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    • 1. 发明授权
    • Tunable acoustic resonator for clinical ultrasonic transducers
    • 用于临床超声波换能器的可调谐声谐振器
    • US5438554A
    • 1995-08-01
    • US203216
    • 1994-02-28
    • Mir S. Seyed-BolorforoshMichael GreensteinTuruvekere R. GururajaHenry Yoshida
    • Mir S. Seyed-BolorforoshMichael GreensteinTuruvekere R. GururajaHenry Yoshida
    • A61B8/14B06B1/06G01N29/24G10K11/02H04R17/00
    • G10K11/02B06B1/0622
    • A tunable ultrasonic probe includes a body of a first piezoelectric material acoustically coupled in series with a body of a second piezoelectric material. The second piezoelectric material has a Curie temperature that is substantially different than that of the first piezoelectric material. Preferably, the first piezoelectric material is a conventional piezoelectric ceramic, such as lead zirconate titanate, while the second piezoelectric material is a relaxor ferroelectric ceramic, such as lead magnesium niobate. At an operating temperature of the probe, the first piezoelectric material has a fixed polarization. In contrast, the second piezoelectric material has a polarization that is variable relative to the fixed polarization of the first piezoelectric material. A preferred novel arrangement of electrodes electrically couples the bodies in parallel with one another. An oscillating voltage for exciting the acoustic signals in the probe is coupled with the electrodes. The polarization of the second piezoelectric material is variably controlled by a bias voltage coupled with the electrodes. In a preferred embodiment, the bias voltage has a reversible electrical polarity for selecting one resonant frequency from a plurality of resonant frequencies of the probe. In another preferred embodiment, the bias voltage source has a variable voltage level for selecting at least one of a plurality of resonant frequencies of the probe.
    • 可调谐超声波探头包括与第二压电材料的主体串联耦合的第一压电材料的主体。 第二压电材料具有与第一压电材料基本不同的居里温度。 优选地,第一压电材料是诸如锆钛酸铅的常规压电陶瓷,而第二压电材料是诸如铌酸铅镁之类的弛豫铁电陶瓷。 在探针的工作温度下,第一压电材料具有固定的极化。 相反,第二压电材料具有相对于第一压电材料的固定极化可变的极化。 电极的优选新颖布置使得主体彼此平行地电耦合。 用于激发探针中的声信号的振荡电压与电极耦合。 第二压电材料的极化可通过与电极耦合的偏置电压来可变地控制。 在优选实施例中,偏置电压具有可逆的电极性,用于从探头的多个谐振频率中选择一个谐振频率。 在另一个优选实施例中,偏置电压源具有用于选择探头的多个谐振频率中的至少一个的可变电压电平。
    • 2. 发明授权
    • Method for fabricating a Z-axis conductive backing layer for acoustic
transducers using etched leadframes
    • 用于使用蚀刻引线框架制造用于声学换能器的Z轴导电背衬层的方法
    • US5592730A
    • 1997-01-14
    • US283136
    • 1994-07-29
    • Michael GreensteinHenry Yoshida
    • Michael GreensteinHenry Yoshida
    • G01N29/24A61B8/00B06B1/02B06B1/06H04R17/00H04R31/00H01L41/22
    • B06B1/0622Y10T29/42Y10T29/49005Y10T29/49121
    • A Z-axis backing layer for an acoustic transducer is provided, which comprises a matrix of electrical conductors disposed in parallel and potted within an electrically insulating acoustic backing material. The acoustic transducers are disposed on a first end of the backing layer, with each individual transducer element connecting electrically to a respective one of the conductors. At the other end of the backing layer, the conductors connect electrically to a corresponding circuit element. The backing layer is fabricated from a plurality of leadframes each having an outer frame member and a plurality of conductors extending in parallel across the leadframes terminating at the frame members at opposite ends thereof. The plurality of leadframes are stacked such that respective conductors of adjacent ones of the leadframes are disposed in parallel with a space provided between the respective conductors equivalent to a width of one of the leadframes. Acoustic backing material is poured onto the stacked plurality of leadframes to completely fill the spaces between conductors. The frame members and excess acoustic backing material are then removed from the stacked and poured plurality of leadframes.
    • 提供了一种用于声学换能器的Z轴背衬层,其包括平行放置并封装在电绝缘声学背衬材料内的电导体矩阵。 声学传感器设置在背衬层的第一端上,每个单独的换能器元件电连接到相应的导体之一。 在背衬层的另一端,电导体与相应的电路元件电连接。 背衬层由多个引线框架制成,每个引线框架具有外框架构件和多个导体,跨过引线框架并联延伸,终端于框架构件的相对端。 多个引线框架被堆叠,使得相邻的引线框架的各个导体与设置在相当于引线框之一的宽度的各个导体之间的空间平行设置。 声学衬垫材料被倒在堆叠的多个引线框架上以完全填充导体之间的空间。 然后将框架构件和多余的声学衬垫材料从堆叠和倒入的多个引线框架中移除。