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1. 发明申请

US20200157394A1 FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SURFACE-TREATED METAL MEMBER, AND METHOD FOR PRODUCING METAL-RESIN COMPOSITE 审中-公开
公开(公告)号：US20200157394A1
公开(公告)日：2020-05-21
申请号：US16611250
申请日：2018-03-02
申请人： MEC COMPANY LTD.
发明人： Itsuro TOMATSU , Kosuke KUMAZAKI , Yasutaka AMITANI , Yuko SHIBANUMA , Ikuyo KATAYAMA
IPC分类号： C09J179/02 , B32B15/08 , B32B15/20 , B32B37/12 , C23C22/06 , C23C22/63 , C23C22/68 , C09J11/04 , C09J5/02 , H05K3/38
摘要： The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

2. 发明申请

US20190037841A1 ANTI-BACTERIAL PATTERNED SURFACES AND METHODS OF MAKING THE SAME 审中-公开
公开(公告)号：US20190037841A1
公开(公告)日：2019-02-07
申请号：US16077440
申请日：2017-02-13
申请人： AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
发明人： Yugen ZHANG , Guangshun YI
IPC分类号： A01N25/34 , C23C22/63 , A01N59/20 , A01N59/08
摘要： The present invention relates to a substrate comprising a plurality of integrally formed surface features, said surface features being micro-sized and/or nano-sized, said surface features comprising at least one pointed terminus. As a result of this unique surface, said substrate exhibits a biocidal activity because the terminal ends of said surface feature pierce through cell membrane of any microbial cell that comes into contact with the substrate, thereby causing cell deformation and lysis. The present invention also relates to a method producing said substrate. By a simple treatment of copper or zinc foil with a reagent solution comprising an alkali and an oxidizing agent, Cu(OH)2 nanotube arrays, CuO nano-blades and ZnO nano-needles are prepared. These surfaces are proven to be very effective in killing bacterial (such as E. coli) via a physical interaction.

3. 发明授权

US09338896B2 Adhesion promotion in printed circuit boards 有权
标题翻译：印刷电路板中的粘附促进
公开(公告)号：US09338896B2
公开(公告)日：2016-05-10
申请号：US13558019
申请日：2012-07-25
申请人： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Eric Walch
发明人： Abayomi I. Owei , Joseph A. Abys , Theodore Antonellis , Eric Walch
IPC分类号： B05D5/10 , H05K3/38 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , B05D3/10 , C23F1/18 , C23G1/20
CPC分类号： H05K3/385 , B05D3/10 , B05D5/10 , C23C22/52 , C23C22/63 , C23C22/73 , C23C22/78 , C23F1/18 , C23G1/20 , H05K3/383
摘要： Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.
摘要翻译：用于在制造印刷电路板期间增强铜导电层和电介质材料之间的粘附性的组合物和方法。调理组合物含有功能性有机化合物，优选过渡金属离子。功能性有机化合物，例如嘌呤衍生物，能够形成自组装单层。粘合促进组合物含有酸，优选无机酸和氧化剂。后一种组合物还可以含有选自Zn，Ni，Co，Cu，Ag，Au，Pd或其它Pt族金属中的腐蚀抑制剂和/或过渡金属离子。腐蚀抑制剂可以包含含氮芳族杂环化合物。

4. 发明授权

US6020029A Process for treating metal surfaces 有权
标题翻译：处理金属表面的方法
公开(公告)号：US6020029A
公开(公告)日：2000-02-01
申请号：US143898
申请日：1998-08-31
申请人： Donald Ferrier , Frank Durso
发明人： Donald Ferrier , Frank Durso
IPC分类号： C08J5/12 , B32B15/08 , C09J5/00 , C09J11/02 , C09J201/00 , C23C22/40 , C23C22/48 , C23C22/52 , C23C22/60 , C23C22/63 , C23C22/73 , C23F1/18 , H05K3/38 , H05K3/46 , B05D3/00 , C23C22/82
CPC分类号： C23C22/52 , C23F1/18 , H05K3/383 , H05K2203/0793 , H05K2203/0796 , H05K2203/124 , H05K3/4611
摘要： A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an alkaline solution. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
摘要翻译：一种处理金属表面的方法，其包括首先使金属表面与特定的酸性过氧化物粘附促进组合物接触，然后使该金属表面与碱性溶液接触。这种处理特别适用于处理印刷电路多层结构中使用的金属表面。

