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1. 发明授权

US06652665B1 Method of removing silicone polymer deposits from electronic components 有权
标题翻译：从电子部件去除有机硅聚合物沉积物的方法
公开(公告)号：US06652665B1
公开(公告)日：2003-11-25
申请号：US10160627
申请日：2002-05-31
申请人： Krishna G. Sachdev , Umar M. Ahmad , Chon C. Lei
发明人： Krishna G. Sachdev , Umar M. Ahmad , Chon C. Lei
IPC分类号： B08B310
CPC分类号： C11D7/261 , B08B3/02 , B08B3/102 , C11D7/263 , C11D7/266 , C11D7/3209 , C11D7/5022 , C11D11/0047 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152 , H05K3/288
摘要： A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.
摘要翻译：从电子部件去除固化的硅氧烷聚合物沉积物的方法。将组分浸入预热的季铵氟化物在疏水非羟基非质子溶剂中并搅拌。然后将组分浸入基本上由疏水性非质子溶剂组成的预热溶剂中并搅拌。随后在搅拌下用亲水性，基本上水溶性的溶剂冲洗和喷雾组分。然后将组分浸入水浴中，然后用加压喷雾水冲洗，然后用N 2吹干干燥。

2. 发明授权

US06406778B1 Multi-thickness, multi-layer green sheet lamination and method thereof 有权
标题翻译：多层，多层生片层压及其方法
公开(公告)号：US06406778B1
公开(公告)日：2002-06-18
申请号：US09621796
申请日：2000-07-21
申请人： Govindarajan Natarajan , Krishna G. Sachdev , Abubaker S. Shagan
发明人： Govindarajan Natarajan , Krishna G. Sachdev , Abubaker S. Shagan
IPC分类号： B32B1706
CPC分类号： B32B18/00 , C04B2235/785 , C04B2237/341 , C04B2237/343 , C04B2237/366 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K3/4664 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , Y10T428/2495 , H01L2924/00
摘要： The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.
摘要翻译：本发明一般涉及至少使用至少一种较薄的生坯片，该生片最初是非常薄的，借助于至少一个较厚的生片。还公开了构建多层陶瓷层压体的粘合屏障及其工艺。基本上，本发明涉及一种用于形成叠层结构的结构和方法，更具体地涉及使用至少一个非常薄的生片和/或至少一个生坯片来制造多密度多层陶瓷产品的结构和方法在至少一个更厚的生片上方具有非常密集的导电图案。

3. 发明授权

US06351871B1 Aqueous quaternary ammonium hydroxide as a screening mask cleaner 失效
标题翻译：水性季铵氢氧化物作为筛选面膜清洁剂
公开(公告)号：US06351871B1
公开(公告)日：2002-03-05
申请号：US09335420
申请日：1999-06-17
申请人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： A47L2500
CPC分类号： C23G1/14 , C11D7/06 , C11D7/3209 , C11D7/3218 , C11D11/0047 , C23G1/24 , G03F7/425 , H01L21/4864 , H05K1/092 , H05K3/1233 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.
摘要翻译：本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法陶瓷（MLC）基板。

4. 发明授权

US5938856A Process of removing flux residue from microelectronic components 失效
标题翻译：从微电子元件去除焊剂残留物的过程
公开(公告)号：US5938856A
公开(公告)日：1999-08-17
申请号：US876141
申请日：1997-06-13
申请人： Krishna G. Sachdev , Umar M. Ahmad , John U. Knickerbocker , Chon C. Lei
发明人： Krishna G. Sachdev , Umar M. Ahmad , John U. Knickerbocker , Chon C. Lei
IPC分类号： C11D7/26 , C11D7/50 , C11D11/00 , H01L21/304 , H01L21/48 , H05K3/26 , B08B7/00
CPC分类号： C11D11/0047 , C11D7/5022 , H01L21/4864 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12044 , H01L2924/15311 , H05K3/26
摘要： This invention relates to the use of non-halogenated and non-aromatic cleaning solvents as environmentally safe replacement of perchloroethylene and xylene to remove rosin flux residue formed on electronic circuit device materials during solder interconnection process for assembly of electronic components.
摘要翻译：本发明涉及非卤化和非芳香族清洁溶剂作为环境安全替代全氯乙烯和二甲苯以去除在电子部件组装的焊接互连过程期间在电子电路装置材料上形成的松香助焊剂残渣。

