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1. 发明授权

US12033774B2 NTC thin film thermistor and method for producing an NTC thin film thermistor 有权
公开(公告)号：US12033774B2
公开(公告)日：2024-07-09
申请号：US17617760
申请日：2020-07-03
申请人： TDK Electronics AG
发明人： Thomas Stendel , Jan Ihle , Christl Lisa Mead , Thomas Bernert , Sebastian Redolfi , Marko Vrabelj
IPC分类号： H01C7/04 , H01C1/14 , H01C7/00 , H01C17/075 , H05K1/18
CPC分类号： H01C7/042 , H01C1/14 , H01C7/006 , H01C17/075 , H05K1/182 , H05K2201/10196
摘要： An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

2. 发明授权

US11824080B2 Thin-film resistor (TFR) with displacement-plated TFR heads 有权
公开(公告)号：US11824080B2
公开(公告)日：2023-11-21
申请号：US17233342
申请日：2021-04-16
申请人： Microchip Technology Incorporated
发明人： Yaojian Leng
IPC分类号： H01L23/532 , H01C17/075 , H01L49/02 , H01C7/00 , H01L23/00
CPC分类号： H01L28/24 , H01C7/006 , H01C17/075 , H01L23/53238 , H01L24/03 , H01L24/05
摘要： A thin film resistor (TFR) module may be formed in copper interconnect in an integrated circuit device. A pair of displacement-plated TFR heads may be formed by forming a pair of copper TFR head elements (e.g., damascene trench elements) spaced apart from each other in a dielectric region, and displacement plating a barrier region on each TFR head element to form a displacement-plated TFR head. A TFR element may be formed on the pair of displacement-plated TFR heads to define a conductive path between the pair of TFR head elements through the TFR element and through the displacement-plated barrier region on each metal TFR head. Conductive contacts may be formed connected to the pair of displacement-plated TFR heads. The displacement-plated barrier regions may protect the copper TFR heads from copper corrosion and/or diffusion, and may comprise CoWP, CoWB, Pd, CoP, Ni, Co, Ni—Co alloy, or other suitable material.

3. 发明授权

US10985090B2 Methods of manufacturing a thin film resistor with ends overlapped by interconnect pads 有权
公开(公告)号：US10985090B2
公开(公告)日：2021-04-20
申请号：US16221767
申请日：2018-12-17
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Yuan-Tai Tseng , Chia-Shiung Tsai , Chung-Yen Chou , Ming-Chyi Liu
IPC分类号： H01C17/075 , H01L21/70 , H01L21/768 , H01L23/485 , H01L49/02 , H01C7/00 , H01L23/522 , H01L23/532
摘要： A novel integrated circuit and method thereof are provided. The integrated circuit includes a plurality of first interconnect pads, a plurality of second interconnect pads, a first inter-level dielectric layer, a thin film resistor, and at least two end-caps. The end-caps, which are connectors for the thin film resistor, are positioned at the same level with the plurality of second interconnect pads. Therefore, an electrical connection between the end-caps and the plurality of second interconnect pads can be formed by directly connection of them. An integrated circuit with a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.

4. 发明授权

US10788377B2 Sensor element and method for producing a sensor element 有权
公开(公告)号：US10788377B2
公开(公告)日：2020-09-29
申请号：US15772790
申请日：2016-10-18
申请人： EPCOS AG
发明人： Jan Ihle , Anke Weidenfelder , Christl Lisa Mead , Gerald Kloiber
IPC分类号： G01K7/22 , G01K7/16 , B28B3/02 , B28B11/24 , H01C7/04 , H01C17/28 , G01K7/18 , H01C7/00 , H01C17/08 , H01C17/12 , H01C17/075
摘要： A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element for temperature measurement includes a ceramic carrier and at least one NTC layer printed on the carrier, wherein the NTC layer covers at least part of a surface of the carrier, and wherein the sensor element is designed for wireless contacting.

