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1. 发明申请

WO2009008982A2 SINGLE PHASE PROXIMITY HEAD HAVING A CONTROLLED MENISCUS FOR TREATING A SUBSTRATE 审中-公开
标题翻译：具有用于处理基板的控制菜单的单相位近端头
公开(公告)号：WO2009008982A2
公开(公告)日：2009-01-15
申请号：PCT/US2008/008199
申请日：2008-06-30
申请人： LAM RESEARCH CORPORATION , RAVKIN, Michael , KABANSKY, Alex , DELARIOS, John, M.
发明人： RAVKIN, Michael , KABANSKY, Alex , DELARIOS, John, M.
IPC分类号： F26B21/00 , F26B21/06
CPC分类号： B08B3/04 , H01L21/67028 , H01L21/67051 , Y10S134/902
摘要： A system for processing a substrate is described. The system includes a proximity head, a mechanism, and a liquid supply. The proximity head is configured to generate a controlled meniscus. Specifically, the proximity head has a plurality of dispensing nozzles formed on a face of the proximity head. The dispensing nozzles are configured to supply a liquid to the meniscus and the suction holes are added to remove a used liquid from the meniscus. The mechanism moves the proximity head or the substrate with respect to each other while maintaining contact between the meniscus and a surface of the substrate. The movement causes a thin layer of the liquid to remain on the surface after being contacted by the meniscus. The liquid supply is in fluid communication with the dispensing nozzles, and is configured to balance an amount of the liquid delivered to the meniscus with an amount of liquid removed from the meniscus, the amount of liquid removed from the meniscus including at least the thin layer of the liquid remaining on the surface of the substrate.
摘要翻译：描述用于处理衬底的系统。该系统包括接近头，机构和液体供应。邻近头部被配置为产生受控弯液面。具体而言，邻近头部具有形成在邻近头部的表面上的多个分配喷嘴。分配喷嘴被配置为向弯月面供应液体，并且添加吸入孔以从弯月面去除使用过的液体。该机构相对于彼此移动邻近头部或衬底，同时保持弯月面和衬底的表面之间的接触。该运动导致薄层的液体在与弯液面接触之后保留在表面上。液体供应与分配喷嘴流体连通，并且被配置为平衡输送到弯液面的液体量与从弯月面移除的液体量，从弯液面移除的液体量至少包括薄层残留在基材表面上的液体。

2. 发明申请

WO2009008982A3 SINGLE PHASE PROXIMITY HEAD HAVING A CONTROLLED MENISCUS FOR TREATING A SUBSTRATE 审中-公开
标题翻译：具有受控弯头的单相接近头用于处理基板
公开(公告)号：WO2009008982A3
公开(公告)日：2009-04-09
申请号：PCT/US2008008199
申请日：2008-06-30
申请人： LAM RES CORP , RAVKIN MICHAEL , KABANSKY ALEX , DELARIOS JOHN M
发明人： RAVKIN MICHAEL , KABANSKY ALEX , DELARIOS JOHN M
IPC分类号： F26B21/00 , F26B21/06
CPC分类号： B08B3/04 , H01L21/67028 , H01L21/67051 , Y10S134/902
摘要： A system for processing a substrate is described. The system includes a proximity head, a mechanism, and a liquid supply. The proximity head is configured to generate a controlled meniscus. Specifically, the proximity head has a plurality of dispensing nozzles formed on a face of the proximity head. The dispensing nozzles are configured to supply a liquid to the meniscus and the suction holes are added to remove a used liquid from the meniscus. The mechanism moves the proximity head or the substrate with respect to each other while maintaining contact between the meniscus and a surface of the substrate. The movement causes a thin layer of the liquid to remain on the surface after being contacted by the meniscus. The liquid supply is in fluid communication with the dispensing nozzles, and is configured to balance an amount of the liquid delivered to the meniscus with an amount of liquid removed from the meniscus, the amount of liquid removed from the meniscus including at least the thin layer of the liquid remaining on the surface of the substrate.
摘要翻译：描述了用于处理基板的系统。该系统包括一个临近头，一个机构和一个液体供应。接近头被配置为生成受控弯月面。具体而言，接近头具有形成在接近头的表面上的多个分配喷嘴。分配喷嘴构造成向弯月面供应液体，并且添加抽吸孔以从弯月面移除使用过的液体。该机构使接近头或基底相对于彼此移动，同时保持弯月面与基底表面之间的接触。该运动使液体薄层在与弯月面接触后保留在表面上。液体供应装置与分配喷嘴流体连通，并且被配置为平衡输送到弯月面的液体的量与从弯月面移除的一定量的液体，从弯月面移除的液体的量包括至少薄层剩余在基材表面上的液体。

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