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1. 发明授权

US06800141B2 Semi-aqueous solvent based method of cleaning rosin flux residue 失效
标题翻译：半水溶剂型清洗松香助焊剂残渣的方法
公开(公告)号：US06800141B2
公开(公告)日：2004-10-05
申请号：US10026269
申请日：2001-12-21
申请人： Krishna G. Sachdev , Chon C. Lei , Demian M. Riccardi
发明人： Krishna G. Sachdev , Chon C. Lei , Demian M. Riccardi
IPC分类号： B08B300
CPC分类号： C11D11/0047 , C09D9/00 , C11D3/2034 , C11D3/2068 , C11D3/43 , C23G5/02 , Y10S438/906
摘要： A semi-aqueous solvent based method using non-aromatic, halogen-free organic solvent compositions for the effective removal of flux residue from electronic component surfaces after high temperature solder interconnections in the presence of rosin based flux compositions. Rosin flux residue can be removed using hydrophobic, essentially water insoluble, propylene glycol alkylether solvents in conjunction with a surfactant, preferably an ionic and/or a mixture of a non-ionic and an ionic surfactant in the first step, then a second step involving immersion with agitation in a hydrophobic solvent with no added surfactant. This is followed by a third step of hydrophilic solvent immersion with agitation/spray, rinsing off the hydrophilic solvent with water, and then a drying step.
摘要翻译：在基于松香的助熔剂组合物存在下，使用非芳香族无卤素的有机溶剂组合物，用于在高温焊料互连之后有效地从电子部件表面去除焊剂残留物的半水溶剂基方法。可以使用疏水性基本上不溶于水的丙二醇烷基醚溶剂与第一步中的表面活性剂，优选离子和/或非离子和离子表面活性剂的离子和/或混合物一起除去松香助焊剂残余物，然后涉及第二步骤在没有添加表面活性剂的疏水性溶剂中搅拌浸泡。然后进行亲水溶剂浸渍搅拌/喷雾的第三步骤，用水漂洗亲水性溶剂，然后干燥步骤。

2. 发明授权

US06276596B1 Low temperature solder column attach by injection molded solder and structure formed 失效
标题翻译：低温焊料柱通过注塑焊料附着并形成结构
公开(公告)号：US06276596B1
公开(公告)日：2001-08-21
申请号：US09649487
申请日：2000-08-28
申请人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
发明人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
IPC分类号： B23K3102
CPC分类号： H05K3/3468 , B23K3/0638 , B23K35/0222 , B23K2101/40 , H01L21/4846 , H05K2203/0113 , H05K2203/0338 , H05K2203/0415 , H05K2203/074 , H05K2203/128
摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
摘要翻译：公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。传递板中的多个空腔各具有直的开口和扩口的开口。然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

3. 发明授权

US06448796B1 Selective netlist to test fine pitch multi-chip semiconductor 失效
标题翻译：选择性网表，以测试细间距多芯片半导体
公开(公告)号：US06448796B1
公开(公告)日：2002-09-10
申请号：US09593557
申请日：2000-06-14
申请人： John J. Ellison , Chon C. Lei , Jorge L. Rivera
发明人： John J. Ellison , Chon C. Lei , Jorge L. Rivera
IPC分类号： G01R3102
CPC分类号： G01R31/318513 , G01R31/31926
摘要： A system for testing every one of the signal inputs and outputs (I/O) of a fine pitch multi-chip semiconductor module utilizing a selective netlist, through the intermediary of presently available test equipment. More particularly, the system facilitates the testing of fine pitch multi-chip modules utilizing 1.0 mm ceramic column grid array (CCGA) technology in order to facilitate the use of increased system interconnect capabilities. Additionally, there is provided a method of employing a selective netlist in order to test fine pitch multi-chip semiconductor modules; especially such as, but not limited to 1.0 mm pitch ceramic column grid array (CCGA) modules by employing commercially available test equipment.
摘要翻译：一种用于通过目前可用的测试设备的中介，利用选择性网表来测试每个信号输入和输出（I / O）的细间距多芯片半导体模块的系统。更具体地，该系统便于使用1.0mm陶瓷列网格阵列（CCGA）技术来测试精细间距多芯片模块，以便于使用增加的系统互连能力。此外，提供了一种采用选择性网表以便测试细间距多芯片半导体模块的方法; 特别是例如但不限于采用市售测试设备的1.0mm间距陶瓷柱格栅阵列（CCGA）模块。