5. 发明授权

US10211280B2 Method of forming tunable resistor with curved resistor elements 有权
公开(公告)号：US10211280B2
公开(公告)日：2019-02-19
申请号：US15799435
申请日：2017-10-31
申请人： International Business Machines Corporation
发明人： Daniel C. Edelstein , Chih-Chao Yang
IPC分类号： H01L21/00 , H01L49/02 , H01C7/00 , H01C17/075 , H01L23/522 , H01L23/532 , H01L23/528 , H01L21/3205 , H01L21/768 , H01L21/321 , H01L21/02
摘要： A resistor structure is provided that contains curved resistor elements. The resistor structure is embedded within an interconnect dielectric material and the resistivity of an electrical conducting resistive material of the resistor structure can be tuned to a desired resistivity during the manufacturing of the resistor structure. Notably, an electrical conducting metallic structure having a concave outermost surface is provided in a dielectric material layer. A doped metallic insulator layer is formed on the concave outermost surface of the metallic structure. A controlled surface treatment process is then performed to an upper portion of the doped metallic insulator layer to convert the upper portion of the doped metallic insulator layer into an electrical conducting resistive material. An interconnect dielectric material can then be formed to embed the entirety of the remaining doped metallic insulator layer and the electrical conducting resistive material.

6. 发明授权

US10157820B2 Methods for manufacturing a thin film resistor over interconnect pads 有权
公开(公告)号：US10157820B2
公开(公告)日：2018-12-18
申请号：US15489494
申请日：2017-04-17
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Yuan-Tai Tseng , Chia-Shiung Tsai , Chung-Yen Chou , Ming-Chyi Liu
IPC分类号： H01L23/522 , H01L49/02 , H01C7/00 , H01C17/075 , H01L23/485 , H01L21/70 , H01L21/768 , H01L23/532
摘要： A novel integrated circuit and method thereof are provided. The integrated circuit includes a plurality of first interconnect pads, a plurality of second interconnect pads, a first inter-level dielectric layer, a thin film resistor, and at least two end-caps. The end-caps, which are connectors for the thin film resistor, are positioned at the same level with the plurality of second interconnect pads. Therefore, an electrical connection between the end-caps and the plurality of second interconnect pads can be formed by directly connection of them. An integrated circuit with a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.

7. 发明申请

US20180197940A1 RESISTORS WITH CONTROLLED RESISTIVITY 审中-公开
公开(公告)号：US20180197940A1
公开(公告)日：2018-07-12
申请号：US15814057
申请日：2017-11-15
申请人： International Business Machines Corporation
发明人： Daniel C. Edelstein , Chih-Chao Yang
IPC分类号： H01L49/02 , H01L21/3205 , H01L21/768 , H01L21/02 , H01L21/321 , H01L23/532 , H01L23/528 , H01L23/522 , H01C7/00 , H01C17/075
CPC分类号： H01L28/24 , H01C7/006 , H01C17/075 , H01L21/02183 , H01L21/32051 , H01L21/321 , H01L21/76802 , H01L21/76823 , H01L21/76834 , H01L21/7684 , H01L21/76846 , H01L21/76877 , H01L23/5228 , H01L23/528 , H01L23/53238 , H01L23/5329
摘要： The present application provides planar and stacked resistor structures that are embedded within an interconnect dielectric material in which the resistivity of an electrical conducting resistive material or electrical conducting resistive materials of the resistor structure can be tuned to a desired resistivity during the manufacturing of the resistor structure. Notably, a doped metallic insulator layer is formed atop a substrate. A controlled surface treatment process is then performed to an upper portion of the doped metallic insulator layer to convert the upper portion of the doped metallic insulator layer into an electrical conducting resistive material layer. The remaining doped metallic insulator layer and the electrical conducting resistive material layer are then patterned to provide the resistor structure.

