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1. 发明授权

US08813964B2 Wafer container with recessed latch 有权
标题翻译：带凹槽的晶片容器
公开(公告)号：US08813964B2
公开(公告)日：2014-08-26
申请号：US12606921
申请日：2009-10-27
申请人： James D Pylant , Alan L Waber
发明人： James D Pylant , Alan L Waber
IPC分类号： B65D85/00
CPC分类号： H01L21/67353 , H01L21/67373 , H01L21/67379 , H01L21/67386
摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.
摘要翻译：半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。对晶片的侧面保护是具有多个交错的内壁和外壁。改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。闩锁机构位于保护闩锁孔中，以最小化闩锁的意外打开。用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。

2. 发明申请

US20120205282A1 SINGLE AND DUAL STAGE WAFER CUSHION AND WAFER SEPARATOR 审中-公开
标题翻译：单级和双级水平垫片和水平分离器
公开(公告)号：US20120205282A1
公开(公告)日：2012-08-16
申请号：US13172565
申请日：2011-06-29
申请人： JAMES D. PYLANT , CHRISTOPHER R. MACK , ALAN L. WABER , DAVID A. MILLER
发明人： JAMES D. PYLANT , CHRISTOPHER R. MACK , ALAN L. WABER , DAVID A. MILLER
IPC分类号： B65D81/02
CPC分类号： H01L21/67369 , H01L21/67346 , H01L21/67366 , H01L21/67379 , H01L21/67389
摘要： Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.
摘要翻译：公开了一种单级和双级晶片衬垫的改进，其中晶片衬垫可以使用作为单级第一级衬垫的边缘铰链和用于双级晶片衬垫的第二中间跨接铰链。这种双级设计提供了两种明显不同的缓冲力，而不是使用单级设计，其中力与施加到晶片垫的外表面的压缩量成线性关系。环的外边缘提供最大的膨胀，使得只有环的外边缘与晶片的外边缘接触。晶片垫是在冲击传递到晶片堆栈之前弯曲和吸收冲击的材料。该材料使碎片或污染物最小化，从而嵌入到晶片衬垫中，并且还防止材料从晶片衬垫的剪切。

3. 发明申请

US20120132561A1 WAFER CONTAINER 有权
公开(公告)号：US20120132561A1
公开(公告)日：2012-05-31
申请号：US13367365
申请日：2012-02-06
申请人： James D. PYLANT , Alan L. WABER
发明人： James D. PYLANT , Alan L. WABER
IPC分类号： H01L21/67 , B65D85/30 , B28B7/20
CPC分类号： H01L21/67386 , H01L21/67353 , H01L21/67366 , H01L21/67369 , H01L21/67373 , H01L21/67379
摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

4. 发明申请

US20110049006A1 WAFER CONTAINER WITH RECESSED LATCH 有权
标题翻译：带收缩锁的散热容器
公开(公告)号：US20110049006A1
公开(公告)日：2011-03-03
申请号：US12606921
申请日：2009-10-27
申请人： JAMES D. PYLANT , ALAN L. WABER
发明人： JAMES D. PYLANT , ALAN L. WABER
IPC分类号： H01L21/673 , B65D85/90
CPC分类号： H01L21/67353 , H01L21/67373 , H01L21/67379 , H01L21/67386
摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.
摘要翻译：半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。对晶片的侧面保护是具有多个交错的内壁和外壁。改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。闩锁机构位于保护闩锁孔中，以最小化闩锁的意外打开。用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。

5. 发明授权

US09653331B2 Single and dual stage wafer cushion 有权
公开(公告)号：US09653331B2
公开(公告)日：2017-05-16
申请号：US13028945
申请日：2011-02-16
申请人： James D Pylant , Christopher R Mack , Alan L Waber , David A Miller
发明人： James D Pylant , Christopher R Mack , Alan L Waber , David A Miller
IPC分类号： B65D85/00 , H01L21/673
CPC分类号： H01L21/67369
摘要： Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.

6. 发明申请

US20160218027A1 SINGLE AND DUAL STAGE WAFER CUSHION AND WAFER SEPARATOR 审中-公开
标题翻译：单级和双级水平垫片和水平分离器
公开(公告)号：US20160218027A1
公开(公告)日：2016-07-28
申请号：US14983101
申请日：2015-12-29
申请人： James D. Pylant , Christopher R. Mack , Alan L. Waber , David A. Miller
发明人： James D. Pylant , Christopher R. Mack , Alan L. Waber , David A. Miller
IPC分类号： H01L21/673
CPC分类号： H01L21/67369 , H01L21/67346 , H01L21/67366 , H01L21/67379 , H01L21/67389
摘要： Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.
摘要翻译：公开了一种单级和双级晶片衬垫的改进，其中晶片衬垫可以使用作为单级第一级衬垫的边缘铰链和用于双级晶片衬垫的第二中间跨接铰链。这种双级设计提供了两种明显不同的缓冲力，而不是使用单级设计，其中力与施加到晶片垫的外表面的压缩量成线性关系。环的外边缘提供最大的膨胀，使得只有环的外边缘与晶片的外边缘接触。晶片垫是在冲击传递到晶片堆栈之前弯曲和吸收冲击的材料。该材料使碎片或污染物最小化，从而嵌入到晶片衬垫中，并且还防止材料从晶片衬垫的剪切。

