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1. 发明申请

US20230140128A1 SILENT ENTRY TORCHING AND OXYGEN DELIVERY SYSTEM AND CONFIGURATION 有权
公开(公告)号：US20230140128A1
公开(公告)日：2023-05-04
申请号：US18146507
申请日：2022-12-27
申请人： SPECIAL PROJECTS OPERATIONS, INC.
发明人： Mark A. HANSEN , Brennan E. HANSEN
IPC分类号： B23K35/02 , B23K35/22 , B23K7/00 , A62B7/02 , B23K7/10 , B23K7/08
摘要： A system for performing exothermic operations or oxygen delivery uses a rod and handle configuration to create a flowpath of oxygen. The rod includes cables having stainless steel fibers that burn using the oxygen within a hollow center area. While burning, the rod cuts through material. A sheath covers the covers to contain the gases and prevent unraveling of the cables. The handle attaches to the rod and provides control of the flow of oxygen to the rod. A manifold fixing in place bottles of oxygen connects to the handle and can be fixed to provide different mixtures from different bottles. The rod is disconnected when needed to fix a mask thereto for delivering breathable oxygen to a patient.

2. 发明申请

US20230139132A1 METAL JOINED BODY AND PRODUCTION METHOD THEREFOR 有权
公开(公告)号：US20230139132A1
公开(公告)日：2023-05-04
申请号：US17884797
申请日：2022-08-10
申请人： KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO , TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Hideaki MATSUOKA , Hiroaki KADOURA , Takashi ASADA , Hiroyuki MORI , Tatsuyuki AMAGO , Ayaka KAGAMI , Shuhei OGURA , Tomohiko SEKIGUCHI , Kyosuke IZUNO
IPC分类号： B62D29/00 , B23K11/00 , B23K11/11 , B23K11/30 , B62D25/02 , B62D25/06
摘要： A metal joined body has an iron base body and an aluminum base body that are joined together via a joint layer. The joint layer has a first layer composed of a first intermetallic compound formed on the iron base body side and a second layer composed of a second intermetallic compound formed on the aluminum base body side. The first layer has one or more first protrusions that merge integrally into the iron base body and extend in a pile shape into the first intermetallic compound. The second layer may have one or more second protrusions that are composed of a second intermetallic compound and extend in a columnar shape into the aluminum base body. The first intermetallic compound may contain Al5Fe2, and the second intermetallic compound may contain Al3Fe. The total thickness of the first layer and the second layer is, for example, 2 to 15 μm.

3. 发明申请

US20230138528A1 MACHINE TOOL 有权
公开(公告)号：US20230138528A1
公开(公告)日：2023-05-04
申请号：US17902419
申请日：2022-09-02
申请人： Hybrid Manufacturing Technologies Limited
发明人： Jason B. Jones , Peter Coates
IPC分类号： B23P23/04 , B23K26/08 , B23K26/34 , B05C19/06 , B23K9/32 , B05C5/00 , B23K26/342 , B23K26/082 , B23K26/14 , B05B7/22 , B05B15/65 , B29C64/209 , B22F10/25 , B22F12/00 , B22F12/44 , B22F12/55 , B05B13/02 , B05D1/02 , B05D3/00 , B33Y30/00 , B23K10/02 , B23K15/00 , B23K15/08 , B23K26/06 , B23K26/36 , B33Y10/00 , B33Y80/00 , B23K9/04 , B23K26/00 , B23P15/02 , B29C73/24
摘要： A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.

4. 发明申请

US20230138508A1 TWO-STEP DECAPSULATION TECHNIQUE FOR SEMICONDUCTOR PACKAGE HAVING SILVER BOND WIRES 有权
公开(公告)号：US20230138508A1
公开(公告)日：2023-05-04
申请号：US17513037
申请日：2021-10-28
申请人： Silicon Laboratories Inc.
发明人： Erwin Hendarto
IPC分类号： H01L21/56 , H01L23/00 , H01L23/31 , H01L23/552 , H01L21/67 , B23K26/362
摘要： In one embodiment, a method includes: laser ablating an encapsulant of a semiconductor package, until a threshold amount of the encapsulant remains above one or more die of the semiconductor package; and providing at least one drop of acid onto a surface of the ablated semiconductor package to acid etch for a first time duration, to remove a remaining portion of the encapsulant above the one or more die, where after the acid etch, a die of interest is exposed and the silver bond wires of the semiconductor package are preserved.

5. 发明申请

US20230136158A1 LASER CUTTING METHOD AND SYSTEM FOR IRREGULAR PARTS BASED ON MACHINE VISION 有权
公开(公告)号：US20230136158A1
公开(公告)日：2023-05-04
申请号：US18066362
申请日：2022-12-15
申请人： Guangdong University of Technology
发明人： Lijun WEI , Tai ZHANG , Qiang LIU , Libin LIN , Ailin YU
IPC分类号： G05B19/19 , B23K26/38 , B23K26/03
摘要： A laser cutting method for irregular parts based on machine vision includes: (A) obtaining and numbering vertices of all parts on the layout diagram; (B) planning a part vertex set and an empty cutting path vertex set; (C) obtaining a shortest empty cutting path and the empty cutting path vertex set with the shortest empty cutting path; (D) cutting the parts one by one according to an order obtained by the CPLEX algorithm. This application further provides a laser cutting system.

