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    • 4. 发明申请
    • Methods of fabricating image sensors and image sensors fabricated thereby
    • 制造图像传感器和图像传感器的方法
    • US20110163362A1
    • 2011-07-07
    • US13064176
    • 2011-03-09
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • H01L31/14
    • H01L27/14643H01L27/14603H01L27/14609H01L27/14641H01L27/14689
    • A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.
    • 制造图像传感器的方法可以包括提供包括光接收和非光接收区域的基板; 在非光接收区域上形成多个栅极; 将第一导电型掺杂剂离子注入到光接收区域中以形成钉扎光电二极管的第一掺杂区域; 主要使用栅极作为第一掩模,将与第一导电类型掺杂剂不同的第二导电型掺杂剂离子注入基板的整个表面; 在门的两个侧壁上形成间隔物; 并且其次使用包括间隔物的多个栅极作为第二掩模将第二导电型掺杂剂离子注入到基板的整个表面中,以完成被钉扎的光电二极管的第二掺杂区域。 图像传感器可以包括基板; 形成在非光接收区域上的传输门; 在所述光接收区域中的第一掺杂剂区域; 以及形成在光接收区域的表面上的第二掺杂剂区域。
    • 5. 发明授权
    • Image sensors with lightly doped drain (LDD) to reduce dark current
    • 具有轻掺杂漏极(LDD)的图像传感器,以减少暗电流
    • US08624310B2
    • 2014-01-07
    • US13064176
    • 2011-03-09
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • H01L29/06
    • H01L27/14643H01L27/14603H01L27/14609H01L27/14641H01L27/14689
    • A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.
    • 制造图像传感器的方法可以包括提供包括光接收和非光接收区域的基板; 在非光接收区域上形成多个栅极; 将第一导电型掺杂剂离子注入到光接收区域中以形成钉扎光电二极管的第一掺杂区域; 主要使用栅极作为第一掩模,将与第一导电类型掺杂剂不同的第二导电型掺杂剂离子注入基板的整个表面; 在门的两个侧壁上形成间隔物; 并且其次使用包括间隔物的多个栅极作为第二掩模将第二导电型掺杂剂离子注入到基板的整个表面中,以完成被钉扎的光电二极管的第二掺杂区域。 图像传感器可以包括基板; 形成在非光接收区域上的传输门; 在所述光接收区域中的第一掺杂剂区域; 以及形成在光接收区域的表面上的第二掺杂剂区域。
    • 7. 发明申请
    • Methods of fabricating image sensors and image sensors fabricated thereby
    • 制造图像传感器和图像传感器的方法
    • US20070267666A1
    • 2007-11-22
    • US11798704
    • 2007-05-16
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • H01L31/113H01L21/00
    • H01L27/14643H01L27/14603H01L27/14609H01L27/14641H01L27/14689
    • A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.
    • 制造图像传感器的方法可以包括提供包括光接收和非光接收区域的基板; 在非光接收区域上形成多个栅极; 将第一导电型掺杂剂离子注入到光接收区域中以形成钉扎光电二极管的第一掺杂区域; 主要使用栅极作为第一掩模,将与第一导电类型掺杂剂不同的第二导电型掺杂剂离子注入基板的整个表面; 在门的两个侧壁上形成间隔物; 并且其次使用包括间隔物的多个栅极作为第二掩模将第二导电型掺杂剂离子注入到基板的整个表面中,以完成被钉扎的光电二极管的第二掺杂区域。 图像传感器可以包括基板; 形成在非光接收区域上的传输门; 在所述光接收区域中的第一掺杂剂区域; 以及形成在光接收区域的表面上的第二掺杂剂区域。
    • 9. 发明申请
    • Methods of manufacturing image sensors having shielding members
    • 制造具有屏蔽部件的图像传感器的方法
    • US20100062559A1
    • 2010-03-11
    • US12585349
    • 2009-09-11
    • Jin-Hyeong ParkTaek-Soo KimChan ParkJong-Cheol ShinYoung-Hyun Lee
    • Jin-Hyeong ParkTaek-Soo KimChan ParkJong-Cheol ShinYoung-Hyun Lee
    • H01L31/18
    • H01L27/14623H01L27/14621H01L27/14627H01L27/1464H01L27/14643H01L27/14689H01L27/14698
    • An epitaxial layer may be formed on a substrate having a first region and a second region. A photo diode may be formed on a first portion of the epitaxial layer in the first region of the substrate. At least one transfer transistor may be formed on the epitaxial layer adjacent to the photo diode. A plurality of transistors may be formed on a second portion of the epitaxial layer in the second region. An insulation layer may be formed to cover the photo diode, the at least one transfer transistor and the plurality of transistors. A plurality of connections may be formed through the insulation layer to be electrically connected with the at least one transfer transistor and the plurality of transistors in the second region. A shielding member may be formed to expose the photo diode. The epitaxial layer and/or the substrate may be treated with a hydrogen plasma before forming the shielding member to remove dangling bonds of silicon-oxygen and/or silicon-silicon.
    • 可以在具有第一区域和第二区域的基板上形成外延层。 可以在衬底的第一区域中的外延层的第一部分上形成光电二极管。 可以在与光电二极管相邻的外延层上形成至少一个传输晶体管。 多个晶体管可以形成在第二区域中的外延层的第二部分上。 可以形成绝缘层以覆盖光电二极管,至少一个传输晶体管和多个晶体管。 可以通过绝缘层形成多个连接,以与第二区域中的至少一个传输晶体管和多个晶体管电连接。 可以形成屏蔽构件以暴露光电二极管。 在形成屏蔽构件之前,可以用氢等离子体处理外延层和/或衬底以除去硅 - 氧和/或硅 - 硅的悬挂键。