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    • 1. 发明授权
    • Inductive inertial sensor architecture and fabrication in packaging build-up layers
    • 感应惯性传感器结构和制造在包装堆积层
    • US09429427B2
    • 2016-08-30
    • US13720876
    • 2012-12-19
    • Qing MaFeras EidKevin LinJohanna M. SwanWeng Hong TehValluri R. Rao
    • Qing MaFeras EidKevin LinJohanna M. SwanWeng Hong TehValluri R. Rao
    • G01C19/00G01C19/56G01C19/5776
    • G01C19/56G01C19/5776
    • This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
    • 本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。 在实施例中,平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。 感应线圈记录在第二维度上作为角速度的函数变化的电感。 在实施例中,振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。 在实施例中,与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。 在实施例中,使用封装积层来制造感应惯性传感器,使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。
    • 4. 发明申请
    • INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING BUILD-UP LAYERS
    • 感应式传感器结构与制造包装建筑层
    • US20140165723A1
    • 2014-06-19
    • US13720876
    • 2012-12-19
    • Qing MAFeras EIDKevin LINJohanna M. SWANWeng Hong TEHValluri R. RAO
    • Qing MAFeras EIDKevin LINJohanna M. SWANWeng Hong TEHValluri R. RAO
    • G01C19/5635
    • G01C19/56G01C19/5776
    • This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
    • 本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。 在实施例中,平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。 感应线圈记录在第二维度上作为角速度的函数变化的电感。 在实施例中,振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。 在实施例中,与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。 在实施例中,使用封装积层来制造感应惯性传感器,使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。
    • 8. 发明授权
    • Probe structure
    • 探头结构
    • US07988352B2
    • 2011-08-02
    • US12318977
    • 2009-01-14
    • Kevin LinVincent WengJoy Liao
    • Kevin LinVincent WengJoy Liao
    • G01J5/00G01K5/00
    • G01J5/04G01J5/049G01J5/06G01J5/08G01J5/0815
    • The present invention discloses an improved probe structure, which is installed in the body of an infrared clinical thermometer and comprises a plastic hollow casing having an opening; a curved block annularly arranged inside the opening; a hollow sleeve arranged inside the casing and along the perimeter of the opening; a temperature sensor arranged inside sleeve and below the curved block; a support element arranged inside the sleeve and supporting the temperature sensor; and a thermal insulation ring encircling the temperature sensor and pressing against the inner wall of the sleeve. The thermal insulation ring has an outer diameter larger than a width of the temperature sensor, and an air gap is thus formed between the temperature sensor and the inner wall of the sleeve; the top of the thermal insulation ring has an altitude higher than the top of the temperature sensor, and another air gap is thus formed between the temperature sensor and the curved block. Thereby is effectively retarded heat conduction from the external to the temperature sensor.
    • 本发明公开了一种改进的探针结构,其安装在红外线体温计的本体中,并包括具有开口的塑料中空壳体; 环形地布置在开口内的弯曲块; 中空套筒,其布置在所述壳体内并沿着所述开口的周边; 温度传感器布置在套筒内并在弯曲块下方; 支撑元件,布置在套筒内并支撑温度传感器; 以及围绕温度传感器并压靠套筒内壁的绝热环。 绝热环的外径大于温度传感器的宽度,并且因此在温度传感器和套管的内壁之间形成气隙; 绝热环的顶部的高度高于温度传感器的顶部,并且因此在温度传感器和弯曲块之间形成另一气隙。 从而有效地延迟了从外部到温度传感器的热传导。
    • 9. 发明授权
    • Probe cover for ear thermometer
    • 耳温度计探头盖
    • US07722250B2
    • 2010-05-25
    • US12318357
    • 2008-12-29
    • Vincent WengKevin LinJames Huang
    • Vincent WengKevin LinJames Huang
    • G01K1/08
    • G01J5/02G01J5/021
    • The present invention discloses a probe cover for an ear thermometer, which comprises: a film cover and a base. The film cover has a cover window able to contact the probe window at the front end of the ear thermometer, a hollow cone able to contact the sidewall of the probe and a strengthened element able to contact the cover window and the hollow cone. The thickness of the cover window is same as the thickness of the strengthened element and greater than the thickness of the hollow cone. Thereby, the present invention can prevent the variation of infrared transmittance caused by the misarrangement and non-uniform thickness of the probe cover film disposed at the front of the probe window.
    • 本发明公开了一种用于耳温度计的探针盖,其包括:胶片盖和底座。 胶片盖具有能够接触耳温度计前端的探针窗口的遮盖窗口,能够接触探针侧壁的中空锥体和能够接触遮盖窗和中空锥体的加强元件。 盖窗的厚度与加强元件的厚度相同,大于中空锥体的厚度。 由此,本发明能够防止由设置在探针窗前部的探针覆盖膜的误差和不均匀厚度引起的红外线透射率的变化。