5. 发明授权

US5643818A Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip 失效
标题翻译：从用于微电子芯片空腔的多层陶瓷基板制造中使用的金属插件中除去残留物
公开(公告)号：US5643818A
公开(公告)日：1997-07-01
申请号：US642238
申请日：1996-05-02
申请人： Krishna G. Sachdev , Thomas E. Lombardi , Vincent P. Peterson
发明人： Krishna G. Sachdev , Thomas E. Lombardi , Vincent P. Peterson
IPC分类号： H01L21/48 , H01L21/70
CPC分类号： H01L21/4857 , H01L21/4864 , H01L2924/15153 , H01L2924/1517
摘要： After a metallic insert has been used precisely to define a cavity for a microelectronic chip in a laminated, multi-sheet, predominantly ceramic substrate having metallic features, any green sheet and metal-polymer composite paste residues are removed from the metallic insert by immersing the metallic insert in an ultrasonically agitated bath containing a first solvent having a relatively high boiling point for about five to fifteen minutes, replacing the first solvent with a second solvent having a relatively low boiling point, and drying the metallic insert in hot air or hot nitrogen to remove the second solvent. Preferably, the first solvent is an alkoxy alcohol, such as 1-methoxy-2-propanol or 3-methoxy-1-butanol, or a hydroxy ester, such as ethyl lactate, and the second solvent is a lower alkyl alcohol, such as isopropanol. Alternatively, the first solvent may be a ketone or an alkyl ester. The metallic insert is rinsed in the second solvent, preferably in an ultrasonically agitated bath, to replace the first solvent with the second solvent before the metallic insert is dried to remove the first solvent.
摘要翻译：在金属插入件被精确地用于在具有金属特征的层压，多片，主要为陶瓷的基底中限定用于微电子芯片的空腔的情况下，通过将任何生片和金属 - 聚合物复合糊料残留物从金属插入物中浸渍金属插入物在包含具有较高沸点的第一溶剂的超声波搅拌浴中约5至15分钟，用具有相对低沸点的第二溶剂代替第一溶剂，并在热空气或热氮中干燥金属插入物以除去第二溶剂。优选地，第一溶剂是烷氧基醇，例如1-甲氧基-2-丙醇或3-甲氧基-1-丁醇，或羟基酯如乳酸乙酯，第二溶剂是低级烷基醇，例如异丙醇或者，第一溶剂可以是酮或烷基酯。金属插入物在第二溶剂中，优选在超声波搅拌浴中漂洗，以在将金属插入物干燥以除去第一溶剂之前用第二溶剂替换第一溶剂。

6. 发明授权

US5532608A Ceramic probe card and method for reducing leakage current 失效
标题翻译：陶瓷探针卡和减少漏电流的方法
公开(公告)号：US5532608A
公开(公告)日：1996-07-02
申请号：US417623
申请日：1995-04-06
申请人： Abbas Behfar-Rad , Charles H. Perry , Krishna G. Sachdev
发明人： Abbas Behfar-Rad , Charles H. Perry , Krishna G. Sachdev
IPC分类号： G01R31/26 , G01R1/073 , H05K3/28 , H05K9/00 , G01R15/12
CPC分类号： G01R1/07307
摘要： An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 micrometer, preferably less than 0.1 micrometer and most preferably between 0.01 and 0.001 micrometers. The hydrophobic layer does not interfere with subsequent soldering to the contacts on the card, is inexpensive, solvent resistant and easily applied to new and pre-existing probe cards. The method of application involves applying an excess of the hydrophobic silicone material in its uncured state, followed by vigorously wiping excess material off to thin the layer, produce a good bond and clean the exposed conductors on the probe card.
摘要翻译：用于具有减小的漏电流的微电子学参数测试的电探针卡包括在裸露导体之间涂覆陶瓷卡的整个暴露表面的自固化硅氧烷材料的疏水层。疏水层的厚度小于1微米，优选小于0.1微米，最优选为0.01至0.001微米。疏水层不会干扰随后焊接到卡上的触点，价格低廉，耐溶剂性，并且易于应用于新的和预先存在的探针卡。施用方法包括将过量的疏水性硅氧烷材料应用于其未固化状态，然后剧烈擦拭多余的材料以使层变薄，产生良好的粘结并清洁探针卡上的暴露的导体。

