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1. 发明申请

WO2009008982A2 SINGLE PHASE PROXIMITY HEAD HAVING A CONTROLLED MENISCUS FOR TREATING A SUBSTRATE 审中-公开
标题翻译：具有用于处理基板的控制菜单的单相位近端头
公开(公告)号：WO2009008982A2
公开(公告)日：2009-01-15
申请号：PCT/US2008/008199
申请日：2008-06-30
申请人： LAM RESEARCH CORPORATION , RAVKIN, Michael , KABANSKY, Alex , DELARIOS, John, M.
发明人： RAVKIN, Michael , KABANSKY, Alex , DELARIOS, John, M.
IPC分类号： F26B21/00 , F26B21/06
CPC分类号： B08B3/04 , H01L21/67028 , H01L21/67051 , Y10S134/902
摘要： A system for processing a substrate is described. The system includes a proximity head, a mechanism, and a liquid supply. The proximity head is configured to generate a controlled meniscus. Specifically, the proximity head has a plurality of dispensing nozzles formed on a face of the proximity head. The dispensing nozzles are configured to supply a liquid to the meniscus and the suction holes are added to remove a used liquid from the meniscus. The mechanism moves the proximity head or the substrate with respect to each other while maintaining contact between the meniscus and a surface of the substrate. The movement causes a thin layer of the liquid to remain on the surface after being contacted by the meniscus. The liquid supply is in fluid communication with the dispensing nozzles, and is configured to balance an amount of the liquid delivered to the meniscus with an amount of liquid removed from the meniscus, the amount of liquid removed from the meniscus including at least the thin layer of the liquid remaining on the surface of the substrate.
摘要翻译：描述用于处理衬底的系统。该系统包括接近头，机构和液体供应。邻近头部被配置为产生受控弯液面。具体而言，邻近头部具有形成在邻近头部的表面上的多个分配喷嘴。分配喷嘴被配置为向弯月面供应液体，并且添加吸入孔以从弯月面去除使用过的液体。该机构相对于彼此移动邻近头部或衬底，同时保持弯月面和衬底的表面之间的接触。该运动导致薄层的液体在与弯液面接触之后保留在表面上。液体供应与分配喷嘴流体连通，并且被配置为平衡输送到弯液面的液体量与从弯月面移除的液体量，从弯液面移除的液体量至少包括薄层残留在基材表面上的液体。

2. 发明申请

WO2007078956A2 METHOD AND APPARATUS FOR PARTICLE REMOVAL 审中-公开
标题翻译：方法和装置去除颗粒
公开(公告)号：WO2007078956A2
公开(公告)日：2007-07-12
申请号：PCT/US2006/048552
申请日：2006-12-18
申请人： LAM RESEARCH CORPORATION , FREER, Erik, M. , DELARIOS, John, M. , MIKHAYLICHENKO, Katrina , RAVKIN, Michael , KOROLIK, Mikhail , REDEKER, Fritz, C.
发明人： FREER, Erik, M. , DELARIOS, John, M. , MIKHAYLICHENKO, Katrina , RAVKIN, Michael , KOROLIK, Mikhail , REDEKER, Fritz, C.
IPC分类号： B08B3/00 , B08B3/12
CPC分类号： B08B3/024 , B08B3/003 , B08B3/08 , B08B6/00 , H01L21/67051
摘要： A method and system for cleaning a surface, having particulate matter thereon, of a substrate features impinging upon the surface a jet of a liquid having coupling elements entrained therein. A sufficient drag force is imparted upon the coupling elements to have the same move with respect to the liquid and cause the particulate matter to move with respect to the substrate.
摘要翻译：一种用于清洁其上具有颗粒物质的表面的表面的方法和系统，其特征在于其表面上具有夹带在其中的具有耦合元件的液体的射流。赋予耦合元件足够的阻力以相对于液体具有相同的移动并使颗粒物质相对于基底移动。