5. 发明授权

US5618456A Improvement of surface property of tip and nozzle for gas welder made of copper and copper alloys by chemical conversion coating treatment 失效
标题翻译：通过化学转化涂层处理改善由铜和铜合金制成的气体焊接头和喷嘴的表面性能
公开(公告)号：US5618456A
公开(公告)日：1997-04-08
申请号：US445561
申请日：1995-05-23
申请人： Chang-Joo Kim
发明人： Chang-Joo Kim
IPC分类号： F23D14/54 , B23K5/00 , B23K5/24 , B23K35/22 , C22C9/00 , C23C22/00 , C23C22/63 , B23K9/28
CPC分类号： C23C22/63 , B23K35/224
摘要： A method for improving the tip and nozzle of a gas welder in which a conventional or new surface oxidation chemical treatment was applied to improve the surface properties of the tip and nozzle of a gas welder made of copper or copper alloys. Continuous welding operation could then be possible for extended periods of time. If a black copper oxide layer is formed by chemical conversion coating treatment on the surface of the nozzle which is made of copper or copper alloys, then the splatters do not easily stick to the surface. Further, even if the splatters stick, they are more easily removed. In the case of the tip, a black copper oxide layer formed by chemical conversion coating treatment in the small hole of the tip makes the supply of the filler metal wire flow smoothly without troubles. Further, the black copper oxide layer formed by chemical conversion coating treatment also inhibits the sticking of splatters, so that the supply of the filler metal wire is smooth. The filler metal wire can be supplied without discontinuity at least during a limited life time which depends on the properties of the base material.
摘要翻译：一种用于改进气体焊接机的尖端和喷嘴的方法，其中采用常规或新的表面氧化处理以改善由铜或铜合金制成的气焊机的尖端和喷嘴的表面性质。连续焊接操作可能会延长一段时间。如果在由铜或铜合金制成的喷嘴的表面上通过化学转化涂覆处理形成黑色的氧化铜层，则溅射物不容易粘到表面上。此外，即使飞溅物粘着，它们更容易被去除。在尖端的情况下，通过在尖端的小孔中进行化学转化涂覆处理形成的黑色氧化铜层使得填充金属线的供给顺利地流动而没有麻烦。此外，通过化学转化涂覆处理形成的黑色氧化铜层也抑制了飞溅物的粘附，使得填充金属丝的供给是光滑的。填充金属丝可以至少在有限的寿命期内不间断地供应，这取决于基材的性质。

6. 发明授权

US4997516A Method for improving adherence of copper foil to resinous substrates 失效
标题翻译：提高铜箔对树脂基材粘附性的方法
公开(公告)号：US4997516A
公开(公告)日：1991-03-05
申请号：US442618
申请日：1989-11-29
申请人： Edward Adler
发明人： Edward Adler
IPC分类号： C23C22/63 , H05K3/38 , H05K3/46
CPC分类号： H05K3/385 , C23C22/63 , H05K2201/0355 , H05K2203/0307 , H05K2203/0315 , H05K2203/0723 , H05K2203/1157 , H05K3/4611
摘要： The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses between said copper foil surfaces and adjacent surfaces of resinous layers. It is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. In a method according to the invention, an oxidized cooper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent. The result is a reticulated metallic copper microstructure capable of forming a strong adhesive bond with a resinous substrate, and having a high resistance to thermal, mechanical, and chemical (e.g. acid) stress.
摘要翻译：本发明包括对铜表面的表面处理的改进。它产生强而稳定的粘结，耐化学侵蚀，以及所述铜箔表面和树脂层相邻表面之间的热和机械应力。它在多层印刷电路制造以及铜电路线路和彼此断开的区域的处理中是特别有用的，即不具有导电连续性的区域。在根据本发明的方法中，在聚合物添加剂的存在下，氧化的铜表面被还原，然后将部分还原的表面暴露于非氧化试剂。结果是能够与树脂基材形成强粘合剂并且具有高耐热，机械和化学（例如酸）应力的网状金属铜微结构。

