007 , B24B55/06
CPC分类号： B24B9/10 , B24B49/045 , B24B55/02 , H01L21/67092 , H01L21/67715 , H01L21/67721 , H01L21/67727 , H01L31/186 , Y02E10/50 , Y02P70/521
摘要： The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.
摘要翻译：本发明一般涉及位于自动太阳能电池生产线内的边缘删除模块。边缘删除模块可以包括用于从太阳能电池装置的边缘区域去除材料并在去除材料之后清洁太阳能电池装置的边缘区域的砂轮装置。边缘删除模块还可以包括研磨元件，其一部分被周期性地研磨成横向前进到研磨轮装置。提供控制器来控制模块的各个面的操作和功能。

10. 发明申请

US20050282475A1 Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system 失效
标题翻译：用于在用于化学机械抛光系统的多个衬垫调节盘中破碎的装置和方法
公开(公告)号：US20050282475A1
公开(公告)日：2005-12-22
申请号：US10873557
申请日：2004-06-22
申请人： Randall Lujan
发明人： Randall Lujan
IPC分类号： H01L21/304 , B24B1/00 , B24B37/04 , B24B53/00 , B24B53/007
CPC分类号： B24B53/017 , B24B53/003
摘要： An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is removably attached to a drive shaft to which a polishing head that holds the semiconductor wafer is normally attached. The break-in head holds multiple pad conditioning disks and presses the plurality of pad conditioning disks against the moving polishing pad. The break-in head comprises a drive mechanism for rotating the multiple pad conditioning disks. The drive mechanism is coupled to the drive shaft and rotates the multiple pad conditioning disks by translating a rotating motion of the drive shaft into rotating motions of the multiple pad conditioning disks.
摘要翻译：一种用于打破用于化学机械抛光（CMP）系统的新的衬垫调节盘的装置，其通过将半导体晶片压靠移动的抛光垫来抛光半导体晶片。该装置包括可拆卸地附接到保持半导体晶片正常安装的抛光头的驱动轴的插入头。插入头保持多个垫调节盘并将多个垫调节盘压靠在移动的抛光垫上。插入头包括用于旋转多个衬垫调节盘的驱动机构。驱动机构联接到驱动轴并且通过将驱动轴的旋转运动转换成多个衬垫调节盘的旋转运动来旋转多个衬垫调节盘。

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