3. 发明申请

WO2008136895A1 SUBSTRATE CLEANING TECHNIQUES EMPLOYING MULTI-PHASE SOLUTION 审中-公开
标题翻译：使用多相解决方案的基板清洗技术
公开(公告)号：WO2008136895A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/004488
申请日：2008-04-04
申请人： LAM RESEARCH CORPORATION , FREER, Erik, M. , DELARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail , REDEKER, Fritz, C.
发明人： FREER, Erik, M. , DELARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail , REDEKER, Fritz, C.
IPC分类号： H01L21/465
CPC分类号： H01L21/02057 , H01L21/02052 , H01L21/67034 , H01L21/67057 , H01L21/67751
摘要： A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.
摘要翻译：一种用于清洁其上具有颗粒物质的半导体晶片的相对表面的方法和系统。该方法包括产生流体和衬底之间的相对运动。相对运动在与相对表面之一的法线横向的方向上，并且产生两个间隔开的流动。每个流体与相对于与多个流动的剩余流动相邻的相对表面不同的一个相对表面相邻。流体具有夹带在其中的耦合元件，并且建立相对运动以在联接元件的子集上施加足够的阻力以产生该流体内该子集的耦合元件的运动。以这种方式，将一定量的阻力赋予颗粒物质以使颗粒物质相对于基底移动。

4. 发明申请

WO2008121190A1 PROXIMITY HEAD WITH ANGLED VACUUM CONDUIT SYSTEM, APPARATUS AND METHOD 审中-公开
标题翻译：具有真空真空管道系统的附件头，装置和方法
公开(公告)号：WO2008121190A1
公开(公告)日：2008-10-09
申请号：PCT/US2008/002414
申请日：2008-02-22
申请人： LAM RESEARCH CORPORATION , RAVKIN, Michael , DE LARIOS, John , REDEKER, Fred, C. , KOROLIK, Mikhail , FREER, Erik, M.
发明人： RAVKIN, Michael , DE LARIOS, John , REDEKER, Fred, C. , KOROLIK, Mikhail , FREER, Erik, M.
IPC分类号： H01L21/00
CPC分类号： H01L21/67051
摘要： A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region. The first angle being between 30 and 60 degrees. A system and method for processing a substrate with a proximity head is also described.
摘要翻译：包括头表面的接近头。头表面包括第一平坦区域和多个第一管道。多个第一导管中的每一个由多个第一离散孔中的对应的一个限定。多个第一离散孔位于头表面并延伸穿过第一平坦区域。头表面还包括第二平坦区域和多个第二管道。多个第二导管由位于头表面中并延伸穿过第二平坦区域的相应多个第二离散孔限定。头表面还包括设置在第一平坦区域和第二平坦区域之间并与其相邻的第三平坦区域和多个第三导管。多个第三导管由位于头表面中并延伸穿过第三平坦区域的对应的多个第三离散孔限定。第三导管相对于第三平坦区域以第一角度形成。第一个角度在30到60度之间。还描述了用于处理具有邻近头的衬底的系统和方法。

5. 发明申请

WO2005076347A1 STRESS FREE ETCH PROCESSING IN COMBINATION WITH A DYNAMIC LIQUID MENISCUS 审中-公开
标题翻译：与动态液体肉汤组合的无应力加工
公开(公告)号：WO2005076347A1
公开(公告)日：2005-08-18
申请号：PCT/US2004/043909
申请日：2004-12-30
申请人： LAM RESEARCH CORPORATION , BAILEY, Andrew, D. , RAVKIN, Michael , KOROLIK, Mikhail , YADAV, Puneet
发明人： BAILEY, Andrew, D. , RAVKIN, Michael , KOROLIK, Mikhail , YADAV, Puneet
IPC分类号： H01L21/768
CPC分类号： H01L21/7684 , H01J37/32522 , H01J2237/022 , H01L21/32115 , H01L21/32136 , H01L21/67034 , H01L21/67051 , H01L21/6708 , H01L21/67253
摘要： A system and method for planarizing and controlling non-uniformity on a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple features in the pattern. The conductive interconnect material having an overburden portion. A bulk of the overburden portion is removed and a remaining portion of the overburden portion has a non-uniformity. The non-uniformity is mapped, optimal solution determined and a dynamic liquid meniscus etch process recipe is developed to correct the non-uniformity. A dynamic liquid meniscus etch process, using the dynamic liquid meniscus etch process recipe, is applied to correct the non-uniformity to substantially planarize the remaining portion of the overburden portion.
摘要翻译：用于平坦化和控制图案化半导体衬底上的不均匀性的系统和方法包括接收图案化的半导体衬底。图案化的半导体衬底具有填充图案中的多个特征的导电互连材料。导电互连材料具有覆盖层部分。去除大部分上覆层部分，并且覆盖层部分的剩余部分具有不均匀性。绘制不均匀性，确定最佳溶液，并开发动态液体弯月面蚀刻工艺配方以校正不均匀性。使用动态液体弯月面蚀刻工艺配方的动态液体弯月面蚀刻工艺来校正不均匀性，以使覆盖层部分的剩余部分基本平坦化。