8. 发明申请

US20170110225A1 CERAMIC CARRIER AND SENSOR ELEMENT, HEATING ELEMENT AND SENSOR MODULE, EACH WITH A CERAMIC CARRIER AND METHOD FOR MANUFACTURING A CERAMIC CARRIER 审中-公开
公开(公告)号：US20170110225A1
公开(公告)日：2017-04-20
申请号：US15129288
申请日：2015-03-25
申请人： HERAEUS SENSOR TECHNOLOGY GMBH
发明人： Thomas LOOSE , Stefan DIETMANN , Alfred FLECKENSTEIN , Dieter TEUSCH
IPC分类号： H01C1/016 , H01C17/075 , G01K7/18 , H01C7/00
摘要： An Al2O3 carrier has a thin-film structure of platinum or a platinum alloy arranged thereon. The carrier and/or the thin-film structure are adapted to reduce mechanical stresses owing to different thermal expansion coefficients. The carrier and/or the thin-film structure include a surface of the carrier in the region of the thin-film structure is smoothed at least in sections to reduce the adhesion and/or a surface of the carrier has an intermediate layer on which the thin-film structure is arranged. The thermal expansion coefficient of the intermediate layer is from 8*10−6/K to 16*10−6/K, in particular from 8.5*10−6/K to 14*10−6/K, and/or the thin-film structure has at least one conductor path that is undular at least in sections, said conductor path extends laterally along the surface of the carrier.

9. 发明授权

US09560883B2 Electronic smoking articles 有权
标题翻译：电子烟制品
公开(公告)号：US09560883B2
公开(公告)日：2017-02-07
申请号：US14200646
申请日：2014-03-07
申请人： Altria Client Services Inc.
发明人： Eric Hawes
IPC分类号： A24F47/00 , A61L9/03 , B23P11/00 , H01C17/075
CPC分类号： A24F47/008 , A61L9/037 , B23P11/00 , C09D11/52 , H01C17/075 , H05B1/0244 , Y10T29/49083 , Y10T29/49826
摘要： An electronic smoking article, a method of manufacturing an electronic smoking article, and a method of achieving a smoking experience without combusting tobacco are disclosed. The electronic smoking article includes an authenticated first section, which includes an aerosol generation unit having at least one heater; an authenticated second section, which includes a power supply operable to apply voltage to the at least one heater for heating a liquid in at least a portion of the aerosol generation unit to form an aerosol; and a conductive ink circuit embedded within the first and second sections, and wherein the power supply and the aerosol generation unit are electrically connected upon joining the first and second sections, and wherein each of the first and second sections has a portion of the conductive ink circuit.
摘要翻译：公开了一种电子烟制品，电子吸烟制品的制造方法以及不燃烧烟草而实现吸烟经验的方法。电子烟制品包括经认证的第一部分，其包括具有至少一个加热器的气溶胶发生单元; 认证的第二部分，其包括可操作以向所述至少一个加热器施加电压的电源，用于加热所述气溶胶发生单元的至少一部分中的液体以形成气溶胶; 以及嵌入在所述第一和第二部分内的导电油墨电路，并且其中所述电源和所述气溶胶发生单元在接合所述第一和第二部分时电连接，并且其中所述第一部分和所述第二部分中的每一个具有所述导电墨水的一部分电路。

10. 发明申请

US20160270152A1 COMPOSITE PANEL WITH INTEGRATED HEATER AND ASSOCIATED METHODS FOR MANUFACTURING 有权
标题翻译：具有集成加热器和相关方法制造的复合面板
公开(公告)号：US20160270152A1
公开(公告)日：2016-09-15
申请号：US14656220
申请日：2015-03-12
申请人： The Boeing Company
发明人： Jeffrey L. Duce , Joseph A. Marshall, IV , Ashley House , Jason Turner
IPC分类号： H05B1/02 , H01C17/075 , H05B3/18 , H01C17/02
CPC分类号： H05B1/0236 , F24D13/022 , F24D2200/08 , F24D2220/2081 , F24H9/1872 , H01C17/02 , H01C17/075 , H05B1/0238 , H05B3/06 , H05B3/18 , H05B3/20 , H05B3/34 , H05B2203/013 , H05B2203/017 , H05B2203/02 , H05B2203/026 , H05B2203/029 , H05B2206/023 , Y02B30/26
摘要： Described herein is a composite panel that includes a first layer made from an electrically non-conductive material. The composite panel also includes a resistance heater printed onto the first layer. Further, the composite panel includes a second layer adjacent the resistance heater, the resistance heater being positioned between the first layer and the second layer. The second layer is made from an electrically non-conductive material.
摘要翻译：这里描述的是包括由不导电材料制成的第一层的复合面板。复合面板还包括印刷在第一层上的电阻加热器。此外，复合面板包括邻近电阻加热器的第二层，电阻加热器位于第一层和第二层之间。第二层由非导电材料制成。

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