4. 发明授权

US06965171B1 Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules 失效
标题翻译：在集成电路芯片模块上选择性散热膏沉积和保留的方法和结构
公开(公告)号：US06965171B1
公开(公告)日：2005-11-15
申请号：US10709931
申请日：2004-06-07
申请人： Tim H. Lee , Chon C. Lei , Donald J. Papae , Francis F. Szenher
发明人： Tim H. Lee , Chon C. Lei , Donald J. Papae , Francis F. Szenher
IPC分类号： H01L23/02 , H01L23/367 , G01L23/48 , G01L23/52 , G01L29/40
CPC分类号： H01L23/3675 , H01L23/3677 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/3011
摘要： An integrated circuit (IC) chip module includes at least one integrated circuit chip mounted upon a substrate, and a plurality of passive components mounted upon the substrate. A polymer based bib has at least one opening formed therein, the at least one opening configured to accommodate the at least one integrated circuit chip therein, and the bib further configured for attachment to one or more of the plurality of passive components. A protective cap is mounted over the at least one integrated circuit chip and attached to the substrate, wherein the bib is configured to retain thereon a thermally conductive paste initially applied to at least one of the integrated circuit chip and the protective cap.
摘要翻译：集成电路（IC）芯片模块包括安装在基板上的至少一个集成电路芯片和安装在基板上的多个无源部件。基于聚合物的围兜具有形成在其中的至少一个开口，所述至少一个开口被配置为在其中容纳所述至少一个集成电路芯片，并且所述围兜还被配置为附接到所述多个无源元件中的一个或多个。保护盖安装在所述至少一个集成电路芯片上并附接到所述基板，其中所述围拢被配置为在其上保持最初施加到所述集成电路芯片和所述保护盖中的至少一个的导热浆。

5. 发明授权

US06491205B1 Assembly of multi-chip modules using eutectic solders 失效
标题翻译：使用共晶焊料组装多芯片模块
公开(公告)号：US06491205B1
公开(公告)日：2002-12-10
申请号：US09960021
申请日：2001-09-21
申请人： Chon C. Lei , Jac A. Burke , William F. Beausoleil , N. James Tomassetti , Lawrence A. Thomas , Tak-kwong Ng , Michael Kessler
发明人： Chon C. Lei , Jac A. Burke , William F. Beausoleil , N. James Tomassetti , Lawrence A. Thomas , Tak-kwong Ng , Michael Kessler
IPC分类号： B23K3102
CPC分类号： H01L24/80 , B23K1/008 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K2101/42 , H01L2224/13111 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H05K3/26 , H05K3/3463 , H05K3/3484 , H05K2201/094 , H05K2201/10674 , H05K2201/10689 , H05K2201/10734 , H05K2203/047 , H05K2203/0786 , H05K2203/1476 , H01L2924/00
摘要： Chips requiring high temperature reflow for attachment to a module substrate are attached first and then a eutectic water soluble solder paste and/or water soluble flux is dispensed on both the TSOP and the PBGA chip pads instead of using the paste screening techniques. The dispensing is done by injecting solder on the solder sites individually. Characteristics of the solder paste used is that it must be fluid enough to be injected onto the individual sites yet have enough body that it remains in place and does not run from site to site once dispensed. A paste capable of providing such characteristics is one having: a ) a very fine particle size in the range of 400 to 500 mesh and preferably between 400 and 450 mesh; b) a low viscosity (below 500 k centerpoise and preferably between 425 to 375 cps); and c) a solid content of 86% or lower and preferably between 84 and 80%. The chips to be joined to the module using low temperature module joining are then placed on the module substrate surface and then put in an oven for reflow to attach these chips to the surface. After the joining process, the modules are cleaned by spraying deionized water on them to remove any flux or solder residues and the modules are electrically tested to determine if the joining process has resulted in connection with the proper mechanical and electrical characteristics.
摘要翻译：首先附加需要高温回流的芯片以附着于模块基板，然后将共晶的水溶性焊膏和/或水溶性助焊剂分配在TSOP和PBGA芯片焊盘上，而不是使用糊状物筛选技术。分配是通过在焊料点上单独注入焊料来完成的。所使用的焊膏的特征在于其必须足够流体注入到各个位置上，但具有足够的体积，其保持在适当位置，并且一旦分配就不会从现场运行。能够提供这种特性的糊料是具有：a）在400-500目范围内，优选400-450目的非常细的粒度; b）低粘度（低于500k中心，优选在425至375cps之间）; 和c）固体含量为86％以下，优选为84〜80％。然后将使用低温模块接合的与模块接合的芯片放置在模块基板表面上，然后放入烘箱中以进行回流以将这些芯片附接到表面。在连接过程之后，通过在其上喷洒去离子水来清洁模块以除去任何焊剂或焊料残留物，并且模块被电测试以确定接合过程是否已经导致与适当的机械和电气特性相关联。