7. 发明授权

US5374503A Method of forming patterned polyimide films 失效
标题翻译：形成图案化聚酰亚胺膜的方法
公开(公告)号：US5374503A
公开(公告)日：1994-12-20
申请号：US47642
申请日：1993-04-13
申请人： Krishna G. Sachdev , Joel R. Whitaker , Umar M. Ahmad
发明人： Krishna G. Sachdev , Joel R. Whitaker , Umar M. Ahmad
IPC分类号： H01L21/30 , G03F7/00 , G03F7/09 , H01L21/306 , H01L21/311 , H01L21/312 , H01L21/768 , G03C5/00
CPC分类号： G03F7/0035 , G03F7/094 , H01L21/31144 , H01L21/76804
摘要： A method of producing patterned polyimide films using wet development of polyimide precursors through a photoresist mask is disclosed. Low thermal coefficient of expansion (TCE) polyimide patterns are formed by starting with a polyamic acid precursor, typically, that derived from 3,3',4,4'-biphenyltetracarboxylic acid dianhydride-p-phenylenediamine (BPDA-PDA). Polyimide patterns are generated with complete retention of the intrinsic properties of the polyimide backbone chemistry and formation of metallurgical patterns in low TCE polyimide dielectric.
摘要翻译：公开了通过光致抗蚀剂掩模使用聚酰亚胺前体的湿显影制造图案化聚酰亚胺膜的方法。通过从聚酰胺酸前体（通常来源于3,3'，4,4'-联苯四羧酸二酐 - 对苯二胺（BPDA-PDA））开始形成低热膨胀系数（TCE）聚酰亚胺图案。产生聚酰亚胺图案，完全保留聚酰亚胺骨架化学的固有性质，并在低TCE聚酰亚胺电介质中形成冶金图案。

8. 发明授权

US5231751A Process for thin film interconnect 失效
标题翻译：薄膜互连工艺
公开(公告)号：US5231751A
公开(公告)日：1993-08-03
申请号：US784281
申请日：1991-10-29
申请人： Krishna G. Sachdev , Benedikt M. J. Kellner , Kathleen M. McGuire , Peter J. Sorce
发明人： Krishna G. Sachdev , Benedikt M. J. Kellner , Kathleen M. McGuire , Peter J. Sorce
IPC分类号： H01L23/522 , C08G73/10 , H01L21/48 , H01L21/768 , H01L23/538 , H05K1/05 , H05K3/00 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46
CPC分类号： H01L23/5384 , H01L21/486 , H01L23/5383 , H05K3/445 , H05K3/4641 , H01L2924/0002 , H05K2201/0154 , H05K2201/068 , H05K2201/09554 , H05K2201/09563 , H05K2201/096 , H05K2203/0152 , H05K3/0032 , H05K3/0035 , H05K3/0061 , H05K3/007 , H05K3/388 , H05K3/4076 , H05K3/423 , H05K3/4614 , H05K3/4617 , Y10T29/49165 , Y10T428/12361 , Y10T428/12382 , Y10T428/12556 , Y10T428/12569 , Y10T428/12806 , Y10T428/12812 , Y10T428/24777 , Y10T428/31678 , Y10T428/31681
摘要： This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

9. 发明授权

US5115090A Viscosity stable, essentially gel-free polyamic acid compositions 失效
标题翻译：粘度稳定，基本无凝胶聚氨酯组合物
公开(公告)号：US5115090A
公开(公告)日：1992-05-19
申请号：US503401
申请日：1990-03-30
申请人： Krishna G. Sachdev , John P. Hummel , Ranee W. Kwong , Robert N. Lang , Leo L. Linehan , Harbans S. Sachdev
发明人： Krishna G. Sachdev , John P. Hummel , Ranee W. Kwong , Robert N. Lang , Leo L. Linehan , Harbans S. Sachdev
IPC分类号： C08G73/10 , C08L79/08 , H01L21/312 , H01L23/29 , H01L23/498 , H01L23/532 , H05K1/00
CPC分类号： H01L23/5329 , C08G73/1014 , H01L23/293 , H01L23/49894 , H01L2924/0002 , H05K3/4676
摘要： Viscosity stable, essentially gel-free linear polyamic acids are provided by a process utilizing offset stoichiometry. Polyimides formed from such polyamic acids have low TCE and low dielectric constants.Methods for improved adhesion of polyimides are also disclosed.

10. 发明授权

US5114826A Photosensitive polyimide compositions 失效
标题翻译：感光性聚酰亚胺组合物
公开(公告)号：US5114826A
公开(公告)日：1992-05-19
申请号：US458130
申请日：1989-12-28
申请人： Ranee W. Kwong , Harbans S. Sachdev , Krishna G. Sachdev
发明人： Ranee W. Kwong , Harbans S. Sachdev , Krishna G. Sachdev
IPC分类号： C08F2/46 , C08G73/10 , C08K5/23 , C08K5/28 , C08L79/08 , G03F7/038 , G03F7/039 , G03F7/075 , G03F7/26 , H01L21/027 , H01L21/30
CPC分类号： G03F7/0758 , G03F7/0387 , G03F7/039 , H01L2224/11334
摘要： New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.

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