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    • 5. 发明授权
    • Arrangement of plural micro-cooling devices with electronic components
    • 具有电子部件的多个微型冷却装置的布置
    • US5737186A
    • 1998-04-07
    • US639102
    • 1996-04-22
    • Hans-Juergen FuesserReinhard ZachaiWolfram MuenchTim Gutheit
    • Hans-Juergen FuesserReinhard ZachaiWolfram MuenchTim Gutheit
    • F28F3/12H01C1/082H01L23/473H05K7/20
    • H01C1/082F28F3/12H01L23/473H01L2924/0002
    • An arrangement of a plurality of microcooling devices provided with electrical components, each microcooling device having a closed channel structure for a coolant to flow through, and being provided with electrical conductors for the electronic components and with externally carried fluid ducts for a coolant which flows through the channel structures. A covering layer which forms one of at least two flat sides of the microcooling device is made from an electrically insulating material with good heat conductivity. The electronic components are arrayed on this cover layer and on the opposite flat side of each microcooling device. Adjacent microcooling devices which are provided with electronic components on confronting flat sides are arranged with their components spaced apart or staggered with respect to one another, and the components of one microcooling device preferably are in contact with the cover layer of the adjacent microcooling device.
    • 设置有多个具有电气部件的微冷却装置的布置,每个微冷装置具有用于冷却剂流过的封闭通道结构,并且设置有用于电子部件的电导体和用于流过冷却剂的外部承载流体管道 渠道结构。 形成微冷装置的至少两个平坦侧面之一的覆盖层由具有良好导热性的电绝缘材料制成。 电子部件排列在该覆盖层上并且排列在每个显微冷却装置的相对的平坦侧上。 在相对的平坦侧面上设置有电子部件的相邻的微冷装置被布置成其部件相对于彼此分开或交错,并且一个微冷装置的部件优选地与相邻的微冷装置的覆盖层接触。