6. 发明申请

WO2005003864A2 APPARATUS AND METHOD FOR PROVIDING A CONFINED LIQUID FOR IMMERSION LITHOGRAPHY 审中-公开
标题翻译：用于提供固定液体的设备和方法进行渗透测绘
公开(公告)号：WO2005003864A2
公开(公告)日：2005-01-13
申请号：PCT/US2004/020332
申请日：2004-06-23
申请人： LAM RESEARCH CORPORATION , HEMKER, David , REDEKER, Fred, C. , BOYD, John , DE LARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail
发明人： HEMKER, David , REDEKER, Fred, C. , BOYD, John , DE LARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail
IPC分类号： G03F7/20
CPC分类号： G03F7/70341 , Y10S134/902
摘要： A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.
摘要翻译：提供了一种用于处理衬底的方法，其包括在衬底的表面上产生弯月面并且通过弯月面施加光刻光以使得能够对衬底的表面进行光刻处理。

7. 发明申请

WO2007123677A2 APPARATUS AND METHOD FOR CONFINED AREA PLANARIZATION 审中-公开
标题翻译：装置和方法用于确定区域平面化
公开(公告)号：WO2007123677A2
公开(公告)日：2007-11-01
申请号：PCT/US2007/007903
申请日：2007-03-27
申请人： LAM RESEARCH CORPORATION , BOYD, John, M. , REDEKER, Fritz, C. , DORDI, Yezdi , RAVKIN, Michael , DE LARIOS, John
发明人： BOYD, John, M. , REDEKER, Fritz, C. , DORDI, Yezdi , RAVKIN, Michael , DE LARIOS, John
IPC分类号： H01L21/461 , H01L21/306
CPC分类号： H01L21/32115 , C25F7/00
摘要： A proximity head and associated method of use is provided for performing confined area planarization of a semiconductor wafer. The proximity head includes a chamber defined to maintain an electrolyte solution. A cathode is disposed within the chamber in exposure to the electrolyte solution. A cation exchange membrane is disposed over a lower opening of the chamber. A top surface of the cation exchange membrane is in direct exposure to the electrolyte solution to be maintained within the chamber. A fluid supply channel is defined to expel fluid at a location adjacent to a lower surface of the cation exchange membrane. A vacuum channel is defined to provide suction at a location adjacent to the lower surface of the cation exchange membrane, such that the fluid to be expelled from the fluid supply channel is made to flow over the lower surface of the cation exchange membrane.
摘要翻译：提供接近头和相关联的使用方法用于执行半导体晶片的限制区域平坦化。邻近头包括限定为维持电解质溶液的室。在室内暴露于电解质溶液中设置阴极。阳离子交换膜设置在室的下开口的上方。阳离子交换膜的顶表面直接暴露于电解质溶液中以保持在室内。定义流体供应通道以在邻近阳离子交换膜的下表面的位置排出流体。定义真空通道以在邻近阳离子交换膜的下表面的位置处提供吸力，使得要从流体供应通道排出的流体流过阳离子交换膜的下表面。

