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    • 3. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07868424B2
    • 2011-01-11
    • US11658227
    • 2005-07-07
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • H01L21/02
    • H01L29/0821B82Y10/00H01L29/06H01L29/0665H01L29/0673H01L29/0676H01L29/08H01L29/423H01L29/42304H01L29/66242H01L29/737H01L29/7378
    • The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (12) comprising a vertical bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type and the first conductivity type, wherein the collector region (3) comprises a first sub-region (3A) bordering the base region (2) and a second sub-region (3B) bordering the first sub-region (3A) which has a lower doping concentration than the second sub-region (3B), and the transistor is provided with a gate electrode (5) which laterally borders the first sub-region (3A) and by means of which the first sub-region (3A) may be depleted. According to the invention the collector region (3) borders the surface of the semiconductor body (12), while the emitter region (1) is recessed in the semiconductor body (12), and the collector region (3) forms part of a mesa structure (6) formed at the surface of the semiconductor body (12). Such a device (10) has very favorable properties at high frequencies and high voltages and, moreover, is easy to manufacture. In a preferred embodiment the collector (3) comprises a nanowire (30) forming the mesa structure (6).
    • 本发明涉及一种具有衬底(11)和半导体本体(12)的半导体器件(10),该半导体器件包括分别具有发射极区,基极区和集电极区(1,2,3)的垂直双极晶体管 ,第一导电类型,与第一导电类型和第一导电类型相反的第二导电类型,其中集电极区域(3)包括与基极区域(2)接壤的第一子区域(3A) 与第二子区域(3A)接合的第一子区域(3A)的区域(3B),其具有比第二子区域(3B)低的掺杂浓度,并且晶体管设置有与第一子区域横向相邻的栅电极(5) 3A),并且借助于此可以使第一子区域(3A)耗尽。 根据本发明,集电极区域(3)与半导体本体(12)的表面相接触,而发射极区域(1)凹入半导体本体(12)中,并且集电极区域(3)形成台面的一部分 结构(6)形成在半导体本体(12)的表面。 这种装置(10)在高频和高电压下具有非常有利的特性,而且易于制造。 在优选实施例中,收集器(3)包括形成台面结构(6)的纳米线(30)。
    • 5. 发明申请
    • Semiconductor Device and Method of Manufacturing the Same
    • 半导体器件及其制造方法
    • US20080315361A1
    • 2008-12-25
    • US11658227
    • 2005-07-07
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • H01L27/00H01L21/331
    • H01L29/0821B82Y10/00H01L29/06H01L29/0665H01L29/0673H01L29/0676H01L29/08H01L29/423H01L29/42304H01L29/66242H01L29/737H01L29/7378
    • The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (12) comprising a vertical bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type and the first conductivity type, wherein the collector region (3) comprises a first sub-region (3A) bordering the base region (2) and a second sub-region (3B) bordering the first sub-region (3A) which has a lower doping concentration than the second sub-region (3B), and the transistor is provided with a gate electrode (5) which laterally borders the first sub-region (3A) and by means of which the first sub-region (3A) may be depleted. According to the invention the collector region (3) borders the surface of the semiconductor body (12), while the emitter region (1) is recessed in the semiconductor body (12), and the collector region (3) forms part of a mesa structure (6) formed at the surface of the semiconductor body (12). Such a device (10) has very favorable properties at high frequencies and high voltages and, moreover, is easy to manufacture. In a preferred embodiment the collector (3) comprises a nanowire (30) forming the mesa structure (6).
    • 本发明涉及一种具有衬底(11)和半导体本体(12)的半导体器件(10),该半导体器件包括分别具有发射极区,基极区和集电极区(1,2,3)的垂直双极晶体管 ,第一导电类型,与第一导电类型和第一导电类型相反的第二导电类型,其中集电极区域(3)包括与基极区域(2)接壤的第一子区域(3A) 与第二子区域(3A)接合的第一子区域(3A)的区域(3B),其具有比第二子区域(3B)低的掺杂浓度,并且晶体管设置有与第一子区域横向相邻的栅电极(5) 3A),并且借助于此可以使第一子区域(3A)耗尽。 根据本发明,集电极区域(3)与半导体本体(12)的表面相接触,而发射极区域(1)凹入半导体本体(12)中,并且集电极区域(3)形成台面的一部分 结构(6)形成在半导体本体(12)的表面。 这种装置(10)在高频和高电压下具有非常有利的特性,而且易于制造。 在优选实施例中,收集器(3)包括形成台面结构(6)的纳米线(30)。
    • 7. 发明授权
    • Semiconductor device and method of manufacture thereof
    • 半导体装置及其制造方法
    • US08476675B2
    • 2013-07-02
    • US12918524
    • 2009-02-26
    • Philippe Meunier-BeillardJohannes J. T. M. DonkersErwin Hijzen
    • Philippe Meunier-BeillardJohannes J. T. M. DonkersErwin Hijzen
    • H01L29/66
    • H01L21/8249H01L27/0623H01L29/0649H01L29/0821H01L29/1004H01L29/165H01L29/42304H01L29/456H01L29/66242H01L29/7378
    • A semiconductor device (10) comprising a bipolar transistor and a field 5 effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22c and 22d) and a base region (33c) of the bipolar transistor. The bipolar transistor is provided with an insulating cavity (92b) provided in the collector region (22c and 22d). The insulating cavity (92b) may be provided by providing a layer (33a) in the collector region (22c), creating an access path, for example by selectively etching polysilicon towards monocrystalline, and removing a portion of the layer (33a) to provide the cavity using the access path. The layer (33a) provided in the collector region may be of SiGe:C. By blocking diffusion from the base region the insulating cavity (92b) provides a reduction in the base collector capacitance and can be described as defining the base contact.
