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51. 发明申请

US20090247547A1 HYDROXAMATE-BASED INHIBITORS OF DEACETYLASES B 有权
标题翻译：脱乙酰壳多糖基抑制剂B
公开(公告)号：US20090247547A1
公开(公告)日：2009-10-01
申请号：US12411715
申请日：2009-03-26
申请人： Michael SHULTZ , Christine Hiu-Tung Chen , Young Shin Cho , Lei Jiang , Jianmei Fan , Gang Liu , Dyuti Majumdar
发明人： Michael SHULTZ , Christine Hiu-Tung Chen , Young Shin Cho , Lei Jiang , Jianmei Fan , Gang Liu , Dyuti Majumdar
IPC分类号： A61K31/496 , C07D209/04 , A61K31/404 , C12N5/00 , C07D261/06 , A61K31/42 , C07D231/10 , A61K31/415 , C07D471/02 , A61K31/437 , C07D207/00 , A61K31/40 , C07D401/02 , A61K31/4439 , C07D403/14 , A61K31/497 , A61P35/00 , A61P25/00 , A61P37/06 , A61P29/00 , A61P31/10
CPC分类号： C07D207/08 , C07D401/06 , C07D403/06 , C07D405/06 , C07D413/06 , C07D471/04
摘要： The present teachings relate to compounds of Formula I: and pharmaceutically acceptable salts, hydrates, esters, and prodrugs thereof, wherein R1, R2, R3, Y, Z, and are as defined herein.The present teachings also provide methods of preparing compounds of Formula I and methods of using compounds of Formula I in treating, inhibiting, or preventing pathologic conditions or disorders mediated wholly or in part by deacetylases.
摘要翻译：本发明涉及式I化合物及其药学上可接受的盐，水合物，酯和前药，其中R1，R2，R3，Y，Z和如本文所定义。本教导还提供制备式I化合物的方法和使用式I化合物治疗，抑制或预防全部或部分由脱乙酰酶介导的病理状况或病症的方法。

52. 发明申请

US20060138087A1 Copper containing abrasive particles to modify reactivity and performance of copper CMP slurries 审中-公开
标题翻译：含铜磨料颗粒以改善铜CMP浆料的反应性和性能
公开(公告)号：US20060138087A1
公开(公告)日：2006-06-29
申请号：US11026322
申请日：2004-12-29
申请人： Harsono Simka , Sadasivan Shankar , Lei Jiang , Paul Fischer , Anne Miller , Kenneth Cadien
发明人： Harsono Simka , Sadasivan Shankar , Lei Jiang , Paul Fischer , Anne Miller , Kenneth Cadien
IPC分类号： C09K13/00 , C03C15/00 , H01L21/302 , B44C1/22
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1409 , C09K3/1436 , C09K3/1445
摘要： A slurry for use in a chemical mechanical polishing process for planarizing copper-based metal structures on a substrate comprises an oxidizer, an organic complexing agent, surfactants, and a plurality of copper-based metal abrasive particles, wherein the copper in the copper-based metal is capable of dissolving into the slurry and forming copper ion complexes. During the chemical mechanical polishing process, the copper removal rate may be selectively increased by increasing the concentration of copper metal abrasive particles in the slurry, and the copper removal rate may be selectively decreased by decreasing the concentration of copper metal abrasive particles in the slurry.
摘要翻译：用于在基板上平面化铜基金属结构的化学机械抛光工艺中的浆料包括氧化剂，有机络合剂，表面活性剂和多种铜基金属磨料颗粒，其中铜基金属能够溶解到浆料中并形成铜离子络合物。在化学机械抛光过程中，通过增加浆料中铜金属磨粒的浓度可以选择性地提高铜的去除速率，并且通过降低浆料中的铜金属磨料颗粒的浓度可以选择性地降低铜的去除速率。

53. 发明授权

US06883153B2 Minimization of microelectronic interconnect thickness variations 失效
标题翻译：微电子互连厚度变化的最小化
公开(公告)号：US06883153B2
公开(公告)日：2005-04-19
申请号：US10340534
申请日：2003-01-10
申请人： Lei Jiang , Sadasivan Shankar
发明人： Lei Jiang , Sadasivan Shankar
IPC分类号： G06F17/10 , G06F17/50 , G06F19/00 , H01L21/768
CPC分类号： B24B37/042 , H01L21/7684
摘要： An efficient TCAD tool to analyze the variation of topography and thickness of interconnects and components of integrated circuits introduced by multiple-layer chemical-mechanical planarization (CMP). Contact stress distribution is determined on all scales as a function of topography. A formulation is used relating the pad deformation and therefore stress directly to pattern topography ({d}), and the pad mechanical properties. The 3-dimensional stress and deformation field is described, along with representation of the statistical pad roughness and slurry thickness information. These process conditions are also functions of the surface topography and contact regimes. The stress-topography relationship is represented as [A]{P}={d}, where [A] is the influence coefficient matrix determined by the contact mechanics, and {P} and {d} represent local stress and topography on patterns. With given initial topography and slurry rate kinetics, the surface evolution at each time step of CMP can be traced iteratively to obtain post-CMP topography.
摘要翻译：一种有效的TCAD工具，用于分析由多层化学机械平面化（CMP）引入的集成电路的互连和部件的形貌和厚度的变化。接触应力分布在所有尺度上作为地形的函数确定。使用一种配方来将焊盘变形和因此的应力直接与图案形貌（{d}）和焊盘的机械性能有关。描述了三维应力和变形场，以及统计垫粗糙度和浆料厚度信息的表示。这些工艺条件也是表面形貌和接触方式的功能。应力 - 形貌关系表示为[A] {P} = {d}，其中[A]是由接触力学确定的影响系数矩阵，{P}和{d}表示模式上的局部应力和形貌。随着给定的初始形貌和浆料速率动力学，CMP的每个时间步长的表面演化可以迭代地追溯到获得CMP后的形貌。

54. 发明授权

US5811937A Bulb-type electronic energy-saving lamp 失效
标题翻译：灯泡型电子节能灯
公开(公告)号：US5811937A
公开(公告)日：1998-09-22
申请号：US628546
申请日：1996-04-10
申请人： Lei Jiang
发明人： Lei Jiang
IPC分类号： H01J61/56 , H05B41/00 , H05B41/282 , H01J7/44
CPC分类号： H01J61/56 , H05B41/00 , H05B41/282 , Y02B20/183
摘要： A fluorescent bulb-type electronic energy-saving lamp includes a screwshell and an electronic ballast sealed within the screwshell so that the lamp has the same shape and size as standard incandescent lamps thereby allowing the fluorescent bulb-type electronic energy-saving lamp to directly replace standard incandescent bulbs. The fluorescent bulb-type electronic energy-saving lamp also includes a fluorescent tube, a bulb cover surrounding the fluorescent tube and a connector for mounting the screwshell, the fluorescent tube and the bulb cover thereon.
摘要翻译：荧光灯型电子节能灯包括螺钉壳和密封在螺钉壳内的电子镇流器，使得灯具具有与标准白炽灯相同的形状和尺寸，从而允许荧光灯泡型电子节能灯直接替代标准白炽灯泡。荧光灯型电子节能灯还包括荧光管，围绕荧光管的灯泡盖和用于安装螺钉的连接器，荧光管和灯泡盖。

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