8. 发明申请

WO2007078955A2 SUBSTRATE PREPARATION USING STABILIZED FLUID SOLUTIONS AND METHODS FOR MAKING STABLE FLUID SOLUTIONS 审中-公开
标题翻译：使用稳定流体解决方案的基板制备和制备稳定流体溶液的方法
公开(公告)号：WO2007078955A2
公开(公告)日：2007-07-12
申请号：PCT/US2006/048548
申请日：2006-12-18
申请人： LAM RESEARCH CORPORATION , FREER, Erik, M. , DE LARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail , MIKHAYLICHENKO, Katrina , REDEKER, Fred, C.
发明人： FREER, Erik, M. , DE LARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail , MIKHAYLICHENKO, Katrina , REDEKER, Fred, C.
IPC分类号： C23G1/00 , B08B7/00 , B08B7/04 , B08B3/00 , B08B3/12
CPC分类号： H01L21/6715 , B05D3/10 , C11D3/14 , C11D11/0047 , C11D17/0004 , C11D17/0013 , C23G1/00 , G03F7/42 , H01L21/02052 , H01L21/02057 , H01L21/02096 , H01L21/67051
摘要： A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.
摘要翻译：提供了制备用于制备基底表面的溶液的方法。该方法包括提供将聚合物材料添加到连续介质的连续介质。将脂肪酸加入到具有聚合物材料的连续介质中，并且聚合物材料限定了在溶液中施加力的物理网络，其克服了脂肪酸所经受的浮力，从而防止脂肪酸在溶液中移动直到通过施加的搅拌超过聚合物材料的屈服应力。施加的搅拌是将溶液从容器运输到将溶液施加到基材表面的制备工位上。

9. 发明申请

WO2007005230A2 METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME 审中-公开
标题翻译：从半导体波导中去除材料的方法及其实施方法
公开(公告)号：WO2007005230A2
公开(公告)日：2007-01-11
申请号：PCT/US2006/023354
申请日：2006-06-15
申请人： LAM RESEARCH CORPORATION , KOROLIK, Mikhail , RAVKIN, Michael , DELARIOS, John , REDEKER, Fritz, C. , BOYD, John, M.
发明人： KOROLIK, Mikhail , RAVKIN, Michael , DELARIOS, John , REDEKER, Fritz, C. , BOYD, John, M.
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , G03F7/422 , H01L21/02063 , H01L21/02071 , H01L21/6704 , Y10S134/902
摘要： A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non- Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes theresulting non-Newtonian fluid to remove the material from the semiconductor wafer.
摘要翻译：压力保持在其中半导体晶片所处于的体积内的压力足以将前体流体的液体状态保持为非牛顿流体。前体流体靠近要从半导体晶片去除的材料设置，同时保持前体流体处于液态。在半导体晶片所在的体积中的压力降低，使得设置在体积内的晶片上的前体流体转变成非牛顿流体。在转化成非牛顿流体期间，前体流体的膨胀和前体流体相对于晶片的移动导致了非牛顿流体从半导体晶片去除材料。

10. 发明申请

WO2008123945A1 METHOD FOR CLEANING SEMICONDUCTOR WAFER SURFACES BY APPLYING PERIODIC SHEAR STRESS TO THE CLEANING SOLUTION 审中-公开
标题翻译：通过将周期性剪切应力应用于清洁溶液来清洁半导体波长表面的方法
公开(公告)号：WO2008123945A1
公开(公告)日：2008-10-16
申请号：PCT/US2008/004033
申请日：2008-03-27
申请人： LAM RESEARCH CORPORATION , FREER, Erik, M. , DE LARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail , REDEKER, Fritz, C.
发明人： FREER, Erik, M. , DE LARIOS, John, M. , RAVKIN, Michael , KOROLIK, Mikhail , REDEKER, Fritz, C.
IPC分类号： H01L21/304
CPC分类号： B08B3/12 , H01L21/67051 , H01L21/67057
摘要： Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is applied over a wafer surface. External energy is applied to the cleaning media to generate periodic shear stresses within the media. The periodic shear stresses impart momentum and/or drag forces on the coupling elements causing the coupling elements to interact with the particulate contaminants to remove the particulate contaminants from the wafer surfaces.
摘要翻译：提供了清洁附着在晶片表面上的颗粒污染物的系统和方法。包括悬浮在清洁介质内的分散的耦合元件的清洁介质被施加在晶片表面上。外部能量被施加到清洁介质以在介质内产生周期性剪切应力。周期性剪切应力赋予耦合元件上的动量和/或阻力，导致耦合元件与颗粒污染物相互作用以从晶片表面去除颗粒污染物。

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