    • 一种半导体器件(10),包括在半导体本体(1)内的双极晶体管和场效应晶体管,包括突出的台面(5),其中集电极区域(22c和22d)的至少一部分和基极区域 (33c)。 双极晶体管设置有设置在集电区域(22c和22d)中的绝缘腔(92b)。 可以通过在集电极区域(22c)中设置层(33a)来提供绝缘腔(92b),从而产生存取路径,例如通过选择性地将多晶硅蚀刻成单晶,并去除层(33a)的一部分以提供 使用进入路径的空腔。 设置在集电区域中的层(33a)可以是SiGe:C。 通过阻挡从基极区域的扩散,绝缘腔(92b)提供基极集电极电容的减小,并且可以被描述为限定基极接触。
    • 10. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    • 制造半导体器件的方法和采用这种方法获得的半导体器件
    • US20100289022A1
    • 2010-11-18
    • US12094303
    • 2006-10-29
    • Joost MelaiErwin HijzenPhilippe Meunier-BeillardJohannes J.T.M. Donkers
    • Joost MelaiErwin HijzenPhilippe Meunier-BeillardJohannes J.T.M. Donkers
    • H01L29/73H01L21/331H01L29/02
    • H01L29/66242H01L29/66287
    • The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one bipolar transistor having an emitter region (1), a base region (2) and a collector region (3), wherein in the semiconductor body (12) a first semiconductor region (13) is formed that forms one (3) of the collector and emitter regions (1,3) and on the surface of the semiconductor body (12) a stack of layers is formed comprising a first insulating layer (4), a polycrystalline semiconductor layer (5) and a second insulating layer (6) in which stack an opening (7) is formed, after which by non-selective epitaxial growth a further semiconductor layer (22) is deposited of which a monocrystalline horizontal part on the bottom of the opening (7) forms the base region (2) and of which a polycrystalline vertical part (2A) on a side face of the opening (7) is connected to the polycrystalline semiconductor layer (5), after which spacers (S) are formed parallel to the side face of the opening (7) and a second semiconductor region (31) is formed between said spacers (S) forming the other one (1) of the emitter and collector regions (1,3). According to the invention the above method is characterized in that before the further semiconductor layer (22) is deposited, the second insulating layer (6) is provided with an end portion (6A) that viewed in projection overhangs an end portion (5A) of the underlying semiconductor layer (5). In this way bipolar transistor devices can be obtained with good high frequency properties in a cost effective manner.
    • 本发明涉及一种制造半导体器件(10)的方法,所述半导体器件(10)具有衬底(11)和半导体本体(12),所述半导体器件(12)具有至少一个具有发射极区域(1),基极区域(2) 和集电极区域(3),其中在所述半导体本体(12)中形成第一半导体区域(13),所述第一半导体区域形成所述集电极和发射极区域(1,3)中的一个(3)并且在所述半导体主体 (12)形成一叠层,其包括形成有开口(7)的第一绝缘层(4),多晶半导体层(5)和第二绝缘层(6),之后通过非选择性 外延生长沉积另外的半导体层(22),其中开口(7)的底部上的单晶水平部分形成基部区域(2),并且在该开口的侧面上具有多晶垂直部分(2A) (7)连接到多晶半导体层(5),之后是间隔 (S)形成为平行于开口(7)的侧面,并且在形成发射极和集电极区域(1,3)的另一个(1)的所述间隔物(S)之间形成第二半导体区域(31) )。 根据本发明,上述方法的特征在于,在沉积另外的半导体层(22)之前,第二绝缘层(6)设置有端部(6A),其从突出部分观察到突出部分 底层半导体层(5)。 以这种方式,可以以成本有效的方式获得具有良好高频特性的双极晶体管器件。