7. 发明授权

US4844981A Adhesion promoter for printed circuits 失效
标题翻译：印刷电路用粘合促进剂
公开(公告)号：US4844981A
公开(公告)日：1989-07-04
申请号：US32953
申请日：1987-03-31
申请人： Adela Landau
发明人： Adela Landau
IPC分类号： C23C22/63 , H05K3/38 , H05K3/46
CPC分类号： C23C22/63 , H05K3/385 , H05K2201/0355 , H05K2203/0315 , H05K3/4611 , Y10S428/901 , Y10T428/31511
摘要： It is among the principal objects of invention to provide a composition and a method for improving the adhesion between a copper foil and a printed circuit substrate by the provision of an adhesion promoting copper oxide layer on the copper film.The provision of copper oxide layers on the surface of copper films by immersion in a chlorite-hydroxide bath as conventionally conducted presents problems of safety and reproducibility. This process is improved by employing an oxidizing solution containing an alkali or alkaline earth metal chlorite at a concentration of from 100 grams per liter to complete saturation, and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter. The process preferably forms an adhesion improving copper oxide film within commercially practical periods of time, on the order of 7 minutes or less, at practically low temperatures, on the order of from 80.degree. F. to 200.degree. F., and preferably less than about 140.degree. F. The solution can be sprayed by conventional spray etchers.The copper oxide films produced according to the most preferred conditions are brown in coloration and provide adhesion values according to the standard peel test of greater than about 5 pounds per inch with contact times of from about 3 to about 5 minutes.
摘要翻译：本发明的主要目的是提供一种通过在铜膜上提供粘附促进铜氧化物层来提高铜箔和印刷电路基板之间的粘附性的组合物和方法。通过浸渍在常规方法的亚氯酸盐氢氧化物浴中在铜膜的表面上提供氧化铜层提出了安全性和再现性的问题。通过使用含有浓度为100克/升的碱金属或碱土金属亚氯酸盐以完成饱和的氧化溶液和浓度为5至25克/升的氢氧化钠或氢氧化钾来改进该方法。该方法优选在商业实用的时间段内在几乎低的温度下在约80分钟至200°F的条件下形成约7分钟或更短的粘附改善氧化铜膜，优选小于约140°F。该溶液可以用常规喷雾器喷涂。根据最优选的条件生产的氧化铜膜是着色的棕色，并根据标准剥离试验提供大于约5磅/英寸的粘合值，接触时间为约3至约5分钟。

8. 发明授权

US4717439A Process for the treatment of copper oxide in the preparation of printed circuit boards 失效
标题翻译：在制备印刷电路板时处理氧化铜的工艺
公开(公告)号：US4717439A
公开(公告)日：1988-01-05
申请号：US790999
申请日：1985-10-24
申请人： Juan Hajdu , Martin W. Bayes
发明人： Juan Hajdu , Martin W. Bayes
IPC分类号： C23C22/63 , H05K3/38 , H05K3/46 , H05K1/09 , C23F11/00 , H05K3/22
CPC分类号： C23C22/63 , H05K3/385 , H05K2201/0355 , H05K2203/0315 , H05K3/4611
摘要： A composition and process is disclosed for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation which comprises contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide.
摘要翻译：公开了一种组合物和方法，用于将印刷电路板的铜电路上的氧化铜涂层的浸出性提高到其制备中使用的溶液，其包括将电路板的氧化铜与含有两性元素的溶液接触，所述两性元素形成酸性氧化物，如二氧化硒。

9. 发明授权

US3998993A Electrical device having a metal surface bearing a corrosion inhibitor 失效
标题翻译：具有带有腐蚀抑制剂的金属表面的电气装置
公开(公告)号：US3998993A
公开(公告)日：1976-12-21
申请号：US584869
申请日：1975-06-09
申请人： Edwin Arthur Chandross , Coralie Anne Pryde
发明人： Edwin Arthur Chandross , Coralie Anne Pryde
IPC分类号： B05D7/14 , B05D7/16 , B23K35/22 , C09D5/08 , C09D133/04 , C09D155/00 , C23C22/00 , C23C22/63 , C23C22/68 , C23F11/00 , B32B15/08 , B32B27/00
CPC分类号： B05D7/16 , B23K35/226 , C23C22/68 , Y10T428/31692 , Y10T428/31699
摘要： Electrical device having a metal surface to at least a portion of which electrical connections are to be made by soldering, and having a coating on said portion which protects it against surface alteration which would tend to render such soldering more difficult but through which coating soldering can be effected, said coating comprising a polymer of at least one methacrylate of the general formula ##STR1## wherein R is selected from the group comprising alkyl radicals having from 1-6 carbon atoms and a glycidyl radical.
摘要翻译：具有金属表面的电气设备至少部分地通过焊接进行电连接，并且在所述部分上具有保护其免受表面改变的涂层，这将导致这种焊接更困难，但是通过该涂层焊接可以所述涂层包含至少一种通式为“IMAGE”的甲基丙烯酸酯的聚合物，其中R选自具有1-6个碳原子的烷基和缩水甘油基。

10. 发明授权

US3544389A Process for surface treatment of copper and its alloys 失效
标题翻译：铜及其合金的表面处理工艺
公开(公告)号：US3544389A
公开(公告)日：1970-12-01
申请号：US3544389D
申请日：1967-12-18
申请人： BELL TELEPHONE LABOR INC
发明人： VAZIRANI HARGOVIND N
IPC分类号： C09J5/00 , C09J5/02 , C23C22/63 , C23C22/68 , C23G1/14 , C23G3/00 , C23F7/02
CPC分类号： C23C22/63 , Y10T428/31522

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