6. 发明授权

US06652665B1 Method of removing silicone polymer deposits from electronic components 有权
标题翻译：从电子部件去除有机硅聚合物沉积物的方法
公开(公告)号：US06652665B1
公开(公告)日：2003-11-25
申请号：US10160627
申请日：2002-05-31
申请人： Krishna G. Sachdev , Umar M. Ahmad , Chon C. Lei
发明人： Krishna G. Sachdev , Umar M. Ahmad , Chon C. Lei
IPC分类号： B08B310
CPC分类号： C11D7/261 , B08B3/02 , B08B3/102 , C11D7/263 , C11D7/266 , C11D7/3209 , C11D7/5022 , C11D11/0047 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152 , H05K3/288
摘要： A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.
摘要翻译：从电子部件去除固化的硅氧烷聚合物沉积物的方法。将组分浸入预热的季铵氟化物在疏水非羟基非质子溶剂中并搅拌。然后将组分浸入基本上由疏水性非质子溶剂组成的预热溶剂中并搅拌。随后在搅拌下用亲水性，基本上水溶性的溶剂冲洗和喷雾组分。然后将组分浸入水浴中，然后用加压喷雾水冲洗，然后用N 2吹干干燥。

7. 发明授权

US5938856A Process of removing flux residue from microelectronic components 失效
标题翻译：从微电子元件去除焊剂残留物的过程
公开(公告)号：US5938856A
公开(公告)日：1999-08-17
申请号：US876141
申请日：1997-06-13
申请人： Krishna G. Sachdev , Umar M. Ahmad , John U. Knickerbocker , Chon C. Lei
发明人： Krishna G. Sachdev , Umar M. Ahmad , John U. Knickerbocker , Chon C. Lei
IPC分类号： C11D7/26 , C11D7/50 , C11D11/00 , H01L21/304 , H01L21/48 , H05K3/26 , B08B7/00
CPC分类号： C11D11/0047 , C11D7/5022 , H01L21/4864 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12044 , H01L2924/15311 , H05K3/26
摘要： This invention relates to the use of non-halogenated and non-aromatic cleaning solvents as environmentally safe replacement of perchloroethylene and xylene to remove rosin flux residue formed on electronic circuit device materials during solder interconnection process for assembly of electronic components.
摘要翻译：本发明涉及非卤化和非芳香族清洁溶剂作为环境安全替代全氯乙烯和二甲苯以去除在电子部件组装的焊接互连过程期间在电子电路装置材料上形成的松香助焊剂残渣。

8. 发明授权

US06503874B2 Cleaning method to remove flux residue in electronic assembly 失效
标题翻译：清除电子组件中残留焊剂的方法
公开(公告)号：US06503874B2
公开(公告)日：2003-01-07
申请号：US09760939
申请日：2001-01-16
申请人： Krishna G. Sachdev , Chon C. Lei
发明人： Krishna G. Sachdev , Chon C. Lei
IPC分类号： B08B700
CPC分类号： H01L21/4864 , C11D7/263 , C11D7/266 , C11D7/5022 , C11D11/0047 , H01L21/4835 , H05K3/26 , H05K2203/0783
摘要： This invention provides a method for removing flux residue and similar other residues formed on the surfaces of micro electronic components during soldering operations using solder paste and fluxing agents in electronic module assembly component fabrication by a semi-aqueous solvent cleaning process using propylene glycol alkyl ether solvents, preferably the mono alkyl ethers, as replacements for xylene. The electronic components may contain plastic components, for example, a plastic grid array (PBGA) in addition to silicon device chip(s), C4 decaps and SMTs on a ceramic chip carrier with solder columns. Preferred solvents are dipropylene glycol mono methyl ether and tripropylene glycol mono methyl ether, which are both water soluble.
摘要翻译：本发明提供一种在使用丙二醇烷基醚溶剂的半水溶剂清洗方法制造电子模块组件部件时，使用焊膏和助熔剂在焊接操作期间除去形成在微电子部件表面上的助焊剂残留物和类似的其它残留物的方法，优选单烷基醚，作为二甲苯的替代物。除了硅器件芯片之外，电子部件可以包含塑料部件，例如除了硅器件芯片之外的塑料栅格阵列（PBGA），具有焊料柱的陶瓷芯片载体上的C4折叠和SMT。优选的溶剂是二丙二醇单甲醚和三丙二醇单甲醚，它们都是水溶性的。

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