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    • 10. 发明申请
    • SUBSTRATE FOR AN ORGANIC LIGHT-EMITTING DEVICE, AND METHOD FOR MANUFACTURING SAME
    • 有机发光装置用基板及其制造方法
    • WO2012091415A3
    • 2012-10-18
    • PCT/KR2011010165
    • 2011-12-27
    • LG CHEMICAL LTDLEE YEON KEUNMOON JAE MINKANG JOON KOOJOO MUN KYUMOON KYOUNG SIKJANG SEONG SU
    • LEE YEON KEUNMOON JAE MINKANG JOON KOOJOO MUN KYUMOON KYOUNG SIKJANG SEONG SU
    • H01L51/52G02B5/02
    • H01L51/0024G02B5/0242G02B5/0278H01L51/0096H01L51/5268H01L51/5275Y02E10/549
    • The present invention relates to a substrate for an organic light-emitting device and to a method for manufacturing same, wherein the substrate comprises: a base; a highly refractive scattering layer formed on the substrate and comprising scattering particles for scattering light onto a highly refractive material; and a bonding layer formed between the base and the highly refractive scattering layer so as to bond the base and the highly refractive scattering layer together. The highly refractive scattering layer has a structure in which the highly refractive material is impregnated with the scattering particles. The average thickness of the highly refractive scattering layer is smaller than the mean diameter of the scattering particles. The surface of the highly refractive scattering layer bonded to the base by means of the bonding layer is embossed with the scattering particles, and the surface of the highly refractive scattering layer, which is opposite the surface of the highly refractive scattering layer that is bonded to the base by means of the bonding layer, is flat. Thus, superior flatness and improved light extraction efficiency may be achieved, processing and material costs may be reduced, and easy mass production may be achieved without sacrificing the performance of the device.
    • 本发明涉及一种有机发光元件用基板及其制造方法,其特征在于,所述基板包括:基体; 高折射散射层,形成在基板上,并且包括用于将光散射到高折射材料上的散射颗粒; 以及形成在基底和高折射率散射层之间的结合层,以将基底和高折射率散射层粘合在一起。 高折射散射层具有其中高折射材料被散射颗粒浸渍的结构。 高折射散射层的平均厚度小于散射粒子的平均直径。 通过接合层与基底结合的高折射率散射层的表面被散射着散射粒子,高折射散射层的表面与高折射散射层的表面相粘合, 通过粘合层的基底是平的。 因此,可以实现优异的平坦度和改善的光提取效率,可以降低加工和材料成本,并且可以在不牺牲器件性能的情况下实现容易的批量生产。