6. 发明授权

US11638969B2 Laser-welded lap joint, method for producing laser-welded lap joint, and automobile frame component 有权
公开(公告)号：US11638969B2
公开(公告)日：2023-05-02
申请号：US17055734
申请日：2019-05-20
申请人： JFE Steel Corporation
发明人： Asato Hara , Yasushi Kitani
IPC分类号： B23K26/244 , B23K26/06 , B23K103/04 , B23K101/00
摘要： A laser-welded lap joint includes a weld zone formed by joining a plurality of steel sheets one over another together by laser welding. The weld zone has a J shape and includes a main weld zone having a linear weld line shape and a weld terminal end zone having an arcuate or circular weld line shape. The length L1 of the main weld zone is ⅔ or more and ⅘ or less of the full length L of the weld zone represented by formula (1). The radius R of the weld terminal end zone satisfies formula (2). The angle θ of the weld terminal end zone satisfies formula (3). The total size of a gap between the plurality of steel sheets in a lapped portion is 0% or more and 15% or less of the total thickness of the plurality of steel sheets.

7. 发明授权

US11638967B2 Welding apparatus and method 有权
公开(公告)号：US11638967B2
公开(公告)日：2023-05-02
申请号：US16498200
申请日：2018-03-29
申请人： AMADA MIYACHI UK LIMITED
发明人： Mark Aherne , Ian Cornelius Brown
IPC分类号： B23K11/25
摘要： The present invention relates micro resistance welding apparatus and to a method of welding. In particular, the present invention relates to small scale or micro welding apparatus and to a method of micro resistance welding using a controlled sequence of current, voltage and/or power signal profile for an electric arc. The invention provides a welding apparatus comprising: a controller supplying a controlled drive current to a weld head circuit in which the controller supplies said controlled drive current in dependence upon electrical feedback from the weld head circuit and in which the controlled drive current is defined by a sequence of segments and for each segment the welding apparatus operates in a mode defined by setting one of a predetermined current target, a predetermined voltage target or a predetermined power target; and at least two of the segments are operated in a different mode from one another. The invention also provide a method of operating such an apparatus.

8. 发明授权

US11638965B2 Systems and methods for non-continuous deposition of a component 有权
公开(公告)号：US11638965B2
公开(公告)日：2023-05-02
申请号：US16837696
申请日：2020-04-01
申请人： 3D Systems, Inc.
发明人： Alexander Gabriel Steinberg , Rex Thomas Alexandre
IPC分类号： B23K9/04 , B33Y10/00 , B33Y40/20 , B23K9/095 , B23K9/12 , B23K9/32 , B33Y50/02
摘要： A method of manufacturing using an additive manufacturing process includes providing a deposition system, the deposition system configured to provide a plurality of cells to form a blank of a part, depositing a first layer of the blank, the first layer comprising a first deposited cell, a second deposited cell spaced apart from the first deposited cell, and a third deposited cell spaced apart from the first deposited cell and the second deposited cell, and depositing a second layer of the part on the first layer, the second layer comprising a fourth deposited cell, a fifth deposited cell spaced apart from the fourth deposited cell, and a sixth deposited cell spaced apart from the fourth deposited cell and the fifth deposited cell. Each of the first layer and the second layer are formed using non-continuous deposition to form the blank.

9. 发明申请

US20230131125A1 ADDITIVE MANUFACTURING APPARATUS, ADDITIVE MANUFACTURING METHOD, AND MACHINE LEARNING DEVICE 有权
公开(公告)号：US20230131125A1
公开(公告)日：2023-04-27
申请号：US17914766
申请日：2020-04-23
申请人： Mitsubishi Electric Corporation
发明人： Daiji MORITA , Nobuhiro SHINOHARA , Yoshikazu UKAI
IPC分类号： B23K26/342 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B23K26/354 , B23K26/03 , G05B13/02
摘要： An additive manufacturing apparatus manufactures a shaped object by stacking layers in each of which unit beads that are solidified products of a molten material are laid side by side. The additive manufacturing apparatus includes a material supply unit that supplies a wire as the material to a workpiece, an irradiation unit that emits a laser beam for melting the material supplied, and a controller device that controls the material supply unit and the irradiation unit to form the unit beads. In the formation of unit beads brought into contact with each other to form the layer, the controller device performs control such that a formed unit bead is flattened by irradiation with the beam, and a unit bead is formed in contact with the unit bead that has been flattened.

10. 发明申请

US20230129245A1 METHOD AND SYSTEM FOR LASER WELDING OF A SEMICONDUCTOR MATERIAL 有权
公开(公告)号：US20230129245A1
公开(公告)日：2023-04-27
申请号：US18010550
申请日：2021-06-15
申请人： Friedrich-Schiller-Universität Jena , Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
发明人： Maxime CHAMBONNEAU , Stefan NOLTE , Qingfeng LI
IPC分类号： B23K26/21 , B23K26/046
摘要： The invention relates to a method for welding a first workpiece (11) to a second workpiece (12) by means of a laser. It is an object of the invention to provide a reliable, repeatable and reproducible approach for laser welding of two workpieces one of which consists of a semiconductor material. The method proposed by the invention comprises the following steps: Irradiating the first workpiece (11) with a beam of pulsed laser radiation, wherein the first workpiece (11) consists of a semiconductor material which is transparent at the wavelength of the laser radiation, so that the beam enters the first workpiece (11) through an entrance surface and leaves it through an exit surface, the geometric focus of the beam being positioned in the plane of the exit surface; determining a delocalization of the focus caused by nonlinear interaction of the laser radiation with the semiconductor material; placing the second workpiece (12) against the first workpiece (11); and, again, irradiating the first workpiece (11) with the laser beam of pulsed laser radiation, the focus of the laser radiation being positioned along the beam direction taking into account the determined delocalization so that the intensity maximum is located in the plane of the exit surface forming the interface of the two workpieces (11, 12), whereby the first workpiece (11) is welded to the second workpiece (12). Moreover, the invention relates to a system for welding a first workpiece (11) to a second workpiece (12).

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