7. 发明授权

US08528737B2 Wafer container 有权
标题翻译：晶圆容器
公开(公告)号：US08528737B2
公开(公告)日：2013-09-10
申请号：US13367365
申请日：2012-02-06
申请人： James D. Pylant , Alan L. Waber
发明人： James D. Pylant , Alan L. Waber
IPC分类号： B65D85/30
CPC分类号： H01L21/67386 , H01L21/67353 , H01L21/67366 , H01L21/67369 , H01L21/67373 , H01L21/67379
摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.
摘要翻译：半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。对晶片的侧面保护是具有多个交错的内壁和外壁。改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。模制集成减少了组装多个零件并连接多个零件时出现的公差错误。

8. 发明申请

US20110180451A1 SINGLE AND DUAL STAGE WAFER CUSHION 有权
标题翻译：单和双级水晶垫
公开(公告)号：US20110180451A1
公开(公告)日：2011-07-28
申请号：US13028945
申请日：2011-02-16
申请人： JAMES D. PYLANT , CHRISTOPHER R. MACK , ALAN L. WABER , DAVID A. MILLER
发明人： JAMES D. PYLANT , CHRISTOPHER R. MACK , ALAN L. WABER , DAVID A. MILLER
IPC分类号： B65D81/02 , B65D85/30
CPC分类号： H01L21/67369
摘要： Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.
摘要翻译：公开了一种单级和双级晶片衬垫的改进，其中晶片衬垫可以使用作为单级第一级衬垫的边缘铰链和用于双级晶片衬垫的第二中间跨接铰链。这种双级设计提供了两种明显不同的缓冲力，而不是使用单级设计，其中力与施加到晶片垫的外表面的压缩量成线性关系。环的外边缘提供最大的膨胀，使得只有环的外边缘与晶片的外边缘接触。晶片垫是在冲击传递到晶片堆栈之前弯曲和吸收冲击的材料。该材料使碎片或污染物最小化，从而嵌入到晶片衬垫中，并且还防止材料从晶片衬垫的剪切。

9. 发明申请

US20100236977A1 WAFER CONTAINER WITH ADJUSTABLE INSIDE DIAMETER 有权
标题翻译：具有可调节内径直径的散热容器
公开(公告)号：US20100236977A1
公开(公告)日：2010-09-23
申请号：US12749448
申请日：2010-03-29
申请人： JAMES D. PYLANT , ALAN L. WABER , CHRISTOPHER R. MACK
发明人： JAMES D. PYLANT , ALAN L. WABER , CHRISTOPHER R. MACK
IPC分类号： B65D85/86
CPC分类号： H01L21/67386 , H01L21/67369 , H01L21/67373
摘要： Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.
摘要翻译：半导体晶片容器的改进，用于减少晶片载体内的半导体晶片的移动，使用基部构件的主内部容纳直径中的柔性壁段，面板或柔性插入件。这些壁允许垂直的容纳表面移动并捕获整个晶片堆而不是几个晶片。接触晶片的表面向内均匀移动。通过减少或消除晶片容器和晶片叠层之间的间隙来固定晶片堆叠。进一步的改进包括在顶部和/或底部盖中添加倾斜的接合表面，其提供了用于更容易地组装顶部和底部盖的机械优点。该设计还允许自动装载和卸载晶片叠层，因为一旦顶盖被移除，柔性壁向外弹回。从而提供一个小的间隙，以便自由地移除晶片。

10. 发明申请

US20100236976A1 WAFER CONTAINER WITH OVERLAPPING WALL STRUCTURE 有权
标题翻译：带有过渡壁结构的过滤器
公开(公告)号：US20100236976A1
公开(公告)日：2010-09-23
申请号：US12548368
申请日：2009-08-26
申请人： JAMES D. PYLANT , ALAN L. WABER
发明人： JAMES D. PYLANT , ALAN L. WABER
IPC分类号： B65D85/30
CPC分类号： H01L21/67386 , H01L21/67353 , H01L21/67366 , H01L21/67369 , H01L21/67373 , H01L21/67379
摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.
摘要翻译：半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。对晶片的侧面保护是具有多个交错的内壁和外壁。改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。模制集成减少了组装多个零件并连接多个零件时出现的公差错误。

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