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    • 5. 发明申请
    • Vapor deposition apparatus
    • 蒸镀装置
    • US20060065197A1
    • 2006-03-30
    • US11235188
    • 2005-09-27
    • Eiji YamadaTakayuki YuasaMasahiro ArakiNakao Akutsu
    • Eiji YamadaTakayuki YuasaMasahiro ArakiNakao Akutsu
    • C23C16/00
    • C23C16/455C23C16/54
    • A vapor deposition apparatus of the present invention has a substrate holder having a substrate holding surface for holding a substrate thereon, and a flow channel for supplying a source gas onto the substrate. The flow channel has an upper wall and a lower wall. An aperture portion is provided in the lower wall of the flow channel. The substrate holding surface of the substrate holder fits in the aperture portion while forming a space between the substrate holding surface and the aperture portion. A means for reducing leakage of gas through the space between the aperture portion and the substrate holder is provided. With this structure, since a means for reducing leakage of gas through the space between the aperture portion and the substrate holder is provided, the conductance with respect to outflow of gas increases, which in turn reduces variations in the amount of outflow gas. This results in high yield production of nitride semiconductor devices with a long life and high light-emission efficiency.
    • 本发明的蒸镀装置具有:基板保持具,具有用于保持基板的基板保持面,以及用于将源气体供给到基板上的流路。 流动通道具有上壁和下壁。 开口部设置在流路的下壁。 在衬底保持表面和孔部之间形成空间的同时,衬底保持器的衬底保持表面装配在孔部分中。 提供了一种用于减少气体通过开口部分和衬底保持器之间的空间的泄漏的装置。 利用这种结构,由于提供了用于减少气体通过开口部和基板保持架之间的空气的泄漏的装置,所以相对于气体流出的电导性增加,从而减小流出气体量的变化。 这导致具有长寿命和高发光效率的氮化物半导体器件的高产量生产。